Panasonic KX-TC1019RUB Service Manual ▷ View online
6 ASSEMBLY INSTRUCTION
13
KX-TC1019RUB
7 TERMINAL GUIDE OF IC´S, TRANSISTORS AND DIODES
7.1. (BASE UNIT)
7.2. (PORTABLE UNIT)
14
KX-TC1019RUB
8 HOW TO REPLACE FLAT
PACKAGE IC
8.1. PREPARATION
•
SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19,KR-
19RMA
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19,KR-
19RMA
•
Soldering iron
Recommended power consumption will be between 30 W
to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 40 W iron, but
beginner might damage foil by overheating.)
Recommended power consumption will be between 30 W
to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 40 W iron, but
beginner might damage foil by overheating.)
•
Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
8.2. PROCEDURE
1. Temporary fix FLAT PACKAGE IC by soldering on two
marked 2 pins.
*Most important matter is accurate setting of IC
to the
to the
corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as
sliding the soldering iron.
8.3. MODIFICATION PROCEDURE
OF BRIDGE
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering
iron as shown in below figure.
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KX-TC1019RUB
9 CPU DATA (BASE UNIT)
9.1. IC601
16
KX-TC1019RUB
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