Harman Kardon HS 1000 (serv.man2) EMC - CB Certificate ▷ View online
Page 6 of 65 Report No. SH09051258-001
IEC/EN 60065
Clause
Requirement – Test
Result - Remark
Verdict
TRF No: IEC/EN 60065H
TRF originator Intertek ETL SEMKO SH
Resistors bridging basic insulation complying with
14.2.1 a)
14.2.1 a)
N/A
8.6
Class II equipment and Class II constructions
within Class I equipment
within Class I equipment
Pass
Reinforced or double insulation between
hazardous live parts and accessible parts
hazardous live parts and accessible parts
Pass
Components bridging reinforced or double
insulation complying with 14.1 a) or 14.3
insulation complying with 14.1 a) or 14.3
T701, T702, R701, R702
Pass
Basic and supplementary insulation each being
bridged by a capacitor complying with 14.2.1 a)
bridged by a capacitor complying with 14.2.1 a)
N/A
Reinforced or double insulation being bridged with
2 capacitors in series complying with 14.2.1 a)
2 capacitors in series complying with 14.2.1 a)
N/A
Reinforced or double insulation being bridged with
a single capacitor complying with 14.2.1 b)
a single capacitor complying with 14.2.1 b)
CY701, CY702, CY703,
CY705
CY705
Pass
Basic insulation bridged by components complying
with 14.3.4.3
with 14.3.4.3
N/A
8.7
Basic insulation between parts at 35 V to 71 V
(peak) a.c. or 60 V to 120 V d.c. and accessible
parts
(peak) a.c. or 60 V to 120 V d.c. and accessible
parts
No such voltage
N/A
Reinforced or double insulation between circuits
operating at voltages between 35 V and 71 V
(peak) a.c. or between 60 V and 120 V d.c. and
hazardous live parts at higher voltage
operating at voltages between 35 V and 71 V
(peak) a.c. or between 60 V and 120 V d.c. and
hazardous live parts at higher voltage
N/A
Separation by Class II isolating transformer
N/A
Separation by Class I transformer
N/A
Separation by earthed conductive part
N/A
8.8
Basic or supplementary insulation > 0,4 mm (mm) :
N/A
Reinforced insulation > 0,4 mm (mm) .................... : T701 bobbin: 0.75mm min.
T702 bobbin: 0.75mm min.
Optocoupler U704, U707,
U711: 0.40mm min.
U711: 0.40mm min.
Enclosure (front panel): 1.6mm
min.
min.
Separation sheet on internal
enclosure under power board:
0.41mm min.
enclosure under power board:
0.41mm min.
Pass
Thin sheet insulation
Pass
Page 7 of 65 Report No. SH09051258-001
IEC/EN 60065
Clause
Requirement – Test
Result - Remark
Verdict
TRF No: IEC/EN 60065H
TRF originator Intertek ETL SEMKO SH
Basic or supplementary insulation, at least two
layers, each meeting 10.3
layers, each meeting 10.3
Insulation tape wrapped the
core and copper coil of T702,
withstand 2520Vp test.
core and copper coil of T702,
withstand 2520Vp test.
Pass
Basic or supplementary insulation, three layers any
two of which meet 10.3
two of which meet 10.3
N/A
Reinforced insulation, two layers each of which
meet 10.3
meet 10.3
N/A
Reinforced insulation, three layers any two which
meet 10.3
meet 10.3
Inside T701, T702, withstand
4240Vp test.
4240Vp test.
Pass
8.9
Adequate insulation between internal hazardous
live conductors and accessible parts
live conductors and accessible parts
N/A
Adequate insulation between internal hazardous
live parts and conductors connected to accessible
parts
live parts and conductors connected to accessible
parts
N/A
8.10
Double insulation between conductors connected
to the mains and accessible parts
to the mains and accessible parts
Live wires are double
insulated, no secondary wire
can come closer to live parts
insulated, no secondary wire
can come closer to live parts
Pass
8.11
Detaching of wires
N/A
No undue reduction of creepages or clearance
distances if wires become detached
distances if wires become detached
Mating lock connector used for
mains. No risk of detached.
mains. No risk of detached.
N/A
Vibration test carried out ........................................ : No, see above
N/A
8.12 Void
N/A
8.13
Adequate fastening of windows, lenses, lamp
covers etc. (pull test 20 N for 10 s)
covers etc. (pull test 20 N for 10 s)
Pass
8.14
Adequate fastening of covers (pull test 50 N for
10 s)
10 s)
Pass
8.15
No risk of damage to the insulation of internal
wiring due to hot parts or sharp edges
wiring due to hot parts or sharp edges
Internal wires secured and
keep enough distance from
sharp or hot parts.
keep enough distance from
sharp or hot parts.
