DOWNLOAD Panasonic KX-TGP600RUB / KX-TPA60RUB Service Manual ↓ Size: 7.75 MB | Pages: 105 in PDF or view online for FREE

ORDER NO. KMS1504143CE

(for Russia, Ukraine, Kazakhstan)

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1 Safety Precautions -----------------------------------------------4

1.1. For Service Technicians  ---------------------------------4

2 Warning --------------------------------------------------------------4

2.1. Battery Caution ---------------------------------------------4
2.2. About Lead Free Solder (PbF: Pb free) --------------4

2.2.1. Suggested PbF Solder -------------------------------5

2.3. Discarding of P. C. Board --------------------------------5

3 Specifications ------------------------------------------------------6
4 Technical Descriptions------------------------------------------7

4.1. IP PHONE Description------------------------------------7
4.2. DECT Description ------------------------------------------8

4.2.1. TDD Frame Format (Full Slot) ---------------------8
4.2.2. TDD Frame Format (Long Slot) for G.722

CODEC --------------------------------------------------8

4.2.3. TDMA system ------------------------------------------8

4.3. Explanation of Link Data Communication------------9

4.3.1. Calling ----------------------------------------------------9
4.3.2. To Terminate Communication ----------------------9
4.3.3. Ringing ---------------------------------------------------9

4.4. Block Diagram (Base Unit) ---------------------------- 10
4.5. Circuit Operationn (Base Unit) ------------------------ 11

4.5.1. IC300, IC101 ----------------------------------------- 11
4.5.2. Flash Memory (IC102, IC301)-------------------- 11
4.5.3. DDR3 RAM (IC100)--------------------------------- 11
4.5.4. Power Supply Circuit ------------------------------- 12
4.5.5. Reset Circuit ------------------------------------------ 13
4.5.6. Clock Circuit ------------------------------------------ 13
4.5.7. ETHER conection Block --------------------------- 14

4.6. Block Diagram (Handset) ------------------------------ 15
4.7. Circuit Operation (Handset) --------------------------- 16

4.7.1. Construction ------------------------------------------ 16
4.7.2. Power Supply Circuit ------------------------------- 17
4.7.3. Ringer and Handset SP-Phone ------------------ 17
4.7.4. Sending Signal --------------------------------------- 17
4.7.5. Reception Signal ------------------------------------ 18

4.8. Circuit Operation (RF Part) ---------------------------- 18
4.9. Circuit Operation (Charger Unit) --------------------- 18

4.10. Signal Route----------------------------------------------- 19

5 Location of Controls and Components------------------ 20

5.1. Name and Locations ------------------------------------ 20

5.1.1. Base Unit  --------------------------------------------- 20
5.1.2. Handset ----------------------------------------------- 22

6 Installation Instructions--------------------------------------- 24

6.1. Connections ----------------------------------------------- 24

6.1.1. Base Unit ---------------------------------------------- 24
6.1.2. Charger Unit ------------------------------------------ 24
6.1.3. Battery Installation ---------------------------------- 24
6.1.4. Attaching the Belt Clip------------------------------ 24
6.1.5. Charging the Batteries ----------------------------- 25

7 Firmware Version up ------------------------------------------- 26

7.1. Serial Download ------------------------------------------ 26

7.1.1. Preparation-------------------------------------------- 26
7.1.2. How to "Serial Download" ------------------------- 26

7.2. Air Down load --------------------------------------------- 29

8 Test Mode ---------------------------------------------------------- 30

8.1. How to execute Test command ----------------------- 30

8.1.1.  Commands ------------------------------------------- 30

8.1.2. How to "TX Power measurment".

(Handset) --------------------------------------------- 31

8.2. Key/Soft key and Icon List----------------------------- 31
8.3. Translation List ------------------------------------------- 31
8.4. Test Burst Mode for Base Unit ----------------------- 32
8.5. Peer to Peer Mode Test -------------------------------- 33

8.5.1. Preparation ------------------------------------------- 33
8.5.2. PC Setting for Configuration --------------------- 33
8.5.3. SET Static IP address ----------------------------- 35
8.5.4. How to Login to Panasonic Administrator

Menu --------------------------------------------------- 36

8.5.5.  Setting Up for Reference Unit------------------- 37
8.5.6. Connection for Test--------------------------------- 39
8.5.7. How to Release the Peer to Peer Mode on

Base Unit---------------------------------------------- 40

8.6. Serial Test Mode ----------------------------------------- 41

8.6.1.  How to Install the Application for Test

Mode --------------------------------------------------- 41

8.6.2. PC Setting -------------------------------------------- 42
8.6.3. How to Start Serial Test Mode ------------------- 43

9 Service Mode----------------------------------------------------- 44

9.1. How to Clear User Setting----------------------------- 44

9.1.1. Base Unit---------------------------------------------- 44
9.1.2. Handset ----------------------------------------------- 44

