Sony HBD-NF7220 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
SPECIFICATIONS
BLU-RAY DISC
TM
/DVD RECEIVER
9-890-643-01
2014D80-1
©
2014.04
AEP Model
Ver. 1.0 2014.04
• HBD-NF7220 is the Blu-ray disc
TM
/DVD receiver in BDV-NF7220.
• In order to perform the operation checking, all the units contained in this unit are needed.
HBD-NF7220
Model Name Using Similar Mechanism
NEW
Optical Pick-up Name
KEM480AHA/C2RP1
Amplifi er Section
POWER OUTPUT (rated)
Front L/Front R:
POWER OUTPUT (rated)
Front L/Front R:
125 W + 125 W (at 6 ohms, 1 kHz,
1% THD)
1% THD)
POWER OUTPUT (reference)
Front L/Front R:
Front L/Front R:
200 W (per channel at 6 ohms, 1 kHz)
Subwoofer:
200 W (at 6 ohms, 80 Hz)
Inputs (Analog)
AUDIO IN
AUDIO IN
Sensitivity: 2 V/700 mV
Inputs (Digital)
TV (Audio Return Channel/OPTICAL)
TV (Audio Return Channel/OPTICAL)
Supported formats: LPCM 2CH
(up to 48 kHz), Dolby Digital, DTS
HDMI (IN 1)/HDMI (IN 2)
Supported formats: LPCM 5.1CH
(up to 48 kHz), LPCM 2CH
(up to 96 kHz), Dolby Digital, DTS
HDMI Section
Connector
Type
Connector
Type
A
(19pin)
BD/DVD/Super Audio CD/CD System
Signal format system
NTSC/PAL
Signal format system
NTSC/PAL
USB Section
(USB) port:
Type A (For connecting USB memory,
memory card reader, digital still camera,
and digital video camera)
memory card reader, digital still camera,
and digital video camera)
LAN Section
LAN (100) terminal
100BASE-TX
LAN (100) terminal
100BASE-TX
Terminal
Wireless LAN Section
Standards Compliance
Standards Compliance
IEEE 802.11 a/b/g/n
Frequency band
2.4 GHz, 5 GHz
BLUETOOTH Section
Communication system
Communication system
BLUETOOTH Specifi cation version 3.0
Output
BLUETOOTH
BLUETOOTH
Specifi cation Power
Class
2
Maximum communication range
Line of sight approx. 10 m
1)
Frequency band
2.4
2.4
GHz
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible BLUETOOTH profi les
2)
A2DP 1.2 (Advanced Audio
Distribution Profi le)
Distribution Profi le)
AVRCP 1.3 (Audio Video Remote
Control Profi le)
Control Profi le)
Supported Codecs
3)
SBC
4)
, AAC
Transmission range (A2DP)
20 Hz – 20,000 Hz (Sampling
frequency 44.1 kHz, 48 kHz)
frequency 44.1 kHz, 48 kHz)
1)
The actual range will vary depending on
factors such as obstacles between devices,
magnetic fi elds around a microwave oven,
static electricity, cordless phone, reception
sensitivity, antenna’s performance, operating
system, software application, etc.
factors such as obstacles between devices,
magnetic fi elds around a microwave oven,
static electricity, cordless phone, reception
sensitivity, antenna’s performance, operating
system, software application, etc.
2)
BLUETOOTH standard profi les indicate the
purpose of BLUETOOTH communication
between devices.
purpose of BLUETOOTH communication
between devices.
3)
Codec: Audio signal compression and
conversion format
conversion format
4)
Subband Codec
FM Tuner Section
System
System
PLL quartz-locked digital synthesizer
Tuning range
87.5 MHz - 108.0 MHz (50 kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals
75 ohms, unbalanced
General
Power requirements
Power requirements
220 V – 240 V AC, 50/60 Hz
Power consumption
On:
On:
85
W
Standby: 0.3 W (For details on the
setting, see page 42.)
Dimensions (w/h/d) (approx.)
480 mm × 78 mm × 212.5 mm
incl. projecting parts
Mass (approx.)
3.1
3.1
kg
Design and specifi cations are subject to
change without notice.
change without notice.
HBD-NF7220
2
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Copyrights and Trademarks
• This system incorporates with Dolby* Digital and the DTS** Digital Surround System.