Pass
8.16
Only special supply equipment can be used
N/A
8.17
Insulated winding wire without additional
interleaved insulation
interleaved insulation
N/A
8.18
Endurance test as required by 8.17
N/A
8.19
Disconnection from the mains
Pass
8.19.1
Disconnect device
Mains plug or appliance
coupler.
coupler.
Pass
All-pole switch or circuit breaker with >3mm
contact separation
contact separation
Not used as a disconnect
device
device
N/A
8.19.2
Mains switch ON indication
No mains switch
N/A
Page 8 of 65 Report No. SH09051258-001
IEC/EN 60065
Clause
Requirement – Test
Result - Remark
Verdict
TRF No: IEC/EN 60065H
TRF originator Intertek ETL SEMKO SH
8.20
Switch not fitted in the mains cord
N/A
8.21
Bridging components comply with clause 14
N/A
9
ELECTRIC SHOCK HAZARD UNDER NORMAL OPERATING CONDITIONS
9.1
Testing on the outside
9.1.1
For voltages >1000 V ac or >1500 V dc complies
with clause 13.3.1 for basic insulation
with clause 13.3.1 for basic insulation
No such high voltage
N/A
9.1.1.1
Touch current measured from terminal devices
using the network in annex D ................................. :
using the network in annex D ................................. :
U1=1.0Vp
U2=0.16Vp
U2=0.16Vp
Pass
Discharge not exceeding 45 µC 1µC max.
Pass
Energy of discharge not exceeding 350 mJ
No voltage exceeding 15kV
N/A
9.1.1.2
Test with test finger and test probe
Pass
9.1.2
No hazardous live shafts of knobs, handles or
levers
levers
Pass
9.1.3
Ventilation holes and other holes tested by means
of 4 mm x 100 mm test pin
of 4 mm x 100 mm test pin
2.3 mm max. no entering
N/A
9.1.4
Terminal devices tested with 1 mm x 20 mm test
pin (10 N); test probe D of IEC 61032
pin (10 N); test probe D of IEC 61032
Pass
Terminal devices tested with 1 mm x 100 mm
straight wire (1 N); test probe D of IEC 61032
straight wire (1 N); test probe D of IEC 61032
Pass
9.1.5
Pre-set controls tested with 2.5 mm x 100 mm test
pin (10 N); test probe C of IEC 61032
pin (10 N); test probe C of IEC 61032
No pre-set control
N/A
9.1.6
No shock hazard due to stored charge on
withdrawal of the mains plug; voltage (V) after 2 s :
withdrawal of the mains plug; voltage (V) after 2 s :
40V max.
R809=1MΩ
R809=1MΩ
Pass
If C is not greater than 0,1uF no test needed
N/A
9.1.7
Enclosure sufficiently resistant to external force
Pass
Test probe 11 of IEC 61032 for 10 s (50 N)
Pass
Test hook of fig. 4 for 10 s (20 N)
Pass
30 mm diameter test tool for 5 s (100 or 250 N) .... : 100N Pass
9.2
No hazard after removing a cover by hand
Can not be removed by hand
N/A
10 INSULATION
REQUIREMENTS
10.1 Insulation
resistance
(MΩ) at least 2 MΩ min. after
surge test for basic and 4 MΩ min. for reinforced
insulation ................................................................. :
insulation ................................................................. :
Pass
10.2
Humidity treatment 48 h or 120 h ........................... : 48h, 30℃, 93%R.H.
Pass
Page 9 of 65 Report No. SH09051258-001
IEC/EN 60065
Clause
Requirement – Test
Result - Remark
Verdict
TRF No: IEC/EN 60065H
TRF originator Intertek ETL SEMKO SH
10.3
Insulation resistance and dielectric strength
(See appended table)
Pass
11 FAULT
CONDITIONS
11.1
No shock hazard under fault condition
Pass
11.2
Heating under fault condition
(See appended table)
Pass
No hazard from softening solder
Pass
11.2.1
Measurement of temperature rises
Pass
11.2.2
Temperature rise of accessible parts
Pass
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
(See appended table)
Pass
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min
exceeding the limits of table 3 by max. 100 K for
max. 5 min
N/A
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than 2 cm²
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than 2 cm²
N/A
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
N/A
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
N/A
Class I protective earthing maintained
N/A
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
Pass
11.2.5
Temperature rise of windings
(see appended table)
Pass
11.2.6
Temperature rise of parts not subject to the limits
of 11.2.1 to 11.2.5
of 11.2.1 to 11.2.5
(see appended table)
Pass
12 MECHANICAL
STRENGTH
12.1.1
Bump test where mass >7 kg
4.95kg
N/A
12.1.2 Vibration
test
Not carried out, no connection
which might impair safety can
become loosen
which might impair safety can
become loosen
Pass
12.1.3 Impact
hammer
test
0.5J Pass
Steel
ball
test
2J Pass
12.1.4
Drop test for portable apparatus where mass < 7
kg
kg
Pass
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