Sony HBD-NF7220 Service Manual ▷ View online
109
HBD-NF7220
7-6. SHIELD (POWER) SECTION
251
3-077-331-41 +BV3
(3-CR)
252
3-077-331-71 +BV3
(3-CR)
253
1-458-765-11 CARD WLAN/BT COMBO
254
4-214-276-01 TAPE
255
1-828-273-61 WIRE (FLAT TYPE) (28 CORE)
256
A-1978-574-A FL+CHUKEI BOARD, COMPLETE
257
A-1978-940-A LED CHUKEI BOARD, COMPLETE
258
1-970-007-11 HARNESS
(USB)
259
A-1980-529-A AUDIO IO BOARD, COMPLETE
260
4-251-067-11 PACKING (AL FRONT)
261
4-478-144-01 INSULATOR
(TOP)
ND2300 1-483-460-11 VACUUM FLUORESCENT DISPLAY
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
Note 1: Wire (fl at type) for service is all straight.
Please bend it referring go “HOW TO BEND FFC” on
page 32 when you install it in the unit.
page 32 when you install it in the unit.
Note 2: When the WLAN/BT combo card is replaced, refer to “NOTE
OF REPLACING THE WLAN/BT COMBO CARD AND THE
COMPLETE MB1305 BOARD” on page 6 and “CHECKING
METHOD OF NETWORK OPERATION” on page 11.
COMPLETE MB1305 BOARD” on page 6 and “CHECKING
METHOD OF NETWORK OPERATION” on page 11.
E
A
A
C
C
B
E
B
D
D
not supplied
not supplied
not supplied
not supplied
(FUSB+SIRCS board)
(FUSB+SIRCS board)
MB1305 board section
ND2300
255
253
252
254
261
254
260
252
251
251
259
252
252
258
257
256
252
252
252
110
HBD-NF7220
Note 1: Wire (fl at type) for service is all straight.
Please bend it referring go “HOW TO BEND
FFC” on page 32 when you install it in the
unit.
FFC” on page 32 when you install it in the
unit.
Note 2: When the complete MB1305 board is replaced, refer to “NOTE OF
REPLACING THE WLAN/BT COMBO CARD AND THE COMPLETE
MB1305 BOARD” on page 6, “NOTE OF REPLACING THE OPTICAL
DEVICE KEM480AHA/C2RP1 (OP1) AND THE COMPLETE MB1305
BOARD” on page 7 and “CHECKING METHOD OF NETWORK
OPERATION” on page 11.
MB1305 BOARD” on page 6, “NOTE OF REPLACING THE OPTICAL
DEVICE KEM480AHA/C2RP1 (OP1) AND THE COMPLETE MB1305
BOARD” on page 7 and “CHECKING METHOD OF NETWORK
OPERATION” on page 11.
7-7. MB1305 BOARD SECTION
301
1-848-229-61 WIRE (FLAT TYPE) (15 CORE)
302
1-848-227-61 WIRE (FLAT TYPE) (5 CORE)
303
3-279-801-31 SHEET,
RADIATION
304
3-077-331-41 +BV3
(3-CR)
9 305
A-1983-163-A MB1305 BOARD, COMPLETE
0 306
1-855-032-11 FAN, D.C.
0 307
4-966-267-12 BUSHING (FBS001), CORD
0 308
1-834-966-41 POWER-SUPPLY CORD
#2
7-682-544-04 SCREW +B 3X3
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
301
304
303
302
304
304
305
306
308
not supplied
not supplied
SWITCHING REGULATOR
section
section
#2
307
111
HBD-NF7220
7-8. SWITCHING REGULATOR SECTION
351
3-077-331-41 +BV3
(3-CR)
352
3-077-331-71 +BV3
(3-CR)
353
A-1980-629-A AMP BOARD, COMPLETE
0 354
1-474-546-11 SWITCHING REGULATOR (3L402W-1)
355
4-478-145-01 INSULATOR
(BOTTOM)
356
1-848-232-61 FLEXIBLE FLAT CABLE (24 CORE)
357
3-381-847-01 CUSHION,
SARANET
358
4-214-276-01 TAPE
359
4-461-058-01 PLATE
(CON-H)
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
Note 1: Flexible fl at cable for service is all straight.
Please bend it referring go “HOW TO BEND FFC” on
page 32 when you install it in the unit.
page 32 when you install it in the unit.
Note 2: When the complete AMP board is replaced, spread the
compound referring to “NOTE OF REPLACING THE IC3101
AND IC3102 ON THE AMP BOARD AND THE COMPLETE
AMP BOARD” on page 5.
AND IC3102 ON THE AMP BOARD AND THE COMPLETE
AMP BOARD” on page 5.