• This system incorporates with Dolby* Digital and the DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories. Dolby and the double-D symbol are
trademarks of Dolby Laboratories.
** For DTS patents, see http://patents.dts.com.
Manufactured under license from DTS Licensing Limited. DTS, DTS-HD, the Symbol,
& DTS and the Symbol together are registered trademarks of DTS, Inc. © DTS, Inc. All
Rights Reserved.
& DTS and the Symbol together are registered trademarks of DTS, Inc. © DTS, Inc. All
Rights Reserved.
• This system incorporates High-Defi nition Multimedia Interface (HDMI™) technology.
The terms HDMI and HDMI High-Defi nition Multimedia Interface, and the HDMI Logo are
trademarks or registered trademarks of HDMI Licensing LLC in the United States and other
countries.
trademarks or registered trademarks of HDMI Licensing LLC in the United States and other
countries.
• Java is a trademark of Oracle and/or its affi liates.
• DVD Logo is a trademark of DVD Format/Logo Licensing Corporation.
• “Blu-ray Disc”, “Blu-ray”, “Blu-ray 3D”, “BD-LIVE”, “BONUSVIEW”, and logos are
• DVD Logo is a trademark of DVD Format/Logo Licensing Corporation.
• “Blu-ray Disc”, “Blu-ray”, “Blu-ray 3D”, “BD-LIVE”, “BONUSVIEW”, and logos are
trademarks of the Blu-ray Disc Association.
• “Blu-ray Disc”, “DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”, and “CD”
logos are trademarks.
• “Super Audio CD” is a trademark.
• App Store is a service mark of Apple Inc.
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD 3D/Progressive” and the “AVCHD 3D/Progressive” logo are trademarks of Panasonic
• App Store is a service mark of Apple Inc.
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD 3D/Progressive” and the “AVCHD 3D/Progressive” logo are trademarks of Panasonic
Corporation and Sony Corporation.
•
, “XMB”, and “xross media bar” are trademarks of Sony Corporation and Sony Computer
Entertainment Inc.
• “Playstation” is a registered trademark of Sony Computer Entertainment Inc.
• “Sony Entertainment Network” logo and “Sony Entertainment Network” are trademarks of Sony
• “Sony Entertainment Network” logo and “Sony Entertainment Network” are trademarks of Sony
Corporation.
• Music and video recognition technology and related data are provided by Gracenote
®
. Gracenote
is the industry standard in music recognition technology and related content delivery. For more
information, please visit www.gracenote.com.
information, please visit www.gracenote.com.
CD, DVD, Blu-ray Disc, and music and video-related data from Gracenote, Inc., copyright
© 2000-present Gracenote. Gracenote Software, copyright © 2000-present Gracenote. One
or more patents owned by Gracenote apply to this product and service. See the Gracenote
website for a nonexhaustive list of applicable Gracenote patents. Gracenote, CDDB, MusicID,
the Gracenote logo and logotype, and the “Powered by Gracenote” logo are either a registered
trademark or a trademark of Gracenote, Inc. in the United States and/or other countries.
© 2000-present Gracenote. Gracenote Software, copyright © 2000-present Gracenote. One
or more patents owned by Gracenote apply to this product and service. See the Gracenote
website for a nonexhaustive list of applicable Gracenote patents. Gracenote, CDDB, MusicID,
the Gracenote logo and logotype, and the “Powered by Gracenote” logo are either a registered
trademark or a trademark of Gracenote, Inc. in the United States and/or other countries.
• Wi-Fi
®
, Wi-Fi Protected Access
®
and Wi-Fi Alliance
®
are registered trademarks of Wi-Fi
Alliance.
• Wi-Fi CERTIFIED™, WPA™, WPA2™, Wi-Fi Protected Setup™, Miracast™ and Wi-Fi
CERTIFIED Miracast™ are trademarks of Wi-Fi Alliance.
• The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and
in other countries.
• Android™ is a trademark of Google Inc.
• Google Play™ is a trademark of Google Inc.
• “Xperia” is a trademark of Sony Mobile Communications AB.
• The
• Google Play™ is a trademark of Google Inc.
• “Xperia” is a trademark of Sony Mobile Communications AB.
• The
Bluetooth
®
word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
and any use of such marks by Sony Corporation is under license. Other trademarks and trade
names are those of their respective owners.
names are those of their respective owners.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and
Thomson.
