Sharp ER-A490 (serv.man2) Service Manual ▷ View online
3) Block diagram
TPRC1 BLOCK DIAGRAM
Fig. 2-8
3) Pin description
Pin
No.
Signal
name
In/Out
Function
1
GND
—
GND
2
GND
—
GND
3
ST1
O
Head drive strobe signal 1
4
GND
—
GND
5
ST2
O
Head drive strobe signal 2
6
ST3
O
Head drive strobe signal 3
7
ST4
O
Head drive strobe signal 4
8
ST5
O
NU
9
ST6
O
NU
10
LATCH
O
Head latch signal
11
GND
—
GND
12
GND
—
GND
13
GND
—
GND
14
SI
I
Data return line, thermalhead -- TPRC1
15
SO
O
Send data from TPRC1 to thermalhead
Data from PB-RAM or zero data are
outputted at the falling of CLOCK signal.
16
Data from PB-RAM or zero data are
outputted at the falling of CLOCK signal.
16
Pin
No.
Signal
name
In/Out
Function
16
CLOCK
O
Thermalhead CLOCK signal
SO is outputted at the edge of I Ä O, and
is taken at the edge of o Ä I.
SO is outputted at the edge of I Ä O, and
is taken at the edge of o Ä I.
17
INHDEC
I
GND
18
CSEN
I
GND
19
TEST2
I
+5V internal counter timer test pin
20
Vcc
—
+5V
21
Vcc
—
+5V
22
Vcc
—
+5V
23
Vcc
—
+5V
24
TEST1
I
+5V internal counter timer test pin
25
D0
I/O
Data bus 0: Internal register, print buffer
data IO
data IO
26
D1
I/O
Data bus 1: Internal register, print buffer
data IO
data IO
27
D2
I/O
Data bus 2: Internal register, print buffer
data IO
data IO
28
D3
I/O
DAta bus 3: Internal register, print buffer
data IO
data IO
MOTOR
CONTROL
HEAD
I/F
MISC.
TEST
CIRCUIT
CUTTER
CONTROL
PB I/F UNIT
SYSTEM
I/F
PORT
PDCTLU
DECODEK UNIT
HEAD CONTROL
TIMER UNIT
MOTOR CONTROL
TIMER UNIT
CUTTER CONTROL
TIMER UNIT
CLOCK
GEN.
IN
T
E
RRUP
T
CI
RC
U
IT
H
O
ST
BU
S
I/
F
U
N
IT
INHBEC
CSEN
CGS
RD,WR
A0~23
D0~7
WO
WI
INT
INTI
PHAI
(
(
Φ)
BD0~7
BA0~15
BRAS,BRAS
BRD,BWR
RES
POF,INH
POP,PHUP,PFP,PCRES
PTRM,PTJM
CLOCK,SO,ST1~5,HCO
SI
EBAK,EPEQ
EBRK,EACK
RVPON,JVPON,
RAS,RBS,RCS,RDS,
JAS,JBD,JCS,JDS
TEST1,TEST2
CTAO,CTBO
20
Pin
No.
Signal
name
In/Out
Function
29
D4
I/O
Data bus 4: Internal register, print buffer
data IO
data IO
30
GND
—
GND
31
GND
—
GND
32
GND
—
GND
33
D5
I/O
Data bus 5: Internal register, print buffer
data IO
data IO
34
D6
I/O
Data bus 6: Internal register, print buffer
data IO
data IO
35
D7
I/O
Data bus 7: Internal register, print buffer
data IO
data IO
36
A0
I
Address bus 0
37
A1
I
Address bus 1
38
A2
I
Address bus 2
39
TPRCRQ2
—
Request signal
40
INTI
I
+5V
41
WI
I
+5V
42
BACK
I
BACK
43
A3
I
Address bus 3
44
A4
I
Address bus 4
45
A5
I
Address bus 5
46
A6
I
Address bus 6
47
A7
I
Address bus 7
48
A8
I
Address bus 8
49
A9
I
Address bus 9
50
GND
—
GND
51
GND
—
GND
52
GND
—
GND
53
A10
I
Address bus 10
54
A11
I
Address bus 11
55
A12
I
Address bus 12
56
A13
I
Address bus 13
57
A14
I
Address bus 14
58
A15
I
Address bus 15
59
A16
I
Address bus 16
60
Vcc
—
+5V
61
Vcc
—
+5V
62
Vcc
—
+5V
63
A17
I
Address bus 17
64
A18
I
Address bus 18
65
A19
I
Address bus 19
66
A20
I
Address bus 20
67
A21
I
Address bus 21
68
A22
I
Address bus 22
69
A23
I
Address bus 23
70
GND
—
GND
71
GND
—
GND
72
RD
I
Read strobe signal: Gate enable of data
bus D0 - D7 tri-state buffer
bus D0 - D7 tri-state buffer
73
WR
I
Write strobe signal: Write enable into the
internal register and the print buffer.
