Sony CDP-CE500 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
CDP-CE500
SPECIFICATIONS
COMPACT DISC PLAYER
9-893-037-01
2010L05-1
©
2010.12
US Model
Canadian Model
Ver. 1.0 2010.12
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM59-DA11
Base Unit Name
BU-DA11BD75
Optical Pick-up Block Name
DA11MMVGP
s MPEG Layer-3 audio coding
technology and patents licensed
from Fraunhofer IIS and
Thomson.
from Fraunhofer IIS and
Thomson.
s Windows Media is a registered
trademark of Microsoft
Corporation in the United States
and/or other countries.
Corporation in the United States
and/or other countries.
CD player section
Laser
Semiconductor laser (
λ =
780 nm)
Emission duration:
continuous
Emission duration:
continuous
Frequency response
2 Hz to 20 kHz ± 0.5 dB
Dynamic range
More than 90 dB
Harmonic distortion
Less than 0.006%
Laser Diode Properties
Emission Duration:
Continuous
Laser Output: Less than
44.6
Continuous
Laser Output: Less than
44.6
μW
* This output is the value measurement at a
distance of 200 mm from the objective lens
surface on the optical pick-up block with 7 mm
aperture.
surface on the optical pick-up block with 7 mm
aperture.
USB section
Supported bit rate
MP3 (MPEG 1 Audio
Layer 3): 32 kbps – 320
kbps, VBR
WMA: 48 kbps – 192 kbps
AAC: 48 kbps – 320 kbps
Layer 3): 32 kbps – 320
kbps, VBR
WMA: 48 kbps – 192 kbps
AAC: 48 kbps – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio
Layer 3): 32 kHz/
44.1 kHz/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
Layer 3): 32 kHz/
44.1 kHz/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
USB port
Maximum current:
500 mA
500 mA
Outputs
General
Power requirements
120 V AC, 60 Hz
Power consumption
16 W
Dimensions (approx.)
430 mm × 110 mm ×
400 mm
400 mm
(w/h/d)
(17 in × 4 3/8 in ×
15 3/4 in) incl. projecting
parts
15 3/4 in) incl. projecting
parts
Mass (approx.)
5.2 kg (11 lbs 1 oz)
Supplied accessories
Audio cord
Red and white (1)
Remote commander
RM-ASU100 (1)
Battery
R6 (size-AA) (2)
Design and specifications are subject to change
without notice.
without notice.
Jack type Maximum
output level
Load
impedance
impedance
ANALOG
OUT
OUT
Phono
jacks
jacks
2 V (at 50
kilohms)
kilohms)
Over 10
kilohms
kilohms
DIGITAL
OUT
OPTICAL
OUT
OPTICAL
Optical
output
jack
output
jack
–18 dBm
Wave
length:
660 nm
length:
660 nm
s Standby power consumption: 0.3 W
s Halogenated flame retardants are not used in the
s Halogenated flame retardants are not used in the
certain printed wiring boards.
CDP-CE500
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ...........................................................
5
2-2.
Case .................................................................................
5
2-3. Front Panel Block ........................................................... 6
2-4. CD Mechanism Deck (CDM59-DA11) .......................... 7
2-5. MAIN Board ...................................................................
2-4. CD Mechanism Deck (CDM59-DA11) .......................... 7
2-5. MAIN Board ...................................................................
8
2-6.
USB-AUDIO Board ........................................................
8
2-7. Table Block .....................................................................
9
2-8. Tray ................................................................................. 10
2-9. Chucking (DA11) Pulley Assy ........................................ 10
2-10. Rotary Motor Assy (M11), SENSOR Board ................... 11
2-11. Gear (RV), Gear (U/D), Swing Gear .............................. 12
2-12. Loading Motor Assy (M10),
2-9. Chucking (DA11) Pulley Assy ........................................ 10
2-10. Rotary Motor Assy (M11), SENSOR Board ................... 11
2-11. Gear (RV), Gear (U/D), Swing Gear .............................. 12
2-12. Loading Motor Assy (M10),
LOADING MOTOR Board ............................................ 13
2-13. JUNCTION Board .......................................................... 14
2-14. Base Unit Block .............................................................. 14
2-15. Base Unit (BU-DA11BD75) ........................................... 15
2-16. Optical Pick-up Block (DA11MMVGP) ........................ 15
2-14. Base Unit Block .............................................................. 14
2-15. Base Unit (BU-DA11BD75) ........................................... 15
2-16. Optical Pick-up Block (DA11MMVGP) ........................ 15
3.
TEST MODE
............................................................ 16
4.