• This product incorporates proprietary technology under license from Verance Corporation and
is protected by U.S. Patent 7,369,677 and other U.S. and worldwide patents issued and pending
as well as copyright and trade secret protection for certain aspects of such technology. Cinavia
is a trademark of Verance Corporation. Copyright 2004-2010 Verance Corporation. All rights
reserved by Verance. Reverse engineering or disassembly is prohibited.
as well as copyright and trade secret protection for certain aspects of such technology. Cinavia
is a trademark of Verance Corporation. Copyright 2004-2010 Verance Corporation. All rights
reserved by Verance. Reverse engineering or disassembly is prohibited.
• Windows Media is either a registered trademark or trademark of Microsoft Corporation in the
United States and/or other countries.
This product is protected by certain intellectual property rights of Microsoft Corporation. Use
or distribution of such technology outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
or distribution of such technology outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
Content owners use Microsoft PlayReady™ content access technology to protect their
intellectual property, including copyrighted content. This device uses PlayReady technology to
access PlayReady-protected content and/or WMDRM-protected content. If the device fails to
properly enforce restrictions on content usage, content owners may require Microsoft to revoke
the device’s ability to consume PlayReady-protected content. Revocation should not affect
unprotected content or content protected by other content access technologies. Content owners
may require you to upgrade PlayReady to access their content. If you decline an upgrade, you
will not be able to access content that requires the upgrade.
access PlayReady-protected content and/or WMDRM-protected content. If the device fails to
properly enforce restrictions on content usage, content owners may require Microsoft to revoke
the device’s ability to consume PlayReady-protected content. Revocation should not affect
unprotected content or content protected by other content access technologies. Content owners
may require you to upgrade PlayReady to access their content. If you decline an upgrade, you
will not be able to access content that requires the upgrade.
• DLNA™, the DLNA Logo and DLNA CERTIFIED™ are trademarks, service marks, or
certifi cation marks of the Digital Living Network Alliance.
• Opera
®
Devices SDK from Opera Software ASA. Copyright 1995-2013 Opera Software ASA.
All rights reserved.
• All other trademarks are trademarks of their respective owners.
• Other system and product names are generally trademarks or registered trademarks of the
• Other system and product names are generally trademarks or registered trademarks of the
manufacturers. ™ and ® marks are not indicated in this document.
Pick-up unit of this appliance is
classified as a CLASS 3R LASER product.
Visible and invisible laser radiation is
emitted when the laser protective
housing is opened, so be sure to avoid
direct eye exposure.
This marking is located on the bottom
exterior of the main unit.
classified as a CLASS 3R LASER product.
Visible and invisible laser radiation is
emitted when the laser protective
housing is opened, so be sure to avoid
direct eye exposure.
This marking is located on the bottom
exterior of the main unit.
This appliance is classified as a CLASS 1
LASER product. This marking is located
on the bottom exterior of the main unit.
LASER product. This marking is located
on the bottom exterior of the main unit.
HBD-NF7220
3
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
1.
SERVICING NOTES
.............................................
4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 14
2-2. Cover
(Top)
..................................................................... 15
2-3. TOUCH_F Board, TOUCH_S Board Block ................... 16
2-4. Inner Door Block ............................................................ 17
2-5. Cover
2-4. Inner Door Block ............................................................ 17
2-5. Cover
(Bu
Top)
............................................................... 18
2-6. Loading
Assy
Block
........................................................ 19
2-7. Optical Device Block ...................................................... 20
2-8. Flexible Flat Cable (45 Core),
2-8. Flexible Flat Cable (45 Core),
Wire (Flat Type) (9 Core), Wire (Flat Type) (5 Core) .... 21
2-9. Optical Device KEM480AHA/C2RP1 (OP1) ................ 22
2-10. Cover (Bottom) Block .................................................... 23
2-11. WLAN/BT Combo Card ................................................. 24
2-12. FL+CHUKEI Board ........................................................ 24
2-13. LED CHUKEI Board ...................................................... 25
2-14. FUSB+SIRCS Board ...................................................... 25
2-15. AUDIO IO Board ............................................................ 26
2-16. Shield (Power) Block ...................................................... 26
2-17. MB1305 Board ............................................................... 27
2-18. DC Fan ............................................................................ 28
2-19. Power Cord ..................................................................... 28
2-20. AMP Board ..................................................................... 29
2-21. Switching Regulator ....................................................... 30
2-22. How To Bend FFC .......................................................... 31
2-10. Cover (Bottom) Block .................................................... 23
2-11. WLAN/BT Combo Card ................................................. 24
2-12. FL+CHUKEI Board ........................................................ 24
2-13. LED CHUKEI Board ...................................................... 25
2-14. FUSB+SIRCS Board ...................................................... 25
2-15. AUDIO IO Board ............................................................ 26
2-16. Shield (Power) Block ...................................................... 26
2-17. MB1305 Board ............................................................... 27
2-18. DC Fan ............................................................................ 28
2-19. Power Cord ..................................................................... 28
2-20. AMP Board ..................................................................... 29
2-21. Switching Regulator ....................................................... 30
2-22. How To Bend FFC .......................................................... 31
3.
