DOWNLOAD Sony CDX-605 / XDC-40 (serv.man2) Service Manual ↓ Size: 1.93 MB | Pages: 34 in PDF or view online for FREE

Model
CDX-605 XDC-40 (serv.man2)
Pages
34
Size
1.93 MB
Type
PDF
Document
Service Manual
Brand
Device
Car Audio
File
cdx-605-xdc-40-sm2.pdf
Date

Sony CDX-605 / XDC-40 (serv.man2) Service Manual ▷ View online

– 15 –
SECTION  6
ELECTRICAL  ADJUSTMENTS
Note:
1.
Perform adjustments as given.
2.
Be sure to use the disc “YEDS-18” parts code: 3-702-101-01, but
only when indicated.
3.
Power supply voltage: DC14.4 V (more than 3A).
• FOCUS  BIAS  CHECK
[RF  BOARD]  – Conductor Side –
Procedure:
1. Connect the oscilloscope to RF board test point RF.
2. Put the set into play mode by loading the disc.
3. Confirm that oscilloscope waveform is clear and check RF
signal level is correct or not.
Note:
Clear RF signal waveform means that the shape “≈” can be clearly distin-
guished at the center of the waveform.
• TRACKING  OFFSET  CHECK
[RF  BOARD]  – Conductor Side –
Procedure:
1. Connect the oscilloscope to RF board bridge point TE.
2. Put the set into play mode by loading the disc.
3. Press the 
= AMS + button, then, check the traverse wave-
form.
4. Confirm that the oscilloscope waveform is symmetrical on the
top and bottom in relation to 0 V dc, and check this level.
* Traverse waveform: This is the tracking error wave form
appears when crossing the track.
TP
(VC)
IC11
IC51
CNJ12
TP (RF)
oscilloscope
+
RF signal waveform
VOLT/DIV: 200 mV
TIME/DIV: 500 nsec
level: 1.4 
±
 0.3 Vp-p
TP
(VC)
IC11
IC51
CNJ12
BP11
(TE)
oscilloscope
+
A
0 V
A=B
traverse waveform
(100 track jump waveform)
VOLT/DIV : 500 mV
TIME/DIV : 2 msec
Center : 0 V
– 16 –
• FOCUS  GAIN  ADJUSTMENT
  (COARSE  ADJUSTMENT)
This adjustment is to be performed when replacing the following
parts.
• Optical Pick-up Block
• RV14
[RF  BOARD]  – Conductor Side –
Procedure:
1. Set RV14 (RF board) to the standard position.
2. Check that there is not an abnormal amount of operation noise
(white noise) from the 2-axis devise. If there is, turn RV14
slightly clockwise.
[RF  BOARD]  – Conductor Side –
• When gain is lowered...
The set does not play because of no focus operation.
• When gain is highered...
Operation noise is heard due to a scratch or a dust, then opera-
tion will be unstable.
RV14
IC11
IC51
CNJ12
MIN side
(low gain)
MAX side
(high gain)
RV14 standard position
CDX-605
– 17 –
– 18 –
SECTION  7
DIAGRAMS
7-1.
NOTES  FOR  PRINTED  WIRING  BOARD  AND  SCHEMATIC  DIAGRAM
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
¢
: internal component.
C
: panel designation.
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
r
: Through hole.
¢
: internal component.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
U
: B+ Line.
H
: adjustment for repair.
• Power voltage is dc 14.4V and fed from CD changer con-
troller.
• Voltages and waveforms are dc with respect to ground in
playback mode.
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
Note: The components identified by mark 
!
 or dotted line
with mark 
!
 are critical for safety.
Replace only with part number specified.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
• Waveforms
– RF Section –
1
IC11 
1
 (FEO)
500 mV/DIV, 500 nsec/DIV
2
IC11 
2
 (FEI)
50 mV/DIV, 1 µsec/DIV
3
IC11 
 (TEI)
200 mV/DIV, 500 µsec/DIV
– MAIN Section –
1
IC101 
 (MDP)
2
IC101 
 (LRCK)
3
IC101 
 (BCK)
4
IC302 
 (EXTAL)
5
IC401 
!∞
 (XI)
1.2 Vp-p
Approx. 110 mVp-p
Approx. 280 mVp-p
2.5 Vp-p
7.6 
µ
sec
6 Vp-p
24 
µ
sec
3.3 Vp-p
125 nsec
6 Vp-p
470 nsec
2.4 Vp-p
59 nsec
CDX-605
– 19 –
– 20 –
• Semiconductor
Location
Ref. No.
Location
IC11
C-6
IC51
B-7
IC52
G-4
Q11
D-6
7-2.
PRINTED  WIRING  BOARDS  – RF Section –
(Page 24)
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