internal register and the print buffer.
74
AS
I
AS
75
POF
I
Power off signal
Pin
No.
Signal
name
In/Out
Function
76
INT
O
Interrupt signal
77
WO
O
Wait request signal to the CPU
78
INH
I
Head drive inhibit
79
BREQ
O
Bus request to CPU
80
—
—
NU
81
EBREQ
I
Bus request from option
82
EBACK
O
Bus acknolege to option
83
RPE
I
Receipt paper empty
84
JPE
I
Journal paper empty
85
PHUP
I
Printer head up
86
PCRES
I
Auto cutter unit reset signal input
87
PFP
I
Auto cutter unit FP signal input
88
RVPON
O
Receipt side paper feed pulse motor
common power control signal
common power control signal
89
GND
—
GND
90
GND
—
GND
91
GND
—
GND
92
JVPON
O
Journal side paper feed pulse motor
common power control signal (Not use)
common power control signal (Not use)
93
VHCOM
O
Head drive common power control
94
CTBO
O
Cutter motor control signal
95
CTAO
O
Cutter motor control signal
96
RDS
O
Receipt side paper feed pulse motor
drive signal, phase D
drive signal, phase D
97
RCS
O
Receipt side paper feed pulse motor
drive signal, phase C
drive signal, phase C
98
GND
—
GND
99
Vcc
—
+5V
100
Vcc
—
+5V
101
Vcc
—
+5V
102
Vcc
—
+5V
103
Vcc
—
+5V
104
RBS
O
Receipt side paper feed pulse motor
drive signal, phase B
drive signal, phase B
105
RAS
O
Receipt side paper feed pulse motor
drive signal, phase A
drive signal, phase A
106
JDS
O
Journal side paper feed pulse motor
drive signal, phase D
drive signal, phase D
107
JCS
O
Journal side paper feed pulse motor
drive signal, phase C
drive signal, phase C
108
JBS
O
Journal side paper feed pulse motor
drive signal, phase B
drive signal, phase B
109
JAS
O
Journal side paper feed pulse motor
drive signal, phase A
drive signal, phase A
110
GND
—
GND
111
GND
—
GND
112
GND
—
GND
113
CGS
O
NU
114
BWR
O
PB-RAM write strobe signal
115
BRD
O
PB-RAM read strobe signal
116
BA15
O
NU
117
BA14
O
Address 14 for PB-RAM
118
BA13
O
Address 13 for PB-RAM
119
PTRM
I
NU
21
Pin
No.
