Panasonic KV-S1037 / KV-S1038 / KV-S1026C-M2 / KV-S1026C-J2 Service Manual ▷ View online
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1 Safety Precautions
1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,
injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
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2 Warning
2.1.
Caution
The power socket wall outlet should be located near this equipment and be easily accessible.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C).
Exercise care while using higher temperature soldering irons.
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
Exercise care while using higher temperature soldering irons.
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
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2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
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3 Specifications
Scanning
*1 The scanning speed differs depending on the host computer, the operating system, the application, the measuring method, the
quantity of data in the image, and the paper type. The scanning speed depends on a measuring method of Panasonic.
*2 When scanning a document larger than A5 size at high resolutions over 600 dpi, the scanning may fail due to insufficient memory.
*3 For details, see "Compatible Paper". Refer to 16. Appendix (Operating Manual P.22).
*4 Using "Long Paper", you can scan long documents by splitting them into smaller parts. For details about "Long Paper", refer to the
*3 For details, see "Compatible Paper". Refer to 16. Appendix (Operating Manual P.22).
*4 Using "Long Paper", you can scan long documents by splitting them into smaller parts. For details about "Long Paper", refer to the
Image Capture Plus, TWAIN, or ISIS help.
*5 For details, see "Compatible Card". Refer to 16. Appendix (Operating Manual P.23).
*6 Use the carrier sheet (KV-SS077) to scan passport. Refer to 16. Appendix (Operating Manual P.24).
*7 Depending on the paper type or operating environment (temperature, humidity, etc.), the unit may not feed the documents properly.
*6 Use the carrier sheet (KV-SS077) to scan passport. Refer to 16. Appendix (Operating Manual P.24).
*7 Depending on the paper type or operating environment (temperature, humidity, etc.), the unit may not feed the documents properly.
When paper weight is more than 209 g/m
2
(55lb.): 5 sheets (A4, High- quality woodfree paper)
When installed the mixed batch card guide: 20 sheets
*8 For details, see "Replacing the Rollers". Refer to 16. Appendix (Operating Manual P.45).
Item
KV-S1037/S1038/S1026C-M2/S1026C-J2
Scanning face
Duplex
Scanning method
Color CIS (600 dpi)
Background: Black
Background: Black
Scanning speed
*1
• A4 / Portrait
• Binary / color
• (200 dpi, 300 dpi)
• Binary / color
• (200 dpi, 300 dpi)
Simplex
30 pages/min.
Duplex
60 images/min.
Scanning resolution
*2
100 – 600 dpi (1 dpi step), 1,200 dpi (Interpolated)
Optical: 300 dpi / 600 dpi (Automatic switch)
Optical: 300 dpi / 600 dpi (Automatic switch)
Paper size
*3
Width
48 mm - 216 mm (1.9 in. - 8.5 in.)
Length
When feeding one sheet:
54 mm - unlimited (2.1 in. - unlimited)
54 mm - unlimited (2.1 in. - unlimited)
*4
When feeding multiple sheets:
54 mm - 356 mm (2.1 in. - 14 in.)
54 mm - 356 mm (2.1 in. - 14 in.)
Thickness
Paper: 0.04 mm – 0.5 mm (1.6 mils – 19.7 mils)
Bound documents: 3 mm (118.1 mils) (including carrier sheet)
Note: 1 mil = 0.001 in.
Bound documents: 3 mm (118.1 mils) (including carrier sheet)
Note: 1 mil = 0.001 in.
Weight
20 g/m² – 413 g/m² (5 lb. – 110 lb.)
Card
*5
Format
ISO format
Size
85.6 mm × 54 mm (3.4 in. × 2.1 in.)
Thickness
0.76 mm (0.03 in.)
Embossed card up to 1.24 mm (0.049 in.)
Embossed card up to 1.24 mm (0.049 in.)
Feed capacity
3 cards on the feed tray or on the mixed batch card guide
Passport
*6
Width
130 mm (5.1 in) or less
Length
188 mm (7.4 in) or less
Thickness
3.0 mm (0.1 in) or less (including carrier sheet)
Feed capacity
50 sheets (80 g/m² [21 lb.] High-quality woodfree paper)
*7
Roller replacement
*8
100,000 sheets