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Model
UF-885 UF-895
Pages
127
Size
22.48 MB
Type
PDF
Document
Service Manual / Other
Brand
Device
Fax / LASER
File
uf-885-uf-895.pdf
Date

Panasonic UF-885 / UF-895 Service Manual / Other ▷ View online

33
2.8
Line Control Circuit
LCU/LCE PCB consists of line connection circuit between Telephone / FAX circuit, PSTN and detection circuit of line condition.
2.8.1
LCU/LCE PCB
1. Line Control
The PSTN line is connected from telephone side to FAX side by CML relay. The relay connects to the Fax side by CML signal
becomes 5V.
2. Automatic Reception
Due to PC2: LCE PCB / PC1: LCE PCB, ringing signal is changed to digital signal (0V and 5V) and it is transfered to System
CPU on FCB PCB. System CPU on FCB PCB confirms Frequency, On/Off timing and changes the PSTN connection from
telephone side to FAX side.
3. Off Hook Detection
Due to loop current during off hook, PC1:LCU / IC1, RL1 or PC2:LCE becomes to 0-Volt and System CPU detects off hook
through the Multiplexer.
4. Dialing
• Dial Pulse Dialing
The circlet consists of the CML relay, PLS relay and their peripheral circlet. This circlet generates dial pulses. The CPU in the
FCB PCB controls all dial pulse generation sequences. It turns relay CML and PLS on and off through API on the FCB PCB.
When the absence of the terminating message is confirmed by the of-hook detector, the CPU turns CML relay ON to develop
loop status (DC loop). After a few seconds, the CPU turns the PLS relay on and off to generator dial pulses making and
breaking the loop.
• DTMF Tone
Modem generates DTMF. The output route is same as FAX transmission signal.
MODEM
ApI
PC2
PC1
CML
PLS
TCK
Ringing
Detector
Line
Telephone
CML
PC1
nCTON
RMCK
RMCS
RMDT
CLK
P/S
Q8
PC2
JP18~23
Country
Code
Jumper
IC2
CML
PLS
TCK
+24V
+24V
+24V
Q1
Q3
Q4
Off-hook
Detector
HYBSR
<MDM>
< LCE >
L : Ring in
H : FAX Side
L : Telephone 
H : Make
L : Break
CN8
CN25
11
11
10
10
7
7
8
8
9
9
5
5
6
6
CMLD
PLSD
14
14
Ringer
Off Hook
Dial Pulse
Loop Relay
TCKD
[DZYNA1436*]
MODEM
PC2
CML
PLS
Ringing
Detector
Line
Telephone
CML
C5
Q2
Off-hook
Detector
HYBSR
< MDM >
< LCU >
PC1
GND
T2
Q1
PC1
nCTON
PLS
CML
+24V
CMLD 5
PLSD 6
PC2
nHKOFF 9
+5V
+5V
L : Hook off
H : On hook 
L : Ring IN 10
H : FAX Side
L : Telephone
CN7
H : Make
L : Break
for Auto Receive
API
[DZYNA1435*]
MODEM
PC1
PC2
CML
PLS
Ringing
Detector
Line
Telephone
CML
C5
Q2
HYBSR
< MDM >
< LCE >
GND
T2
Q1
PC2
nCTON
PLS
CML
+24V
CMLD 5
PLSD 6
PC1
nHKOFF 9
+5V
+5V
L : Hook off
H : On hook 
L : Ring IN 10
H : FAX Side
L : Telephone
CN7
H : Make
L : Break
API
[DZEP000441]
34
2.9
Panel
Panel block consists of LCD module (not repairable) and Panel CPU, Key matrix and LED on PNL PCB. These are controlled by
one chip CPU (4 bit) on LCD PCB. This CPU is controlled by System CPU on FCB PCB.
1. Panel I/F with System CPU
PTXD, PRXD, PNL CLOCK : Half-duplex transmission is carried out by clock synchronized serial I/F of 3 line type.
2. LED Drive
LED is driven by dynamic drive.
3. Key Scan
Switch condition is detected through matrix line of 8 bit data X 10 line for each 10 ms cycle. This information is transferred to
System CPU when panel CPU receives a request.
4. Calender
The Calendar information is counted up by panel CPU. This information is transferred to System CPU when panel CPU
receives a request. During power off Panel CPU is back up by battery on Panel Block.
• PNLRST
:
System CPU puts out reset signal if there is no response from Panel CPU.
• WAKUP
:
Sleep Mode cancel signal from FCB PCB
• PSAVE
:
Sleep Mode approval signal to FCB PCB
• BZCLK
:
When panel SW is pressed, panel SW sound clock is put out.
• BATLVOL
:
Due to this signal line, System CPU on FCB PCB detects Battery condition.
