Panasonic TH-86SQ1W (serv.man2) Service Manual ▷ View online
5
PREFACE
<86SQ1>
5
TH-50LFC70U/TH-50LFC70W
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
to damage an ES device).
2. Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive
(ES) Devices
(ES) Devices
6
PREFACE
<86SQ1>
6
TH-50LFC70U/TH-50LFC70W
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
2.2. About lead free solder (PbF)
7
PREFACE
<86SQ1>
3. Specifications
25
English
Specifications
Model No.
98-inch model
: TH-98SQ1W
86-inch model
: TH-86SQ1W
Power Consumption
98-inch model
685 W
86-inch model
480 W
Power off condition
0.3 W
Stand-by condition
0.5 W
LCD Display panel
98-inch model
98-inch IPS panel (Direct LED backlight),
16:9 aspect ratio
86-inch model
86-inch IPS panel (Edge LED backlight),
16:9 aspect ratio
Screen size
98-inch model
2 158.8 mm (W) × 1 214.3 mm (H) × 2 476.9 mm
(diagonal) / 84.99” (W) × 47.80” (H) × 97.51”
(diagonal)
86-inch model
1 895.0 mm (W) × 1 065.9 mm (H) × 2 174.2 mm
(diagonal) / 74.60” (W) × 41.96” (H) × 85.60”
(diagonal)
No. of pixels
8 294 400
(3 840 (Horizontal) × 2 160 (Vertical))
(3 840 (Horizontal) × 2 160 (Vertical))
Dimensions (W × H × D)
98-inch model
2 194 mm × 1 249 mm × 90 mm
(excluding handles: 81 mm) /
86.35” × 49.15” × 3.54”
(excluding handles: 3.17”)
86-inch model
1 928 mm × 1 099 mm × 86 mm
(excluding handles: 76 mm) /
75.91” × 43.27” × 3.39”
(excluding handles: 2.99”)
Mass
98-inch model
Approx. 90.0 / 198.5 lbs net
86-inch model
Approx. 66.0 / 145.5 lbs net
Power source
110 ‒ 240 V ~ (110 ‒ 240 V alternating current),
50/60 Hz
Operating condition
Temperature
0 °C ‒ 40 °C (32 °F ‒ 104 °F)*
1
Humidity
20 % ‒ 80 % (no condensation)
Storing condition
Temperature
-20 °C ‒ 60 °C (-4 °F ‒ 140 °F)
Humidity
20 % ‒ 80 % (no condensation)
Supply power for SLOT
12 V/5.5 A, 3.3 V/1.1 A
Connection terminals
HDMI 1
HDMI 2
HDMI 2
TYPE A Connector*
2
× 2 (Supports 4K)
Audio signal:
Linear PCM (sampling frequencies: 48 kHz,
44.1 kHz, 32 kHz)
DisplayPort IN
DisplayPort Terminal × 1
Audio signal:
Audio signal:
Linear PCM (sampling frequencies: 48 kHz,
44.1 kHz, 32 kHz)
DisplayPort OUT
DisplayPort Terminal × 1
DVI-D IN
DVI-D 24 Pin × 1:
Compliance with DVI Revision 1.0
Compatible with HDCP 1.1
Compatible with HDCP 1.1
8
PREFACE
<86SQ1>
English
26
PC IN
Mini D-sub 15 Pin (Compatible with DDC2B) × 1
Y/G:
Y/G:
1.0 Vp-p (75 ) (with sync signal)
0.7 Vp-p (75 ) (without sync signal)
0.7 Vp-p (75 ) (without sync signal)
P
B
/C
B
/B:
0.7 Vp-p (75 ) (without sync signal)
P
R
/C
R
/R:
0.7 Vp-p (75 ) (without sync signal)
HD/VD:
TTL (high impedance)
AUDIO IN 1
Stereo mini jack (M3) × 1, 0.5 Vrms
AUDIO IN 2
Stereo mini jack (M3) × 1, 0.5 Vrms
AUDIO OUT
Stereo mini jack (M3) × 1, 0.5 Vrms
Output: Variable (-∞ ‒ 0 dB)
Output: Variable (-∞ ‒ 0 dB)
(1 kHz 0 dB input, 10 k load)
SERIAL IN
External Control Terminal
D-sub 9 Pin × 1:
D-sub 9 Pin × 1:
RS-232C compatible
LAN
RJ45 × 1:
For network connection, compatible with PJLink
Communication method:
RJ45, 10BASE-T / 100BASE-TX
DIGITAL LINK / LAN
RJ45 × 1:
For network connection, DIGITAL LINK
connection, compatible with PJLink
Communication method:
RJ45, 100BASE-TX, long reach mode is
supported
IR IN
Stereo mini jack (M3) × 1
IR OUT
Stereo mini jack (M3) × 1
USB
USB connector × 2, TYPE A
DC 5V/1A (front side terminal),
DC 5V/1A (front side terminal),
DC 5V/2A (far side terminal)
EXT SP
8 , 30 W [15 W + 15 W] (10 % THD)
Sound
Speakers
15 mm × 25 mm × 1 / φ 70 mm × 1 × 2 pieces
Audio Output
20 W [10 W + 10 W] (10 % THD)
Remote Control Transmitter
Power source
DC 3 V (battery (AAA/R03/LR03 type) × 2)
Operating range
Approx. 7 m (22.9 ft)
(when operated directly in front of remote control
(when operated directly in front of remote control
sensor)
Mass
Approx. 63 / 2.22 oz (including batteries)
Dimensions (W × H × D)
48 mm × 134 mm × 20 mm / 1.89” × 5.28” × 0.76”
*
1: Environmental temperature to use this unit at high
altitudes (1 400 m (4 593 ft) and higher and below
2 800 m (9 186 ft) above sea level): 0 °C to 35 °C
(32 °F to 95 °F)
*
2: VIERA LINK is not supported.
Note
●
Design and specifications are subject to change
without notice. Mass and dimensions shown are
approximate.
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