TEST MODE
............................................................ 33
4.
ELECTRICAL CHECK
......................................... 44
5. TROUBLESHOOTING
.......................................... 45
6. DIAGRAMS
6-1. Block Diagram - SERVO Section - ................................ 49
6-2. Block Diagram - MEMORY Section - ............................ 50
6-3. Block Diagram - MAIN Section - ................................... 51
6-4. Block Diagram - AMP Section - ..................................... 52
6-5. Block Diagram - POWER SUPPLY Section - ................ 53
6-6. Printed
6-2. Block Diagram - MEMORY Section - ............................ 50
6-3. Block Diagram - MAIN Section - ................................... 51
6-4. Block Diagram - AMP Section - ..................................... 52
6-5. Block Diagram - POWER SUPPLY Section - ................ 53
6-6. Printed
Wiring
Board
- MB1305 Board (Component Side) - ............................ 55
6-7. Printed
Wiring
Board
- MB1305 Board (Conductor Side) - .............................. 56
6-8. Schematic Diagram - MB1305 Board (1/9) - ................. 57
6-9. Schematic Diagram - MB1305 Board (2/9) - ................. 58
6-10. Schematic Diagram - MB1305 Board (3/9) - ................. 59
6-11. Schematic Diagram - MB1305 Board (4/9) - ................. 60
6-12. Schematic Diagram - MB1305 Board (5/9) - ................. 61
6-13. Schematic Diagram - MB1305 Board (6/9) - ................. 62
6-14. Schematic Diagram - MB1305 Board (7/9) - ................. 63
6-15. Schematic Diagram - MB1305 Board (8/9) - ................. 64
6-16. Schematic Diagram - MB1305 Board (9/9) - ................. 65
6-17. Printed Wiring Board
6-9. Schematic Diagram - MB1305 Board (2/9) - ................. 58
6-10. Schematic Diagram - MB1305 Board (3/9) - ................. 59
6-11. Schematic Diagram - MB1305 Board (4/9) - ................. 60
6-12. Schematic Diagram - MB1305 Board (5/9) - ................. 61
6-13. Schematic Diagram - MB1305 Board (6/9) - ................. 62
6-14. Schematic Diagram - MB1305 Board (7/9) - ................. 63
6-15. Schematic Diagram - MB1305 Board (8/9) - ................. 64
6-16. Schematic Diagram - MB1305 Board (9/9) - ................. 65
6-17. Printed Wiring Board
- AMP Board (Component Side) - .................................. 66
6-18. Printed Wiring Board
- AMP Board (Conductor Side) - .................................... 67
6-19. Schematic Diagram - AMP Board (1/2) - ....................... 68
6-20. Schematic Diagram - AMP Board (2/2) - ....................... 69
6-21. Printed Wiring Board - AUDIO IO Board - .................... 70
6-22. Schematic Diagram - AUDIO IO Board - ...................... 71
6-23. Printed Wiring Board - FL+CHUKEI Board - ................ 72
6-24. Schematic Diagram - FL+CHUKEI Board - .................. 73
6-25. Printed Wiring Board - TOUCH_F Board - .................... 74
6-26. Schematic Diagram - TOUCH_F Board -....................... 75
6-27. Printed Wiring Board - LED CHUKEI Board - .............. 76
6-28. Schematic Diagram - LED CHUKEI Board - ................ 77
6-29. Printed Wiring Board - TOUCH_S Board - .................... 77
6-30. Schematic Diagram - TOUCH_S Board -....................... 78
6-31. Printed Wiring Board - FUSB+SIRCS Board - .............. 78
6-32. Schematic Diagram - FUSB+SIRCS Board - ................. 79
6-33. Printed Wiring Board - POWER KEY Board -............... 79
6-34. Schematic Diagram - POWER KEY Board - ................. 79
6-20. Schematic Diagram - AMP Board (2/2) - ....................... 69
6-21. Printed Wiring Board - AUDIO IO Board - .................... 70
6-22. Schematic Diagram - AUDIO IO Board - ...................... 71
6-23. Printed Wiring Board - FL+CHUKEI Board - ................ 72
6-24. Schematic Diagram - FL+CHUKEI Board - .................. 73