352
352
353
352
352
359
354
356
355
351
351
F
F
not supplied
not supplied
not supplied
not supplied
352
not
supplied
supplied
357
357
358
112
HBD-NF7220
SECTION 8
ELECTRICAL PARTS LIST
A-1980-629-A AMP BOARD, COMPLETE
********************
< CAPACITOR >
C3050 1-165-669-21 ELECT
CHIP 220uF 20% 6.3V
C3051 1-164-232-91 CERAMIC
CHIP 0.01uF 10% 100V
C3099 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3106 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3107 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3108 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3109 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3118 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3119 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3127 1-116-731-11 CERAMIC
CHIP 2.2uF
20% 6.3V
C3131 1-116-717-11 CERAMIC
CHIP 10uF
20% 10V
C3133 1-116-717-11 CERAMIC
CHIP 10uF
20% 10V
C3134 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3135 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3156 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3157 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3228 1-116-731-11 CERAMIC
CHIP 2.2uF
20% 6.3V
C3251 1-118-453-31 ELECT
270uF 20% 63V
C3253 1-118-453-31 ELECT
270uF 20% 63V
C3271 1-100-154-91 CERAMIC
CHIP 330PF 5% 100V
C3272 1-100-154-91 CERAMIC
CHIP 330PF 5% 100V
C3281 1-100-154-91 CERAMIC
CHIP 330PF 5% 100V
C3282 1-100-154-91 CERAMIC
CHIP 330PF 5% 100V
C3306 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3307 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3308 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3309 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3318 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3319 1-118-691-11 CERAMIC
CHIP 2.2uF
10% 100V
C3331 1-116-717-11 CERAMIC
CHIP 10uF
20% 10V
C3333 1-116-717-11 CERAMIC
CHIP 10uF
20% 10V
C3334 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3335 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3336 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C3356 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3357 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3381 1-100-154-91 CERAMIC
CHIP 330PF 5% 100V
C3382 1-100-154-91 CERAMIC
CHIP 330PF 5% 100V
C3451 1-112-723-21 CERAMIC
CHIP 0.0047uF 10% 250V
C3452 1-112-723-21 CERAMIC
CHIP 0.0047uF 10% 250V
C3453 1-100-158-91 CERAMIC
CHIP 1000PF 5% 100V
C3454 1-100-158-91 CERAMIC
CHIP 1000PF 5% 100V
C3455 1-112-723-21 CERAMIC
CHIP 0.0047uF 10% 250V
C3456 1-112-723-21 CERAMIC
CHIP 0.0047uF 10% 250V
C3457 1-100-158-91 CERAMIC
CHIP 1000PF 5% 100V
C3458 1-100-158-91 CERAMIC
CHIP 1000PF 5% 100V
C3460 1-112-723-21 CERAMIC
CHIP 0.0047uF 10% 250V
C3462 1-100-158-91 CERAMIC
CHIP 1000PF 5% 100V
C3464 1-112-723-21 CERAMIC
CHIP 0.0047uF 10% 250V
C3466 1-100-158-91 CERAMIC
CHIP 1000PF 5% 100V
C3552 1-126-208-21 ELECT
CHIP 47uF
20% 4V
C3554 1-118-459-11 CERAMIC
CHIP 0.01uF 10% 25V
C3555 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C3557 1-118-459-11 CERAMIC
CHIP 0.01uF 10% 25V
C3562
1-118-365-11
CERAMIC CHIP 0.047uF 10%
50V
C3564 1-118-365-11 CERAMIC
CHIP 0.047uF 10% 50V
* C3570 1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C3955 1-164-232-91 CERAMIC
CHIP 0.01uF 10% 100V
C3956 1-164-232-91 CERAMIC
CHIP 0.01uF 10% 100V
C3957 1-164-232-91 CERAMIC
CHIP 0.01uF 10% 100V
C3958 1-164-232-91 CERAMIC
CHIP 0.01uF 10% 100V
C3959 1-164-232-91 CERAMIC
CHIP 0.01uF 10% 100V
C3960 1-164-232-91 CERAMIC
CHIP 0.01uF 10% 100V
C3963 1-116-457-11 CERAMIC
CHIP 0.033uF 10% 350V
C3964 1-116-457-11 CERAMIC
CHIP 0.033uF 10% 350V
C3965 1-116-457-11 CERAMIC
CHIP 0.033uF 10% 350V
C3966 1-116-457-11 CERAMIC
CHIP 0.033uF 10% 350V
C3967 1-116-457-11 CERAMIC
CHIP 0.033uF 10% 350V
C3968 1-116-457-11 CERAMIC
CHIP 0.033uF 10% 350V
C3980 1-118-716-71 FILM
0.1uF
99% 450V
C3981 1-118-716-71 FILM
0.1uF
99% 450V
C3982 1-118-716-71 FILM
0.1uF
99% 450V
C3989 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C3990 1-118-698-11 CERAMIC
CHIP 0.1uF
10% 100V
C4009 1-116-717-11 CERAMIC
CHIP 10uF
20% 10V
C4010 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C4011 1-116-717-11 CERAMIC
CHIP 10uF
20% 10V
C4012 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
Note:
• Due to standardization, replacements in
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
All resistors are in ohms.
METAL:
Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F:
F:
nonfl ammable
• CAPACITORS
uF:
uF:
μF
• COILS
uH:
uH:
μH
• SEMICONDUCTORS
In each case, u: μ, for example:
uA.
In each case, u: μ, for example:
uA.
. :
μA. . , uPA. . , μPA. . ,
uPB.
.
:
μPB. . , uPC. . , μPC. . ,
uPD.
.
:
μPD. .
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
The components identifi ed by mark 9 con-
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
AMP
Note: When the complete AMP board is replaced, spread the compound
referring to “NOTE OF REPLACING THE IC3101 AND IC3102 ON THE
AMP BOARD AND THE COMPLETE AMP BOARD” on page 5.
AMP BOARD AND THE COMPLETE AMP BOARD” on page 5.
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