9
3
2
4
5
1
11
12
10
6
7
8
13
+5V
+5V
KEYIN (7:0)
Key Matrix
LED Matrix
LED (7:0)
SCAN (9:0)
LEDCT (1:0)
To FCB
BATVOL
BATVOL
BAT
TXS
RXS
CKS
BUZ
RES
nPNLTXD
nPNLRXD
nPNLCK
nBZCK
nPNLRST
nPSAVE
nWAKUP
+5V
+5VP
GND
GND
+24V
(NC)
GND
GND
GND
GND
+5V panel
+5VP
+5VP
+5VP
Battery
+3V
8.00 MHz
32.768 KHz
(For RTC)
Battery
for RTC
CPU
TMP87CH00LF
VDD
*RESET
XIN
XOUT
XTIN
XTOUT
COG
Chip
on
Glass
VDD
V0
VSS
DB (7:0)
E
RS
R/W
35
2.10
Sleep Mode
This function is to reduce the power consumption in standby mode. During Sleep Mode, power is not supplied to System Control 
circuit on FCB PCB. It is supplied to Panel PCB and some circuit on FCB PCB.
1. Shifted conditions to Sleep Mode
• Sleep Mode timer is time over (default: 60 minutes).
• During the timer period, there are no TX/RX and no operation from Panel.
• Document sensor ON
• Option PCB (G3, PDL, Printer I/F) is not installed.
2. Recovered conditions from Sleep Mode
• Key input on Panel
• Deferred Communication is time over
• Document sensor ON
• Ringing signal input
• Hook-off (external telephone or Handset: except LCE PCB)
+5VP
+5VP
+5VP
Q204-2
Q206-2
Q203-2
Q202-2
Q202-3
+5VP
+5VP
5V
5V
3V
+5VP
nAPNT
API
nCTONP
nHKOFP
nHSDTP
OPEN
not used
nLPOW
nPSDES
nPSG
Command
3  : L
nPSAVE
nWAKUP
LED
Self-Keep 
Circuit
Option
POW
SNS
NCU
Document
Sensor 
+5VP
Q205 C721
CI Detect
EX-TEL Hook Up 
Detect
Handset Hook Up 
Detect
Sub-CPU, API
+5VP
API
+5VP
API
CPU
+24V
-12V
+5V
+24V / +12V
-12V
+5V / +3.3V
+5VP
WAKUP Circuit
Display Sleep 
Mode
Option
G3 & PDL
Main
CPU
PNL CPU
PA7
P14
P53
P50
Disenable 
Sleep Mode
1  : L
2  : Power
      OFF
4  : L
5  : OFF
5  : OFF
Q200
6  : OFF
36
3 Main LSI Feature and Pin Assignment
3.1
Main LSI Feature and Pin Assignment
3.1.1
CPU (Central Processing Unit, SH2)
Pin No.
Pin Name
Type
Description
1
PA23
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
2
PE14
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
3
PA22
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
4
PA21
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
5
PE15
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
7
A0
O
Outputs addresses.
8
A1
O
Outputs addresses.
9
A2
O
Outputs addresses.
10
A3
O
Outputs addresses.
11
A4
O
Outputs addresses.
13
A5
O
Outputs addresses.
15
A6
O
Outputs addresses.
16
A7
O
Outputs addresses.
17
A8
O
Outputs addresses.
18
A9
O
Outputs addresses.
19
A10
O
Outputs addresses.
20
A11
O
Outputs addresses.
21
A12
O
Outputs addresses.
22
A13
O
Outputs addresses.
23
A14
O
Outputs addresses.
24
A15
O
Outputs addresses.
25
A16
O
Outputs addresses.
27
A17
O
Outputs addresses.
29
PA20
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
30
DRAK1
O
Output the input sampling acknowledgment of external DMA transfer requests.
31
RAS
O
Timing signal for DRAM row address strobe.
32
CASL
O
Timing signal for DRAM column address strobe. Output when the lower 8 bits of 
data are accessed.
33
DRAK0
O
Output the input sampling acknowledgment of external DMA transfer requests.
34
CASH
O
Timing signal for DRAM column address strobe. Output when the upper 8 bits of 
data are accessed.
36
RDWR
O
DRAM write strobe signal.
37
A18
O
Outputs addresses.
38
A19
O
Outputs addresses.
39
A20
O
Outputs addresses.
41
A21
O
Outputs addresses.
43
RD
O
Indicates reading from an external device.
45
PD31
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
46
IRQOUT
O
Indicates that interrupt cause has occurred. Enables notification of interrupt 
generation also during bus release.
47
WRH
O
Indicates writing the upper 8 bits (15-8) of external data.
48
WRL
O
Indicates writing the lower 8 bits (7-0) of external data.
49
CS1
O
Chip select signals for external memory or devices.
50
CS0
O
Chip select signals for external memory or devices.
51
PA9
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
52
PA8
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
53
PA7
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
54
PA6
I/O
General purpose input/output port pins. Each bit can be designated for input/out-
put.
56
CS3
O
Chip select signals for external memory or devices.
57
CS2
O
Chip select signals for external memory or devices.
58
DACK1
O
Output a strobe to the external I/O of external DMA transfer requests.
59
DACK0
O
Output a strobe to the external I/O of external DMA transfer requests.
60
DREQ1
I
Input pin for external requests for DMA transfer.
62
DREQ0
I
Input pin for external requests for DMA transfer.
64
IRQ7
I
Maskable interrupt request pins. Allows selection of level input and edge input.
65
IRQ6
I
Maskable interrupt request pins. Allows selection of level input and edge input.
66
IRQ5
I
Maskable interrupt request pins. Allows selection of level input and edge input.
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