Panasonic KX-TGJ310RU / KX-TGJ312RU / KX-TGJ320RU / KX-TGJ322RU / KX-TGJA30RU Service Manual ▷ View online
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KX-TGJ310/KX-TGJ312/KX-TGJ320/KX-TGJ322/KX-TGJA30
11.7. RF Specification
11.7.1.
Base Unit
*: Refer to Check Point (Base Unit) (P.39)
11.7.2.
Handset
**: Refer to Check Point (Handset) (P.41)
Item
Value
Refer to -. *
TX Power
18.5 dBm ~ 25 dBm
Check Point (Base Unit) (H)
Modulation
-350 ± 50/+350 ± 50 kHz/div
Check Point (Base Unit) (I)
Frequency Offset
<±20 kHz
Check Point (Base Unit) (J)
RX Sensitivity
< 1000 ppm
Check Point (Base Unit) (K)
Power RAMP
Power RAMP is matching
Check Point (Base Unit) (L)
Item
Value
Refer to -. **
TX Power
19 dBm ~ 25 dBm
Check Point (Handset) (I)
Modulation
-350 ± 50/+350 ± 50 kHz/div
Check Point (Handset) (J)
Frequency Offset
<±20 kHz
Check Point (Handset) (K)
RX Sensitivity
< 1000 ppm
Check Point (Handset) (L)
Power RAMP
Power RAMP is matching
Check Point (Handset) (M)
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KX-TGJ310/KX-TGJ312/KX-TGJ320/KX-TGJ322/KX-TGJA30
11.8. How to Check the Handset Speaker or Receiver
1. Prepare the digital voltmeter, and set the selector knob to ohm meter.
2. Put the probes at the speaker terminals as shown below.
2. Put the probes at the speaker terminals as shown below.
11.9. Frequency Table (MHz)
Note:
Channel No. 10: In the Test Mode on Base Unit and Handset.
BASE UNIT
HANDSET
Channel No
Transmit Frequency
Receive Frequency
Transmit Frequency
Receive Frequency
1
1897.344 1897.344 1897.344 1897.344
2
1895.616 1895.616 1895.616 1895.616
3
1893.888 1893.888 1893.888 1893.888
4
1892.160 1892.160 1892.160 1892.160
5
1890.432 1890.432 1890.432 1890.432
6
1888.704 1888.704 1888.704 1888.704
7
1886.976 1886.976 1886.976 1886.976
8
1885.248
1885.248
1885.248
1885.248
9
1883.520 1883.520 1883.520 1883.520
10
1881.792 1881.792 1881.792 1881.792
Handset speaker (receiver)
Digital Voltmeter
Is the value between
(+) terminal and (–) terminal about 40
(+) terminal and (–) terminal about 40
Ω?
RECEIVER:
Is the value between
(+) terminal and (–) terminal about 8
(+) terminal and (–) terminal about 8
Ω?
NG
NO
OK
YES
Replace the speaker
(receiver).
(receiver).
SPEAKER:
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KX-TGJ310/KX-TGJ312/KX-TGJ320/KX-TGJ322/KX-TGJA30
12 Miscellaneous
12.1. How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description only applies to the model with Shield case.
12.1.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20 °F (370 °C ± 10 °C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608
°F ± 68 °F (320 °C ± 20 °C)
12.1.2.
Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
12.1.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
P.C.Board
IC
Hot Air Desoldering Tool
Tweezers, etc.
P.C.Board
IC
P.C.Board
Hot Air Desoldering Tools
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KX-TGJ310/KX-TGJ312/KX-TGJ320/KX-TGJ322/KX-TGJA30
12.1.4.
How to Install the IC
1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.
Note:
• When placing the IC, the positioning should be done very carefully.
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.
Note:
• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
4. After soldering, confirm there are no short and open circuits with visual inspection.
Solder
Soldering Iron
P.C.Board
Land
IC
Solder
Soldering Iron
P.C.Board
Land
P.C.Board
IC
Hot Air Desoldering Tool
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