Signal
name
In/Out
Function
120
PTJM
I
NU
121
GND
—
GND
122
GND
—
GND
123
POPI
O
GND
124
BA12
O
Address bus 12 for PB-RAM
125
BA11
O
Address bus 11 for PB-RAM
126
BA10
O
Address bus 10 for PB-RAM
127
BA9
O
Address bus 9 for PB-RAM
128
BA8
O
Address bus 8 for PB-RAM
129
BA7
O
Address bus 7 for PB-RAM
130
GND
—
GND
131
GND
—
GND
132
GND
—
GND
133
BA6
O
Address bus 6 for PB-RAM
134
BA5
O
Address bus 5 for PB-RAM
135
BA4
O
Address bus 4 for PB-RAM
136
BA3
O
Address bus 3 for PB-RAM
137
BA2
O
Address bus 2 for PB-RAM
138
BA1
O
Address bus 1 for PB-RAM
139
PHAI
I
TPRC1 clock input pin
140
Vcc
—
+5V
141
Vcc
—
+5V
142
Vcc
—
+5V
143
BA0
O
Address bus 0 for PB-RAM
144
BD7
I/O
Data bus 7 for PB-RAM
145
BD6
I/O
Data bus 6 for PB-RAM
146
BD5
I/O
Data bus 5 for PB-RAM
147
GND
—
GND
148
BD4
I/O
Data bus 4 for PB-RAM
149
BD3
I/O
Data bus 3 for PB-RAM
150
GND
—
GND
151
GND
—
GND
152
GND
—
GND
153
BD2
I/O
Data bus 2 for PB-RAM
154
BD1
I/O
Data bus 1 for PB-RAM
155
BD0
I/O
Data bus 0 for PB-RAM
156
BRAS
O
PB-RAM chip select: Active HIGH
157
BRAS
O
PB-RAM chip select: Active LOW
158
RESET
I
TPRC1 reset signal
159
GND
—
GND
160
NU
—
GND
3. Clock generator
1) CPU (HD64151010FX)
Fig. 3-1
Basic clock is supplied from a 19.6MHz ceramic oscillator.
The CPU contains an oscillation circuit from which the basic clock is
internally driven. If the CPU was not operating properly, the signal
does not appear on this line in most cases.
The CPU contains an oscillation circuit from which the basic clock is
internally driven. If the CPU was not operating properly, the signal
does not appear on this line in most cases.
2) MPCA6
X2: 7.37 MHz is IR communication clock.
3) HD404728A91FS CKDC6 oscillation circuit
(Display-PWB)
Fig. 3-2
Two oscillators are connected to the CKDC6.
The main clock X1 generates 4.19MHz which is used during power
on.
When power is turned off, the CKDC6 goes into the standby mode
and the main clock stops.
The sub-clock X2 generates 32.768KHz which is primarily used to
update the internal RTC (real time clock). During the standby mode, it
keeps oscillating to update the clock and monitoring the power recov-
ery.
The main clock X1 generates 4.19MHz which is used during power
on.
When power is turned off, the CKDC6 goes into the standby mode
and the main clock stops.
The sub-clock X2 generates 32.768KHz which is primarily used to
update the internal RTC (real time clock). During the standby mode, it
keeps oscillating to update the clock and monitoring the power recov-
ery.
CPU
(HD64151010FX)
99
98
XTAL
EXTAL
19.6MHz
X1
101
PHAI
105
104
DX2
DX1
MPCA6
R67
R68
X2
7.37MHz
7.37MHz
PHAI
43
46
45
15PCH
15PCH
HD404728A91FS
C8
C9
CKDC 6
OSC1
R11
1M
1M
X7
4.19MHz
4.19MHz
CL2
CL1
X2
32.768KHz
32.768KHz
2
1
3
42
OSC2
22
4. Reset (POFF) circuit
Fig. 4-1
In order to prevent memory loss at a time of power off and power
supply failure of the ECR, the power supply condition is monitored at
all times. When a power failure is met, the CPU suspends the execu-
tion of the current program and immediately executes the power-off
program to save the data in the CPU registers in the external S-RAM
with the signal STOP forced low to prepare for the power-off situation.
The signal STOP is supplied to the CKDC6 as signal RESET to reset
the devices.
This circuit monitors +24V supply voltage.
The voltage at the (–) pin of the comparator GL393 is always main-
tained to 5.1V by means of the zener diode ZD1, while +24V supply
voltage is divided through the resistors R72, R73, and R77, and is
applied to the (+) pin. When normal +24V is in supply, 6.8V is sup-
plied to the (+) pin, therefore, signal POFF is at a high level. When
+24V supply voltage decreases due to a power off or any other rea-
son, the voltage at the (+) pin also decreases. When +24V supply
voltage drops, the voltage at the (+) pin drops below +5.1V, which
causes POFF to go low, thus predicting the power-off situation.
supply failure of the ECR, the power supply condition is monitored at
all times. When a power failure is met, the CPU suspends the execu-
tion of the current program and immediately executes the power-off
program to save the data in the CPU registers in the external S-RAM
with the signal STOP forced low to prepare for the power-off situation.
