DOWNLOAD Panasonic TH-55LF80U / TH-55LF80W (serv.man2) Service Manual ↓ Size: 6.54 MB | Pages: 56 in PDF or view online for FREE

Model
TH-55LF80U TH-55LF80W (serv.man2)
Pages
56
Size
6.54 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / FULL HD LCD DISPLAY
File
th-55lf80u-th-55lf80w-sm2.pdf
Date

Panasonic TH-55LF80U / TH-55LF80W (serv.man2) Service Manual ▷ View online

5
PREFACE
<55LF80>
5
TH-50LFC70U/TH-50LFC70W
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
2. Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive
(ES) Devices
6
PREFACE
<55LF80>
6
TH-50LFC70U/TH-50LFC70W
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol 
PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
2.2. About lead free solder (PbF)
7
PREFACE
<55LF80>
3. Specifications
English
100
Specifications
Model No.
Power Consumption
42-inch model
145 W (LF8)
155 W (LF80)
49-inch model
160 W (LF8)
175 W (LF80)
55-inch model
185 W (LF8)
190 W (LF80)
Power off condition
0.3 W
Stand-by condition
0.5 W
LCD Display panel
42-inch model
42-inch IPS panel (Edge LED backlight), 16:9 aspect 
ratio
49-inch model
49-inch IPS panel (Edge LED backlight), 16:9 aspect 
ratio
55-inch model
55-inch IPS panel (Edge LED backlight), 16:9 aspect 
ratio
Screen size
42-inch model
927 mm (W) × 521 mm (H) × 1 064 mm (diagonal) /  
36.5” (W) × 20.5” (H) × 41.9” (diagonal)
49-inch model
1 073 mm (W) × 604 mm (H) × 1 232 mm (diagonal) /  
42.2” (W) × 23.7” (H) × 48.5” (diagonal)
55-inch model
1 209 mm (W) × 680 mm (H) × 1 387 mm (diagonal) /  
47.6” (W) × 26.7” (H) × 54.6” (diagonal)
(No. of pixels)
2 073 600 (1 920 (W) × 1 080 (H))
Dimensions (W × H × D)
42-inch model
947 mm × 541 mm × 72 mm (57 mm: without 
handles) /  
37.3” × 21.3” × 2.8” (2.3”: without handles)
49-inch model
1 093 mm × 623 mm × 72 mm (57 mm: without 
handles) /  
43.1” × 24.6” × 2.8” (2.3”: without handles)
55-inch model
1 229 mm × 699 mm × 72 mm (57 mm: without 
handles) /  
48.4” × 27.6” × 2.8” (2.3”: without handles)
Mass
42-inch model
approx. 15.3   / 33.8 lbs net
49-inch model
approx. 19   / 41.9 lbs net
55-inch model
approx. 24.7   / 54.5 lbs net
Power source
TH-42/49/55LF8-80U      110 - 127 V AC, 50/60 Hz 
TH-42/49/55LF8-80W     220 - 240 V AC, 50/60 Hz
Operating condition
Temperature
0 °C to 40 °C (32 °F to 104 °F)*
1
Humidity
20 % to 80 % (no condensation)
Storing condition
Temperature
-20 °C to 60 °C (-4 °F to 140 °F)
Humidity
20 % to 80 % (no condensation)
: TH-42LF8W 
: TH-49LF8W
: TH-55LF8W  
  : TH-42LF80W  
  : TH-49LF80W 
  : TH-55LF80W
42-inch model
: TH-42LF8U
49-inch model
: TH-49LF8U
55-inch model
: TH-55LF8U
42-inch model
: TH-42LF80U
49-inch model
: TH-49LF80U
55-inch model
: TH-55LF80U
8
PREFACE
<55LF80>
101
English
Connection terminals
HDMI 1
HDMI 2
TYPE A Connector*
2
 × 2
Audio signal:
Linear PCM (sampling frequencies - 48 kHz, 
44.1 kHz, 32 kHz)
DVI-D IN
DVI-D 24 Pin:
Compliance with DVI Revision 1.0
Content Protection:
Compatible with HDCP 1.1
DVI-D OUT
DVI-D 24 Pin:
Compliance with DVI Revision 1.0
Content Protection:
Compatible with HDCP 1.1
COMPONENT/RGB IN
Y/G
BNC terminal 1.0 Vp-p (75 Ω ) (with sync)
P
B
/C
B
/B
BNC terminal 0.7 Vp-p (75 Ω ) (without sync)
P
R
/C
R
/R
BNC terminal 0.7 Vp-p (75 Ω ) (without sync)
VIDEO IN
VIDEO
BNC terminal 1.0 V [p-p] (75 Ω )
Also used as Y/G terminal
PC IN
High-Density Mini D-sub 15 Pin:
Compatible with DDC2B
Y/G:
1.0 Vp-p (75 Ω) (with sync)
0.7 Vp-p (75 Ω) (without sync)
P
B
/C
B
/B:
0.7 Vp-p (75 Ω) (without sync)
P
R
/C
R
/R:
0.7 Vp-p (75 Ω) (without sync)
HD/VD:
1.0 - 5.0 Vp-p (high impedance)
AUDIO1 IN
Stereo mini jack (M3) 0.5 Vrms
Shared with DVI-D IN and PC IN
AUDIO2 IN
Stereo mini jack (M3) 0.5 Vrms
Shared with COMPONENT/RGB IN and VIDEO IN
AUDIO OUT
Stereo mini jack (M3) 0.5 Vrms
Output: Variable (-∞ to 0 dB)  
(1 kHz 0 dB input, 10 kΩ load)
SERIAL IN
External Control Terminal
D-sub 9 Pin:
RS-232C compatible
SERIAL OUT
External Control Terminal
D-sub 9 Pin:
RS-232C compatible
LAN (LF8 series)
For RJ45 network connections, compatible with 
PJLink
Communication method:
RJ45 10BASE-T/100BASE-TX
DIGITAL LINK/LAN (LF80 series)
For RJ45 network connections, compatible with 
PJLink
Communication method:
RJ45 100BASE-TX
IR IN
Stereo mini jack (M3)
IR OUT
Stereo mini jack (M3)
USB
TYPE A  USB connector
5V DC / 1A (USB 3.0 is not supported.)
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