9.2. Handset Operation Using the Direct

Commands for IP Settings ---------------------------- 44

9.3. Web User Interface-------------------------------------- 45

9.3.1. Web user interface Parameter List ------------- 45
9.3.2. Version Information--------------------------------- 45
9.3.3. Handset Information-------------------------------- 46
9.3.4. Network Status -------------------------------------- 46
9.3.5. VoIP Status ------------------------------------------- 46
9.3.6. Basic Network setting Status--------------------- 47
9.3.7.  Syslog setting Status ------------------------------ 47
9.3.8. Import Configuration File Status----------------- 47
9.3.9. Export Configuration File Status ---------------- 48

9.3.10. Export Operational Value Status ---------------- 48

9.3.11. Upgrade Firmware Status------------------------- 48

9.3.12. Peer to peer Mode Status------------------------- 49
9.3.13. Restart to Default Status -------------------------- 49
9.3.14. Restart ------------------------------------------------- 50

9.4. How to Change MAC Address

Label(Procedure after Replacing the Main
P.C.Board of Base Unit)-------------------------------- 51

9.4.1. Replacing Main P.C.Board------------------------ 51
9.4.2. Attaching MAC Address and Serial

Number Label---------------------------------------- 52

10 Troubleshooting Guide --------------------------------------- 53

10.1. Troubleshooting Flowchart ---------------------------- 53

10.1.1. Check Power----------------------------------------- 54
10.1.2. Check Status Indicator----------------------------- 55
10.1.3. Check CDL Link ------------------------------------- 56
10.1.4. Check DCX (IC300) -------------------------------- 57
10.1.5. IP Trouble --------------------------------------------- 58
10.1.6.  Check the RF part --------------------------------- 60
10.1.7. Check Handset Transmission-------------------- 63
10.1.8. Check Handset Reception------------------------ 63

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10.2. Failure analysis of DSP(IC101) ,FLASH and

RAM (Base Unit)------------------------------------------64

10.3. Error Message (Handset)-------------------------------65

10.3.1. Need Repair-------------------------------------------65
10.3.2. “ERROR 1”, “ERROR 2” ---------------------------65

11 Disassembly and Assembly Instructions ---------------66

11.1. Remove Handset and Charger Unit -----------------66
11.2. Remove the Base Unit ----------------------------------67

12 Measurements and Adjustments---------------------------68

12.1. Things to Do after Replacing IC ----------------------68

12.1.1. X100 (Base Unit), X1 (Handset) Check --------68
12.1.2. Check and Adjustment X100(Base Unit) ------68

12.2. Handset Reference Drawing---------------------------69
12.3. Frequency Table ------------------------------------------70

13 Maintenance-------------------------------------------------------71

13.1. Terminal Guide of the ICs Transistors and

Diodes -------------------------------------------------------71

13.1.1. Base Unit (Main Board) ----------------------------71
13.1.2. Handset (Main Board) ------------------------------71

13.2. How To Replace a Flat Package IC------------------72

13.2.1. Preparation --------------------------------------------72
13.2.2. Removal Procedure ---------------------------------72
13.2.3. Procedure----------------------------------------------72
13.2.4. Removing Solder From Between Pins ---------72

14 Schematic Diagram ---------------------------------------------73

14.1. Base Unit  --------------------------------------------------73
14.2. Handset -----------------------------------------------------76

15 Printed Circuit Board-------------------------------------------77

15.1. Base Unit ---------------------------------------------------77

15.1.1. Component View-------------------------------------77
15.1.2. Bottom View-------------------------------------------78

15.2. Handset -----------------------------------------------------79

15.2.1. Component View-------------------------------------79
15.2.2. Bottom View-------------------------------------------79

16 Appendix Information of Schematic Diagram ---------80
17 Exploded View and Replacement Parts List -----------81

17.1. IC Data (Base Unit) --------------------------------------81

17.1.1. IC101 (DVF)-------------------------------------------81
17.1.2. IC100 (DDR3) ----------------------------------------87
17.1.3. IC102 (Flash) -----------------------------------------89
17.1.4. IC300 (DCX) ------------------------------------------90
17.1.5. IC301 (Flash) -----------------------------------------92
17.1.6. IC200 (PHY) ------------------------------------------92

17.2. IC Data (Handset) ----------------------------------------93

17.2.1. IC1 (DCX)----------------------------------------------93
17.2.2. IC100 (FLASH) ---------------------------------------94

17.3. Cabinet and Electric Parts------------------------------95

17.3.1. Base Unit ----------------------------------------------95
17.3.2. Handset ------------------------------------------------96
17.3.3. Charger Unit ------------------------------------------97

17.4. Accessories and Packing Materials------------------98

17.4.1. KX-TGP600 -------------------------------------------98
17.4.2. KX-TPA60----------------------------------------------99

17.5. Replacement Parts List ------------------------------- 100

17.5.1. Cabinet and Electrical Parts -------------------- 100
17.5.2. Accessories and Packing Materials ----------- 100
17.5.3. Main Board Parts ---------------------------------- 101
17.5.4. Poly Switch Board --------------------------------- 105

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1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent

the customer from being exposed to shock hazards.

• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer. Dispose of used batteries according to the manufacturer's lnstructions. 

2. The lithium battery is a critical component. Please observe for the proper polarity and the exact location when replacing it and

soldering the replacement lithium battery in.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50 

F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 

F ± 20 F (370 C ± 10 C).

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 

F (600 C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).