Panasonic TH-55LFE8W / TH-55LFE8U / TH-55LFE8C / TH-55LFE8E Service Manual ▷ View online
5
PREFACE
5
TH-50LFC70U/TH-50LFC70W
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
to damage an ES device).
2. Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive
(ES) Devices
(ES) Devices
6
PREFACE
6
TH-50LFC70U/TH-50LFC70W
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
2.2. About lead free solder (PbF)
7
PREFACE
3. Specifications
English
82
Specifications
Model No.
43-inch model : TH-43LFE8U
48-inch model : TH-48LFE8U
55-inch model : TH-55LFE8U
65-inch model : TH-65LFE8U
43-inch model : TH-43LFE8E
48-inch model : TH-48LFE8E
55-inch model : TH-55LFE8E
65-inch model : TH-65LFE8E
Power Consumption
TH-43LFE8U: 135 W
TH-48LFE8U: 150 W
TH-55LFE8U: 170 W
TH-65LFE8U: 160 W
TH-43LFE8E: 135 W
TH-48LFE8E: 150 W
TH-55LFE8E: 170 W
TH-65LFE8E: 160 W
TH-48LFE8U: 150 W
TH-55LFE8U: 170 W
TH-65LFE8U: 160 W
TH-43LFE8E: 135 W
TH-48LFE8E: 150 W
TH-55LFE8E: 170 W
TH-65LFE8E: 160 W
Power off condition
0.3 W
Stand-by condition
0.5 W
LCD Display panel
43-inch model
43-inch VA panel (LED backlight), 16:9 aspect ratio
48-inch model
48-inch VA panel (LED backlight), 16:9 aspect ratio
55-inch model
55-inch IPS panel (LED backlight), 16:9 aspect ratio
65-inch model
65-inch VA panel (LED backlight), 16:9 aspect ratio
43-inch VA panel (LED backlight), 16:9 aspect ratio
48-inch model
48-inch VA panel (LED backlight), 16:9 aspect ratio
55-inch model
55-inch IPS panel (LED backlight), 16:9 aspect ratio
65-inch model
65-inch VA panel (LED backlight), 16:9 aspect ratio
Screen size
43-inch model
940 mm (W) × 529 mm (H) × 1 079 mm (diagonal) /
37.0” (W) × 20.8” (H) × 42.5” (diagonal)
48-inch model
1 054 mm (W) × 592 mm (H) × 1 209 mm (diagonal) /
41.4” (W) × 23.3” (H) × 47.6” (diagonal)
55-inch model
1 209 mm (W) × 680 mm (H) × 1 387 mm (diagonal) /
47.6” (W) × 26.7” (H) × 54.6” (diagonal)
940 mm (W) × 529 mm (H) × 1 079 mm (diagonal) /
37.0” (W) × 20.8” (H) × 42.5” (diagonal)
48-inch model
1 054 mm (W) × 592 mm (H) × 1 209 mm (diagonal) /
41.4” (W) × 23.3” (H) × 47.6” (diagonal)
55-inch model
1 209 mm (W) × 680 mm (H) × 1 387 mm (diagonal) /
47.6” (W) × 26.7” (H) × 54.6” (diagonal)
65-inch model
1 428 mm (W) × 803 mm (H) × 1 638 mm (diagonal) /
56.2” (W) × 31.6” (H) × 64.5” (diagonal)
1 428 mm (W) × 803 mm (H) × 1 638 mm (diagonal) /
56.2” (W) × 31.6” (H) × 64.5” (diagonal)
(No. of pixels)
2 073 600 (1 920 (W) × 1 080 (H))
Dimensions (W × H × D)
43-inch model
969 mm × 560 mm × 61 mm /
38.2” × 22.1” × 2.4”
48-inch model
1 082 mm × 624 mm × 62 mm /
42.6” × 24.6” × 2.5”
55-inch model
1 239 mm × 712 mm × 62 mm /
48.8” × 28.0” × 2.5”
65-inch model
1 451 mm × 829 mm × 62 mm /
57.2” × 32.7” × 2.5”
969 mm × 560 mm × 61 mm /
38.2” × 22.1” × 2.4”
48-inch model
1 082 mm × 624 mm × 62 mm /
42.6” × 24.6” × 2.5”
55-inch model
1 239 mm × 712 mm × 62 mm /
48.8” × 28.0” × 2.5”
65-inch model
1 451 mm × 829 mm × 62 mm /
