DOWNLOAD Panasonic TH-75EQ1W (serv.man2) Service Manual ↓ Size: 10.62 MB | Pages: 76 in PDF or view online for FREE

Model
TH-75EQ1W (serv.man2)
Pages
76
Size
10.62 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / VED1812727CE
File
th-75eq1w-sm2.pdf
Date

Panasonic TH-75EQ1W (serv.man2) Service Manual ▷ View online

5
PREFACE
<75EQ1>
5
TH-50LFC70U/TH-50LFC70W
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
2. Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive
(ES) Devices
6
PREFACE
<75EQ1>
6
TH-50LFC70U/TH-50LFC70W
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol 
PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
2.2. About lead free solder (PbF)
7
PREFACE
<75EQ1>
125
English
Specifications
Model No.
86-inch model
: TH-86EQ1W
75-inch model
: TH-75EQ1W
65-inch model
: TH-65EQ1U
55-inch model
: TH-55EQ1U
50-inch model
: TH-50EQ1U
43-inch model
: TH-43EQ1U
65-inch model
: TH-65EQ1W
55-inch model
: TH-55EQ1W
50-inch model
: TH-50EQ1W
43-inch model
: TH-43EQ1W
Power Consumption
86-inch model
363 W
75-inch model
296 W
65-inch model
185 W
55-inch model
195 W
50-inch model
178 W
43-inch model
162 W
Power off condition
0.3 W
Stand-by condition
0.5 W
LCD Display panel
86-inch model
86-inch IPS panel (Edge LED backlight), 16:9 aspect 
ratio
75-inch model
75-inch IPS panel (Edge LED backlight), 16:9 aspect 
ratio
65-inch model
65-inch VA panel (Direct LED backlight), 16:9 aspect 
ratio
55-inch model
55-inch VA panel (Direct LED backlight), 16:9 aspect 
ratio
50-inch model
50-inch VA panel (Direct LED backlight), 16:9 aspect 
ratio
43-inch model
43-inch VA panel (Direct LED backlight), 16:9 aspect 
ratio
Screen size
86-inch model
1 895 mm (W) × 1 065 mm (H) × 2 174 mm (diagonal) / 
74.60” (W) × 41.96” (H) × 85.60” (diagonal)
75-inch model
1 649 mm (W) × 927 mm (H) × 1 892 mm (diagonal) / 
64.94” (W) × 36.53” (H) × 74.51” (diagonal)
65-inch model
1 428 mm (W) × 803 mm (H) × 1 639 mm (diagonal) / 
56.23” (W) × 31.63” (H) × 64.52” (diagonal)
55-inch model
1 209 mm (W) × 680 mm (H) × 1 387 mm (diagonal) / 
47.62” (W) × 26.78” (H) × 54.63” (diagonal)
50-inch model
1 095 mm (W) × 616 mm (H) × 1 257 mm (diagonal) / 
43.14” (W) × 24.26” (H) × 49.50” (diagonal)
43-inch model
941 mm (W) × 529 mm (H) × 1 079 mm (diagonal) / 
37.05” (W) × 20.84” (H) × 42.51” (diagonal)
No. of pixels
8 294 400
(3 840 (Horizontal) × 2 160 (Vertical))
Dimensions (W × H × D)
86-inch model
1 928 mm × 1 099 mm × 86 mm (excluding handles: 
76 mm) / 75.91” × 43.27” × 3.39” (excluding handles: 
2.99”)
75-inch model
1 681 mm × 959 mm × 73 mm (excluding handles: 
66 mm) / 66.19” × 37.76” × 2.88” (excluding handles: 
2.58”)
65-inch model
1 459 mm × 835 mm × 82 mm / 57.5” × 32.9” × 3.30”
55-inch model
1 240 mm × 712 mm × 62 mm / 48.9” × 28.0” × 2.50”
50-inch model
1 124 mm × 647 mm × 70 mm / 44.26” × 25.48” × 
2.76”
43-inch model
969 mm × 560 mm × 61 mm / 38.15” × 22.05” × 2.40”
3. Specifications
8
PREFACE
<75EQ1>
126
English
Mass
86-inch model
Approx. 66.0   / 145.5 lbs net
75-inch model
Approx. 56.0   / 123.5 lbs net
65-inch model
Approx. 27.0   / 59.6 lbs net
55-inch model
Approx. 17.0   / 37.5 lbs net
50-inch model
Approx. 14.0   / 30.0 lbs net
43-inch model
Approx. 9.0   / 19.9 lbs net
Power source
TH-86EQ1W, TH-75EQ1W:
110 ‒ 240 V ~ (110 ‒ 240 V alternating current),  
50/60 Hz
TH-65EQ1U, TH-55EQ1U, TH-50EQ1U, TH-43EQ1U:
110 ‒ 127 V ~ (110 ‒ 127 V alternating current),  
50/60 Hz
TH-65EQ1W, TH-55EQ1W, TH-50EQ1W, TH-43EQ1W:
220 ‒ 240 V ~ (220 ‒ 240 V alternating current),  
50/60 Hz
Operating condition
Temperature
0 °C ‒ 40 °C (32 °F ‒ 104 °F)*
1
Humidity
20 % ‒ 80 % (no condensation)
Storing condition
Temperature
-20 °C ‒ 60 °C (-4 °F ‒ 140 °F)
Humidity
20 % ‒ 80 % (no condensation)
Connection terminals
HDMI 1
HDMI 2
TYPE A Connector*
2
 × 2
Audio signal:
Linear PCM (sampling frequencies: 48 kHz, 
44.1 kHz, 32 kHz)
DVI-D IN
DVI-D 24 Pin × 1:
Compliance with DVI Revision 1.0
Compatible with HDCP 1.1
AV IN
Audio/Video 4-pole mini jack (M3) × 1  
(see page 23)
Video:   1.0 Vp-p (75 Ω)
Audio:  Stereo mini jack (M3) × 1, 0.5 Vrms
         Shared by AV IN, DVI-D IN and PC IN
PC IN
Mini D-sub 15 Pin (Compatible with DDC2B) × 1
Y/G:
1.0 Vp-p (75 Ω) (with sync signal)
0.7 Vp-p (75 Ω) (without sync signal)
P
B
/C
B
/B:
0.7 Vp-p (75 Ω) (without sync signal)
P
R
/C
R
/R:
0.7 Vp-p (75 Ω) (without sync signal)
HD/VD:
TTL (high impedance)
AUDIO OUT
Stereo mini jack (M3) × 1, 0.5 Vrms
Output: Variable (-∞ ‒ 0 dB)  
(1 kHz 0 dB input, 10 kΩ load)
SERIAL IN
External Control Terminal
D-sub 9 Pin × 1:
RS-232C compatible
LAN
RJ45 × 1:
For network connection, compatible with PJLink
Communication method:
RJ45, 10BASE-T / 100BASE-TX / 1000BASE-T
IR IN
Stereo mini jack (M3) × 1
IR OUT
Stereo mini jack (M3) × 1
USB
USB connector × 1, TYPE A
DC 5V / 2A
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