DOWNLOAD Panasonic KX-TGP600RUB / KX-TPA60RUB Service Manual ↓ Size: 7.75 MB | Pages: 105 in PDF or view online for FREE

Model
KX-TGP600RUB KX-TPA60RUB
Pages
105
Size
7.75 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / SIP CORDLESS PHONE
File
kx-tgp600rub-kx-tpa60rub.pdf
Date

Panasonic KX-TGP600RUB / KX-TPA60RUB Service Manual ▷ View online

69
KX-TGP600RUB/KX-TPA60RUB
12.2. Handset Reference Drawing
When connecting the simulator equipment for checking, please refer to below.
1
3
1
3
2
5
4
2.5A
E
E
E
E
E
8
5
4
1
B A T T +
B A T T -
R T C K
C H G +
C H G -
G N D _ J
C 2 0 3
C 2 0 4
3 . 0 v
S P M S P P
R E F - 2
V B G
D200
D201
T C K
U R X
Q 5 0 1
T D I
T D O
L303
L304
L305
A N T _ T P 1
U T X
M I C +
M I C -
L E D 4 v
C N 1 0 0
C N 3 0 1
V B A T
T M S
F201
Q 2 0 0
O F 1
Q 2 0 1
O F 2
A N T _ J P
Q 2 0 4
Q 2 0 5
1 . 2 v
D 3 0 0
D 3 0 1
D304
D305
L201
S P E A K E R
G N D 1
IC104
I C 1 0 5
CKM
X1
1 . 8 V
K X - T P A 6 0 x x
2014.10.23
Blue
Orange
C E
M
R U
L A
L C
B R
C
U K
A L
1 2 3 4 5 6 7 8 9
A B C D E F G H I
P N L B 2 3 4 8 Z
A
AF VOLT 
METER
40
Oscilloscope
DC_VOLT_METER
MIC Load
MICP
MICM
BATT-
BATT+
47
47
Frequency
Counter (*1)
CKM
Spectrum Analyzer
OSC
1.1 kHz
AF VOLT 
METER
8
Oscilloscope
ANT
DC_POWER_SUPPLY
2.6 V    2.34 V
70
KX-TGP600RUB/KX-TPA60RUB
12.3. Frequency Table
Cross Reference:
How to "TX Power measurment". (Handset) (P.31)
Test Burst Mode for Base Unit (P.32)
Ch.(hex)
TX/RX Frequency (MHz)
Channel 0
00 
1897.344 
Channel 1
01 
1895.616
Channel 2
02 
1893.888 
Channel 3
03 
1892.160 
Channel 4
04 
1890.432 
Channel 5
05
1888.704 
Channel 6
06
1886.976 
Channel 7
07
1885.248 
Channel 8
08 
1883.520 
Channel 9
09
1881.792
71
KX-TGP600RUB/KX-TPA60RUB
13 Maintenance
13.1. Terminal Guide of the ICs Transistors and Diodes
13.1.1.
Base Unit (Main Board)
13.1.2.
Handset (Main Board)
C3ABTY000111
C2HBBY000150
C0EBE0000444, C0DBGYY00905
C1CB00003736
C1CB00004252
C2HBCY000155
C3FBPY000318
C0DBGYY01870
C0DBAYY01648
B0JCML000007
DB2X41400L
B3AAB0000316, B3ABB0000331
B0ECMK000001
A 1
T 1
T 9
A 9
A1
A19
W19
W1
1
2
4
3
1
8
9
16
32
25
17
24
1
4
8
5
Cathode
Anode
Cathode
Anode
Cathode
Anode
1
4
8
5
1
4
14
11
15
10
20
5
Cathode
Anode
1
27
28
54
108
82
81
55
C2HBCY000155
B1ADCF000040, 2SD2216JSL
B1ABGE000011
DB2J20100L
B0BC4R3A0006
B3AFB0000570
LNJ826W83RA
C
B
E
Cathode
Anode
1
27
28
54
108
82
81
55
Cathode
Anode
72
KX-TGP600RUB/KX-TPA60RUB
13.2. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
F ± 20F (370C ± 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity 
 0.82.
Type 
 RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
13.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
13.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
13.2.4.
Removing Solder From Between
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
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