DOWNLOAD Panasonic TH-152UX1 / TH-152UX1W / TH-152UX1C Service Manual ↓ Size: 9.8 MB | Pages: 127 in PDF or view online for FREE

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TH-152UX1 / TH-152UX1W / TH-152UX1C

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the

wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight

out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed metal-
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to 
the chassis, the reading must be

.

Figure 1

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15

µF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,
as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-

tivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the volt-

age at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a measure-
ment is outside of the limits specified, there is a possibility
of a shock hazard, and the equipment should be repaired
and rechecked before it is returned to the customer.

Please use the safty equipment (protection cap, gloves, safety
shoes, and stepladder, etc.) when you work in the height where
height is 2m or more. 

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TH-152UX1 / TH-152UX1W / TH-152UX1C

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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TH-152UX1 / TH-152UX1W / TH-152UX1C

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 

°F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 

°F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 

°F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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TH-152UX1 / TH-152UX1W / TH-152UX1C

Customers could select the NANODRIFT SAVER which
reduces image retention OFF in the previous systems, but this
system customers can not select OFF.
If customers simply wants to select OFF, customers can set to
OFF according to the following steps.
However, the image retention cannot be guaranteed in this
case.  

Setup steps to select NANODRIFT SAVER to OFF

1. Press SETUP
2. Select Extended life settings
3. Select Custom Settings
4. Set the cursor to NANODRIFT SAVER and press OK

more than 5 sec

5. YES/NO Screen of OFF selection is displayed.
6. Select YES, then becomes possible to select OFF.

*How to adjust VR by stopping the fan not to operate SOS
When adjustment VR is under the fan, please stop the fan by
following steps and turn adjustment VR. 
*If you disconnect the connectors of the Fan, SOS works,
and the power supply is turn off so you can not adjust it.

Steps to stop the Fan

1. Access the CAT mode and select CD mode.(See 

chap.6.1.) 

2. Change the data of MONITOR-EEPROM Change.

Addr :change [00 01] to [00 A7] by Up/Down buttons
Data :change[**  **] to [** 00] by [8],[0] buttons

3. Select ID Mode (See chap.6.1.5.) and after ID Mode dis-

played, turn off the SW of the unit and then turn on again.

4. The unit will start with the Fan stopped, and then adjust

VR.

After VR adjustment is finnished, change MONITOR-
EEPROM Change to the former value.(See step 2)
Addr :change [00 01] to [00 A7] by Up/Down buttons
Data :change [00 00] to [00 01] by [8],[0] buttons
Select ID Mode (See chap.6.1.5.) and after ID Mode dis-
played, turn off the SW of the unit and then turn on again.
 Check that the unit will start and the Fan works.

SCU and SCD boards should be replaced at the same time.

SSU and SSD boards should be replaced at the same time.