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The self-diagnosis function consists of error codes for customers, which are displayed automatically when errors occur,
and error codes, which show the error history in the test mode during servicing. For details on how to view error codes
for the customer, refer to the following box in the instruction manual. For details on how to check error codes during
servicing, refer to the following “Procedure for using the Self-Diagnosis Function (Error History Display Mode)”.

This system has a Self-diagnosis display
function to let you know if there is a system
malfunction. The display shows a code made
up of 3 or 5 letters and a message alternately to
show you the problem. To solve the problem
refer to the following list. If any problem
persists, consult your nearest Sony dealer.

The MD is protected against erasure.

cRemove the MD and slide the tab to close the

slot (see page 18).

You tried to record a CD or MD with a format that
the system does not support, such as a CD-ROM.

cRemove the disc and turn off the system once,

then turn it on again.

Recording could not be performed properly.

cMove the system to a stable place, and start

recording over from the beginning.

The MD is dirty or scratched, or the MD does not
meet the standards.

cReplace the MD and start recording over from

the beginning.

The MD deck cannot read the disc information
properly.

cRemove the MD once, then load it again.

There is a problem with the optical pickup.

cThe optical pickup may have failed. Consult your

nearest Sony dealer.

The MD deck cannot read the disc information
properly.

cReplace the MD.

Erase all the recorded contents of the MD using
All Erase Function (see page 29).

The sound source is a copy of a commercially
available music software, or you tried to record a
CD-R (Recordable CD).

cThe Serial Copy Management System prevents

making a digital copy (see page 48). You cannot
record a CD-R.

This appears momentarily because of the signal of
the digital broadcast during recording.

cThere is no affect on the recorded contents.
No component is connected to the DIGITAL
OPTICAL IN jack, or a digital component is not
connected properly.

cConnect a digital component to the DIGITAL

OPTICAL IN jack properly using a digital
connecting cable (not supplied, see page 43).

The connected digital component is not turned on.

cSee the operating instructions supplied with the

connected component and confirm whether the
component is turned on.

The digital connecting cable connected to the
DIGITAL OPTICAL IN jack is pulled out, or the
connected digital component is turned off during
digital recording.
cConnect the cable, or turn on the digital

component.

There is an error in the internal data that the system
needs in order to operate.

cConsult your nearest Sony dealer.

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2

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4

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7

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9

............................................................... 24

CD Section ...................................................................... 33
MD Section ..................................................................... 34

6-1. NOTE FOR PRINTED WIRING BOARDS AND

SCHEMATIC DIAGRAMS ............................................ 45
– Wave forms ................................................................... 45
– Circuit Boards Location ............................................... 45

6-2. Block Diagram – CD Servo Section – ............................ 46
6-3. Block Diagram – MD Servo Section – ........................... 47
6-4. Block Diagram – MAIN Section – ................................. 48
6-5. Printed Wiring Boards – CD Section – .......................... 49
6-6. Schematic Diagram – CD Section – ............................... 50
6-7. Printed Wiring Board – BD (MD) Board – .................... 51
6-8. Schematic Diagram – BD (MD) Board (1/2) – .............. 52
6-9. Schematic Diagram – BD (MD) Board (2/2) – .............. 53
6-10. Printed Wiring Board – MD DIGITAL Board – ............ 54
6-11. Schematic Diagram – MD DIGITAL Board – ............... 55
6-12. Printed Wiring Board – UCOM Board – ........................ 56
6-13. Schematic Diagram – UCOM Board – ........................... 57
6-14. Printed Wiring Boards – AUDIO Section – .................... 58
6-15. Schematic Diagram – AUDIO Section – ........................ 59
6-16. Printed Wiring Board – PANEL Board – ....................... 60
6-17. Schematic Diagram – PANEL Board – .......................... 61
6-18. Printed Wiring Boards – POWER Section – .................. 62
6-19. Schematic Diagram – POWER Section – ...................... 63
6-20. IC Block Diagrams ......................................................... 64
6-21. IC Pin Function Description ........................................... 68

................................................ 76

.............................. 86

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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the bottom
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

This caution
label is
located inside
the unit.

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

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CD MECHANISM DECK
(TN-CCD1001Z)

STAND

BD (CD) BOARD

UCOM BOARD

CN101

CN204

MD MECHANISM (MDM-7B4M)

MD DIGITAL BOARD

AUDIO BOARD

UCOM BOARD

BD (CD) BOARD

BD (MD) BOARD

CN102

CN102

CN201

CN701

CN103

CN702

CN703

CN601

CN101

CN201

CN204

CN203

PANEL BOARD