Panasonic KX-TGP500B09 / KX-TPA50B09 (serv.man2) Service Manual ▷ View online
ORDER NO. KM41109497CE
Telephone Equipment
Model No.
KX-TGP500B09
KX-
KX-
TPA50B09
SIP Cordless Phone
Black Version
(for Russia, Ukraine)
(for Russia, Ukraine)
2
KX-TGP500B09/KX-TPA50B09
3
KX-TGP500B09/KX-TPA50B09
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4 Technical Descriptions ----------------------------------------- 7
4.1. IP PHONE Description ----------------------------------- 7
4.2. DECT Description ----------------------------------------- 8
4.3. Explanation of Link Data Communication ----------10
4.4. Block Diagram (Base Unit_Main)---------------------11
4.5. Block Diagram (Base Unit_RF Part) -----------------12
4.6. Circuit Operation (Base Unit)--------------------------13
4.7. Block Diagram (Handset)-------------------------------16
4.8. Block Diagram (Handset_RF Part)-------------------17
4.9. Circuit Operation (Handset)----------------------------18
4.2. DECT Description ----------------------------------------- 8
4.3. Explanation of Link Data Communication ----------10
4.4. Block Diagram (Base Unit_Main)---------------------11
4.5. Block Diagram (Base Unit_RF Part) -----------------12
4.6. Circuit Operation (Base Unit)--------------------------13
4.7. Block Diagram (Handset)-------------------------------16
4.8. Block Diagram (Handset_RF Part)-------------------17
4.9. Circuit Operation (Handset)----------------------------18
4.10. Circuit Operation (RF Part)-----------------------------21
4.11. Circuit Operation (Charger Unit) ----------------------22
4.12. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------24
6 Installation Instructions ---------------------------------------24
7 Operating Instructions-----------------------------------------24
8 Test Mode ----------------------------------------------------------25
6 Installation Instructions ---------------------------------------24
7 Operating Instructions-----------------------------------------24
8 Test Mode ----------------------------------------------------------25
8.1. Key/Soft key and Icon List -----------------------------25
8.2. Translation List --------------------------------------------25
8.3. Adjustment and Test Mode Flow Chart -------------26
8.4. Peer to Peer Mode Test---------------------------------33
8.5. USB Test Mode -------------------------------------------44
8.2. Translation List --------------------------------------------25
8.3. Adjustment and Test Mode Flow Chart -------------26
8.4. Peer to Peer Mode Test---------------------------------33
8.5. USB Test Mode -------------------------------------------44
9 Service Mode -----------------------------------------------------49
9.1. How to Clear User Setting------------------------------49
9.2. Copying Phonebook Items when Repairing -------50
9.3. Handset Operation Using the Direct
9.2. Copying Phonebook Items when Repairing -------50
9.3. Handset Operation Using the Direct
Commands for IP Settings -----------------------------52
9.4. Web User Interface --------------------------------------53
9.5. IP Reset-----------------------------------------------------58
9.6. How to Change MAC Address Label
9.5. IP Reset-----------------------------------------------------58
9.6. How to Change MAC Address Label
(Procedure after Replacing the Main
P.C.Board of Base Unit)---------------------------------59
P.C.Board of Base Unit)---------------------------------59
10 Troubleshooting Guide ----------------------------------------61
10.1. Troubleshooting Flowchart -----------------------------61
10.2. Failure Analysis of DSP, FLASH ROM and
10.2. Failure Analysis of DSP, FLASH ROM and
RAM (Base Unit)------------------------------------------83
11 Disassembly and Assembly Instructions ---------------88
11.1. Disassembly Instructions -------------------------------88
11.2. How to Replace the Handset LCD -------------------91
11.2. How to Replace the Handset LCD -------------------91
12 Measurements and Adjustments---------------------------93
12.1. Things to Do after Replacing IC ----------------------93
12.2. Base Unit Reference Drawing-------------------------94
12.3. Handset Reference Drawing---------------------------95
12.4. Frequency Table ------------------------------------------96
12.2. Base Unit Reference Drawing-------------------------94
12.3. Handset Reference Drawing---------------------------95
12.4. Frequency Table ------------------------------------------96
13 Miscellaneous ----------------------------------------------------97
13.1. Explanation of IC Terminals (RF Part)---------------97
13.2. How to Replace the Flat Package IC ----------------98
13.3. How to Replace the Shield Case ------------------- 100
13.4. Terminal Guide of the ICs, Transistors and
13.2. How to Replace the Flat Package IC ----------------98
13.3. How to Replace the Shield Case ------------------- 100
13.4. Terminal Guide of the ICs, Transistors and
Diodes ----------------------------------------------------- 104
14 Schematic Diagram ------------------------------------------- 105
14.1. For Schematic Diagram ------------------------------ 105
14.2. Schematic Diagram (Base Unit_Main_DSP
14.2. Schematic Diagram (Base Unit_Main_DSP
Block) ----------------------------------------------------- 106
14.3. Schematic Diagram (Base Unit_Main_LAN
Part) ------------------------------------------------------- 108
14.4. Schematic Diagram (Base Unit_Main_Power) - 109
14.5. Schematic Diagram (Base Unit_RF Part)---------110
14.6. Schematic Diagram (Handset_Main) --------------112
14.7. Schematic Diagram (Handset_RF Part)-----------114
14.8. Schematic Diagram (Charger Unit)-----------------116
14.5. Schematic Diagram (Base Unit_RF Part)---------110
14.6. Schematic Diagram (Handset_Main) --------------112
14.7. Schematic Diagram (Handset_RF Part)-----------114
14.8. Schematic Diagram (Charger Unit)-----------------116
15 Printed Circuit Board -----------------------------------------117
15.1. Circuit Board (Base Unit_Main) ---------------------117
15.2. Circuit Board (Base Unit_RF Part)------------------119
15.3. Circuit Board (Handset_Main) ---------------------- 121
15.4. Circuit Board (Handset_RF Part) ------------------ 123
15.5. Circuit Board (Charger Unit)------------------------- 124
15.2. Circuit Board (Base Unit_RF Part)------------------119
15.3. Circuit Board (Handset_Main) ---------------------- 121
15.4. Circuit Board (Handset_RF Part) ------------------ 123
15.5. Circuit Board (Charger Unit)------------------------- 124
16 Exploded View and Replacement Parts List --------- 125
16.1. Cabinet and Electrical Parts (Base Unit) --------- 125
16.2. Cabinet and Electrical Parts (Handset)----------- 126
16.3. Cabinet and Electrical Parts (Charger Unit) ----- 127
16.4. Accessories --------------------------------------------- 128
16.5. Replacement Parts List------------------------------- 129
16.2. Cabinet and Electrical Parts (Handset)----------- 126
16.3. Cabinet and Electrical Parts (Charger Unit) ----- 127
16.4. Accessories --------------------------------------------- 128
16.5. Replacement Parts List------------------------------- 129
4
KX-TGP500B09/KX-TPA50B09
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer's Instructions.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer's Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700
°F ± 20° F (370°C ± 10°C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