The signal STOP is supplied to the CKDC6 as signal RESET to reset
the devices.
This circuit monitors +24V supply voltage.
The voltage at the (–) pin of the comparator GL393 is always main-
tained to 5.1V by means of the zener diode ZD1, while +24V supply
voltage is divided through the resistors R72, R73, and R77, and is
applied to the (+) pin. When normal +24V is in supply, 6.8V is sup-
plied to the (+) pin, therefore, signal POFF is at a high level. When
+24V supply voltage decreases due to a power off or any other rea-
son, the voltage at the (+) pin also decreases. When +24V supply
voltage drops, the voltage at the (+) pin drops below +5.1V, which
causes POFF to go low, thus predicting the power-off situation.
The STOP signal from the CPU is converted into the RESETS signal
by the CKDC6.
The RESETS signal from the CKDC6 is converted into the RESET
signal at the gate backed-up by the VRAM power, performing the
system reset.
by the CKDC6.
The RESETS signal from the CKDC6 is converted into the RESET
signal at the gate backed-up by the VRAM power, performing the
system reset.
5. Memory control
1) Memory map
1
All range memory map
Fig. 5-1
(
*
1)
“Internal I/O” means the registers in the H8/510.
(
*
2)
“External I/O” means the base system I/O area to be ad-
dressed in page 0.
dressed in page 0.
(
*
3)
"Memory image area" means the lower 32KB of ROM area
which is projected to 000000H ~ 007FFFH for allowing reset
start and other vector addressing, or the lower 32KB of ROM
area which is projected to 008000H ~ 00FE7FH for allowing 0
page addressing of work RAM area.
which is projected to 000000H ~ 007FFFH for allowing reset
start and other vector addressing, or the lower 32KB of ROM
area which is projected to 008000H ~ 00FE7FH for allowing 0
page addressing of work RAM area.
(
*
4)
“Expansion I/O” means expansion I/O device area which isad-
dressed to area other than page 0.
dressed to area other than page 0.
2
0 page memory map
+
-
/POFF
3
2
1
4
8
B
IC18A
GL393
C103
1000P
D1
1SS133
C102
1µ 50V
+
ZD1
MTZ5.1A
R77
9.1KG
R73
15KG
R76
56K
R74
2.7K
R75
2.7K
R72
8.2KG
+24V
+5V
POFF
CPU
72
IRQ0
89
RESET (FROM CKDC 6)
STOP (TO CKDC 6)
MPCA6
13
48
1
IRQ
0
54
INT
0
RESETS
STOP
CKDC6
RAS3
3-1C
4
5
6
IC10B
74HC00S
74HC00S
VRAM
/(RAS3./RESET)
/RESET
1
2
3
IC10A
74HC00S
74HC00S
VRAM
V RA M
C86
1000P
1000P
C87
1000P
1000P
R64
10K
C85
1000P
1000P
12
13
11
14
IC10D
74HC00S
74HC00S
14
14
Internal I/O
External I/O
Memory image area
External I/O
Memory image area
(*1)
(*2)
(*3)
(*2)
(*3)
RAM area
(10M byte)
(10M byte)
ROM area
(3M byte)
(3M byte)
Expansion I/O area (1M byte)
000000H
1C0000H
C00000H
FFFFFFH
000000H
004000H
008000H
00FFFFH
1FFFFFH
ROM image area
32KB
32KB
RAM image area
slightly smaller than32KB
slightly smaller than32KB
NOT USE
00F800H
00FE80H
00FF80H
00FFFFH
RAM image area
Internal I/O area
External I/O area
(0 page)
(0 page)
1BFFFFH
RAM area
23
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