Panasonic KX-TG6611RUB / KX-TG6611RUM / KX-TG6611UAB / KX-TG6611UAM / KX-TG6611CAB / KX-TG6611CAM / KX-TG6612CAB / KX-TGA661RUB / KX-TGA661RUM Service Manual ▷ View online
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KX-TG6611RU/KX-TG6611UA/KX-TG6611CA/KX-TG6612CA/KX-TGA661RU
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P.C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
0.3 mm X 100 g
0.6 mm X 100 g
1.0 mm X 100 g
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KX-TG6611RU/KX-TG6611UA/KX-TG6611CA/KX-TG6612CA/KX-TGA661RU
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
• DECT repeater: KX-A405
• Analog telephone connection: Telephone Line
• DECT repeater: KX-A405
Standard:
DECT (Digital Enhanced Cordless
Telecommunications),
GAP (Generic Access Profile)
Telecommunications),
GAP (Generic Access Profile)
Number of channels:
120 Duplex Channels
Frequency range:
1.88 GHz to 1.90 GHz
Duplex procedure:
TDMA (Time Division Multiple Access)
Channel spacing:
1,728 kHz
Bit rate:
1,152 kbit/s
Modulation:
GFSK (Gaussian Frequency Shift Keying)
RF transmission power:
Approx. 10 m W (average power per channel)
Power source (AC Adaptor):
220–240 V AC, 50/60 Hz
Power consumption
Base unit: PNLV226CE0Z
Base unit:
Charger: PNLV226CE0Z
Standby: Approx. 0.4 W
Maximum: Approx. 2.3 W
Charger:
Standby: Approx. 0.1 W
Maximum: Approx. 1.8 W
Maximum: Approx. 2.3 W
Charger:
Standby: Approx. 0.1 W
Maximum: Approx. 1.8 W
Operating conditions:
0
°
C–40
°
C, 20 %–80 % relative air humidity (dry)
Dimensions:
Base unit: Approx. 126 mm x 90 mm x 77 mm
Handset: Approx. 49 mm x 29 mm x 159 mm
Charger: Approx. 73 mm x 76 mm x 43 mm
Handset: Approx. 49 mm x 29 mm x 159 mm
Charger: Approx. 73 mm x 76 mm x 43 mm
Mass (weight):
Base unit: Approx. 140
g
Handset: Approx. 130
g
Charger: Approx. 50
g
Voice coding:
ADPCM 32 kbit/s
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KX-TG6611RU/KX-TG6611UA/KX-TG6611CA/KX-TG6612CA/KX-TGA661RU
4 Technical Descriptions
4.1.
Block Diagram (Base Unit)
Analog
Front
End
To TEL_LINE
Bridge
Rect
D
3
D
D
3
Hook Switch
Q
3
,Q4,Q5
Q
Q
3
,Q
4
,Q
5
Audio
Bell/Caller ID
Interface
CPU
21
2
3
15
17
19
20
14
BELL
HOOK
Off-Hook Line Voltage
1
3
A/D
D/A
ADPCM
Codec Filter
DSP
Speech Encoding
Speech Decoding
BMC
Burst Encoding
Burst Decoding
RF
PLL
5
2
79
9
10
EEPROM
SCL
SDA
45
58
59
To AC Adaptor
To HANDSET
Limit
Resistor
Charge
Detector
Power Failer Mode
Power Supply SW
Q
3
51,IC
3
51
CHARGE(+)
CHARGE(-)
Optional
Optional
DC/DC convertorD
C
/D
C
c
o
n
v
e
rt
o
r
IC2,L
3
,C
3
6,Q602
IC
2
,L
3
,C
3
6
,Q
6
0
2
Q9Q
9
Q8Q
8
2.4V
Reg.
1.8V
Reg.
2.85 V
2.4 V
1.8 V
BBIC
IC401
IC7
KX-TG6611/6612 BLOCK DIA
GRAM
(BASE UNIT)
MOD/DEMOD
Charge
Pump
DCDC
Converter
44
XTAL
X1X
1
10.
3
68
MHz
RX
n
RX
p
TX
p
TX
n
TX
on
RX
on
D801
6
72
ANT1
ANT2
ANT1
ANT2
ANT1
ANT2
78
80
L1
L2
DCP
DCM
3
FLASH MEMORY
IC421
QSPI
FLASH MEMORY
IC4
3
1
43
3
.0V
3
.0V
70
71
71
72
69
69
TAM-CSn
SPI-DI
SPI-DO
SPI-DO
SPICLK
QSPI-CS
DC,DCI
DC-CTRL
DC-SENSE
QSPI-SCK
QSPI-IO 0-3
90,92,
94,96
Q22,Q2
3
R55,R56,
D22
91
95
83
82
82
84
QSPI
Control
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KX-TG6611RU/KX-TG6611UA/KX-TG6611CA/KX-TG6612CA/KX-TGA661RU
4.2.
Circuit Operation (Base Unit)
4.2.1.
Outline
Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).
• DECT BBIC (Base Band IC): IC7
- Handling all the audio, signal and data processing needed in a DECT base unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- PLL Oscillator
- Detector
- Compress/Expander
- First Mixer
- All interfaces (ex: QSPI FLASH MEMORY, EEPROM, LED, Analog Front End, etc.)
- DCDC Converter
- Integrated 1.9GHz PA for DECT
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- PLL Oscillator
- Detector
- Compress/Expander
- First Mixer
- All interfaces (ex: QSPI FLASH MEMORY, EEPROM, LED, Analog Front End, etc.)
- DCDC Converter
- Integrated 1.9GHz PA for DECT
• EEPROM: IC401
- Temporary operating parameters (for RF, etc.)
• Additionally,
- Power Supply Circuit (+3.0 V, +2.4 V, +1.8 V output)
- Crystal Circuit (10.368 MHz)
- Charge Circuit
- Telephone Line Interface Circuit
- Crystal Circuit (10.368 MHz)
- Charge Circuit
- Telephone Line Interface Circuit
• QSPI FLASH MEMORY IC431
- Main Program D/L Area
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