ELECTRICAL CHECK
......................................... 19
5. DIAGRAMS
5-1. Block Diagram ................................................................ 20
5-2. Printed Wiring Board - BD75 Board - ............................ 22
5-3. Schematic Diagram - BD75 Board - ............................... 23
5-4. Printed Wiring Boards - MECHANISM Section - ......... 24
5-5. Schematic Diagram - MECHANISM Section - .............. 25
5-6. Printed Wiring Board - USB-AUDIO Board - ................ 26
5-7. Schematic Diagram - USB-AUDIO Board - .................. 27
5-8. Printed Wiring Boards - PANEL Section - ..................... 28
5-9. Schematic Diagram - PANEL Section - .......................... 29
5-10. Schematic Diagram - MAIN Board (1/2) - ..................... 30
5-11. Schematic Diagram - MAIN Board (2/2) - ..................... 31
5-12. Printed Wiring Board - MAIN Board - ........................... 32
5-2. Printed Wiring Board - BD75 Board - ............................ 22
5-3. Schematic Diagram - BD75 Board - ............................... 23
5-4. Printed Wiring Boards - MECHANISM Section - ......... 24
5-5. Schematic Diagram - MECHANISM Section - .............. 25
5-6. Printed Wiring Board - USB-AUDIO Board - ................ 26
5-7. Schematic Diagram - USB-AUDIO Board - .................. 27
5-8. Printed Wiring Boards - PANEL Section - ..................... 28
5-9. Schematic Diagram - PANEL Section - .......................... 29
5-10. Schematic Diagram - MAIN Board (1/2) - ..................... 30
5-11. Schematic Diagram - MAIN Board (2/2) - ..................... 31
5-12. Printed Wiring Board - MAIN Board - ........................... 32
6.
EXPLODED VIEWS
6-1.
Case Section .................................................................... 40
6-2. Front Panel Section ......................................................... 41
6-3. Chassis Section ............................................................... 42
6-4. CD Mechanism Deck Section (Table Block)
6-3. Chassis Section ............................................................... 42
6-4. CD Mechanism Deck Section (Table Block)
(CDM59-DA11) .............................................................. 43
6-5. CD Mechanism Deck Section (Chassis Block)
(CDM59-DA11) .............................................................. 44
6-6. Base Unit Section ............................................................ 45
7.
ELECTRICAL PARTS LIST
.............................. 46
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
TABLE OF CONTENTS
CDP-CE500
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTE OF REPLACING THE IC901 ON THE USB-
AUDIO BOARD
AUDIO BOARD
IC901 on the USB-AUDIO board cannot exchange with single. When this
part is damaged, exchange the complete mounted board.
part is damaged, exchange the complete mounted board.
RELEASING ANTITHEFT LOCK MODE
The disc tray lock function for the antitheft of a demonstration disc
in the store is equipped.
The disc tray lock function for the antitheft of a demonstration disc
in the store is equipped.
Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. Press the [CD/USB] button to select CD function.
3. Press two buttons of [ENTER] and [
3. Press two buttons of [ENTER] and [
Z
] for 5 seconds or larger
simultaneously.
4. The message “UNLOCKED” is displayed on the fl uorescent
indicator tube, and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the antitheft lock is not released by
turning power on/off with the [\/1] button.
NOTE OF TRANSPORTING THIS SET
Transport it after executing “CD SHIP & COLD RESET” accord-
ing to the following procedure when this set is transported.
Transport it after executing “CD SHIP & COLD RESET” accord-
ing to the following procedure when this set is transported.
Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. Eject the CD.
3. Press the [CD/USB] button to select CD function
4. Press three buttons of [
3. Press the [CD/USB] button to select CD function
4. Press three buttons of [
M >
], [ENTER] and [
?/1
] simulta-
neously.
5. When “STANDBY” and “RESET” appears, the set enters
standby status.
CDP-CE500
4
HOW TO OPEN THE DISC TABLE WHEN POWER
SWITCH TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and
turn it in the direction of the arrow (to OUT direction).
SWITCH TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and
turn it in the direction of the arrow (to OUT direction).
– bottom view –
tapering driver
table
Note: To close the table, turn the tapering driver
in the reverse direction (to IN direction).
NOTE FOR GEAR INSTALLATION
When following gears are installed, it is necessary to phase it.
Please refer to “2-11. GEAR (RV), GEAR (U/D), SWING GEAR”
(page 12).
When following gears are installed, it is necessary to phase it.
Please refer to “2-11. GEAR (RV), GEAR (U/D), SWING GEAR”
(page 12).
CD MECHANISM DECK SERVICE POSITION
gear (RV)
swing gear
gear (U/D)
base unit block
chucking block
disc for play
CD mechanism deck
(CDM59-DA11)
(CDM59-DA11)
Connect extension jig
(1.0 mm pitch/25 cores)
(Part No. J-2501-199-A)
to USB-AUDIO board (CN902)
and BD75 board (CN403)
(1.0 mm pitch/25 cores)
(Part No. J-2501-199-A)
to USB-AUDIO board (CN902)
and BD75 board (CN403)
BD75 board
USB-AUDIO board
Note: When you do the operation check
of base unit block, please check
after installing temporary CD on
the tray.
after installing temporary CD on
the tray.