6-25. Printed Wiring Board - TOUCH_F Board - .................... 74
6-26. Schematic Diagram - TOUCH_F Board -....................... 75
6-27. Printed Wiring Board - LED CHUKEI Board - .............. 76
6-28. Schematic Diagram - LED CHUKEI Board - ................ 77
6-29. Printed Wiring Board - TOUCH_S Board - .................... 77
6-30. Schematic Diagram - TOUCH_S Board -....................... 78
6-31. Printed Wiring Board - FUSB+SIRCS Board - .............. 78
6-32. Schematic Diagram - FUSB+SIRCS Board - ................. 79
6-33. Printed Wiring Board - POWER KEY Board -............... 79
6-34. Schematic Diagram - POWER KEY Board - ................. 79
7.
EXPLODED VIEWS
7-1. Cover (Top) Section ........................................................ 104
7-2. TOUCH_F Board, TOUCH_S Board Section ................ 105
7-3. Mechanism Deck Section ............................................... 106
7-4. Optical Device KEM480AHA/C2RP1 (OP1) Section ... 107
7-5. Cover (Bottom) Section .................................................. 108
7-6. Shield (Power) Section ................................................... 109
7-7. MB1305 Board Section .................................................. 110
7-8. Switching Regulator Section .......................................... 111
7-2. TOUCH_F Board, TOUCH_S Board Section ................ 105
7-3. Mechanism Deck Section ............................................... 106
7-4. Optical Device KEM480AHA/C2RP1 (OP1) Section ... 107
7-5. Cover (Bottom) Section .................................................. 108
7-6. Shield (Power) Section ................................................... 109
7-7. MB1305 Board Section .................................................. 110
7-8. Switching Regulator Section .......................................... 111
8.
ELECTRICAL PARTS LIST
.............................. 112
HBD-NF7220
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
IMPORTANT NOTICE FOR OPERATION CHECK
Before performing an operation check on this model, make sure
you fi rst attach inner door to prevent the laser beam from shining
directly into the eyes.
Additionally, before disassembling this model, make sure you re-
move the power cord and confi rm that no electricity is fl owing
through this model.
Before performing an operation check on this model, make sure
you fi rst attach inner door to prevent the laser beam from shining
directly into the eyes.
Additionally, before disassembling this model, make sure you re-
move the power cord and confi rm that no electricity is fl owing
through this model.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
In order to perform the operation checking, all the units contained
in this unit are needed.
ERATION
In order to perform the operation checking, all the units contained
in this unit are needed.
ABOUT THE LENS CLEANING
Don’t do the lens cleaning with the cotton bud etc. It causes the
trouble.
Don’t do the lens cleaning with the cotton bud etc. It causes the
trouble.
RELEASING THE DISC LID LOCK
The disc lid lock function for the antitheft of an demonstration disc
in the store is equipped.
The disc lid lock function for the antitheft of an demonstration disc
in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn on the system.
2. Press the [HOME] button on the remote commander to enter
the home menu.
3. Touch the [
x
] sensor, press the [
Z
] button simultaneously
and hold down until “D. OFF” displayed on the fluorescent
indicator tube (around 5 seconds).
indicator tube (around 5 seconds).
Note: When “D LOCK” is displayed, the disc lid lock is not released by
turning power on/off with the [?/1] button.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• Switching
regulator
C201, C207, C208, C402
C402
C207
C201
800
:/2 W
(for C402)
C208
– SWITCHING REGULATOR (Component Side) –
800
:/2 W
(for C208)
800
:/2 W
(for C207)
800
:/2 W
(for C201)
inner door