57.2” × 32.7” × 2.5”
Mass
43-inch model
approx. 8.7 kg / 19.2 lbs net
48-inch model
approx. 11.5 kg / 25.4 lbs net
55-inch model
approx. 16.0 kg / 35.3 lbs net
65-inch model
approx. 36.2 kg / 79.9 lbs net
approx. 8.7 kg / 19.2 lbs net
48-inch model
approx. 11.5 kg / 25.4 lbs net
55-inch model
approx. 16.0 kg / 35.3 lbs net
65-inch model
approx. 36.2 kg / 79.9 lbs net
Power source
TH-43/48/55/65LFE8U:
110 - 127 V AC, 50/60 Hz
TH-43/48/55/65LFE8E:
220 - 240 V AC, 50/60 Hz
Operating condition
Temperature
0 °C to 40 °C (32 °F to 104 °F)
*
1
Humidity
20 % to 80 % (no condensation)
8
PREFACE
83
English
Storing condition
Temperature
-20 °C to 60 °C (-4 °F to 140 °F)
Humidity
20 % to 80 % (no condensation)
Connection terminals
HDMI 1
HDMI 2
HDMI 2
TYPE A Connector ×
2
*
2
Audio signal:
Linear PCM (sampling frequencies - 48 kHz,
44.1 kHz, 32 kHz)
DVI-D IN
DVI-D 24 Pin:
Compliance with DVI Revision 1.0
Content Protection:
Compatible with HDCP 1.1
PC IN
High-Density Mini D-sub 15 Pin:
Compatible with DDC2B
Y/G:
1.0 Vp-p (75 Ω) (with sync)
0.7 Vp-p (75 Ω) (without sync)
0.7 Vp-p (75 Ω) (without sync)
P
B
/C
B
/B:
0.7 Vp-p (75 Ω)
P
R
/C
R
/R:
0.7 Vp-p (75 Ω)
HD/VD:
1.0 - 5.0 Vp-p (high impedance)
VIDEO
Audio/Video 4-pole mini jack (M3) (see page 19)
AUDIO IN
Stereo mini jack (M3) 0.5 Vrms
Shared with DVI-D IN and PC IN
Shared with DVI-D IN and PC IN
AUDIO OUT
Stereo mini jack (M3) 0.5 Vrms
Output: Variable (-∞ to 0 dB)
Output: Variable (-∞ to 0 dB)
(1 kHz 0 dB input, 10 kΩ load)
SERIAL IN
External Control Terminal
D-sub 9 Pin:
D-sub 9 Pin:
RS-232C compatible
LAN
For RJ45 network connections,
compatible with PJLink
Communication method:
compatible with PJLink
Communication method:
RJ45 10BASE-T/100BASE-TX
IR IN
Mini jack (M3)
IR OUT
Mini jack (M3)
USB
5V DC / 1A (USB 3.0 is not supported.)
Sound
Speakers
43/48/55-inch models:
80 mm × 30 mm × 2 pcs
65-inch model:
96 mm × 27 mm × 2 pcs
80 mm × 30 mm × 2 pcs
65-inch model:
96 mm × 27 mm × 2 pcs
Audio Output
20 W [10 W + 10 W] (10 % THD)
Remote Control Transmitter
Power source
3 V DC (battery (AAA/R03/UM4 type) × 2)
Operating range
Approx. 7 m (22.9 ft)
(when operated directly in front of receptor)
(when operated directly in front of receptor)
Mass
Approx. 63 g / 2.22 ozs (including batteries)
Dimensions (W × H × D)
44 mm × 106 mm × 20.5 mm /
1.74” × 4.18” × 0.81”
*1: Environmental temperature to use this unit at
high altitudes (1 400m (4 593 ft) and higher and
below 2 800 m (9 186 ft) above sea level): 0 °C to
35 °C (32 °F to 95 °F)
*2
*2
: VIERA LINK is not supported.
Note
●
Design and specifications are subject to change
without notice. Mass and dimensions shown are
approximate.
●
This equipment complies with the EMC standards
listed below.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.
TYPE A USB connector
Video: 1.0 Vp-p (75 Ω)
Audio: 0.5 Vrms
Audio: 0.5 Vrms
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