Sony DSC-F55 / DSC-F55E (serv.man2) Service Manual ▷ View online
17
4. DESCRIPTION OF FUNCTIONS
4-1. Outline of Memory Stick
Electrical Specifications
Memory Stick Electrical Specifications
Number of connector pins : 10 pins
Connector shape
Connector shape
: Planar electrode one-row
Write speed
: 1,500 KB to 330 KB/s
Readout speed
: 2.45 MB/s
Capacity
: 4 MB to 64 MB
Write unit
: 512 B
Erase block size
: 8KB or 16 KB
Power source voltage
: 2.7 to 3.6 V
Serial clock
: 20 MHz (maximum)
Fig. 4-1 Block diagram
Memory Stick
VSS
BS
VCC
DIO
Reserv
INS
Reserv
SCLK
VCC
VSS
Control IC (MB86188)
I/F
S/P & P/S
S/P & P/S
Page
Buffer
(512B)
Buffer
(512B)
ECC (3B)
Attri
ROM
ROM
RESET
OSC Cont.
Register
FLASH
I/F
I/F
Sequencer
FLASH I/F
FMEM
Page Reg.
512B
16B
512B
16B
512B
16B
512B
16B
512B
16B
512B
16B
512B
16B
18
4-2. Flash Function
Flash Button
The default setting of the flash button is the AUTO position (no indication).
Each time the flash button is pressed, the flash mode changes as follows.
Each time the flash button is pressed, the flash mode changes as follows.
Forced flash
→
No flash
→
AUTO (no indication)
The following description explains operation of the forced flash mode.
When the main power is turned on in the “STILL” mode, the HI Controller
(IC603) detects its input from the flash button and sets the STB CHG signal
(pin 93) to “H”.
When the main power is turned on in the “STILL” mode, the HI Controller
(IC603) detects its input from the flash button and sets the STB CHG signal
(pin 93) to “H”.
Flash Unit
The STB CHG signal is sent to the charge circuit inside the flash unit that
charges the discharging capacity. The charge circuit inside the flash unit
has the high voltage oscillator that generates a high voltage (about 700 Vp-
p). The high voltage is rectified and charges the discharging capacitor up to
about 300 V. When the discharging capacitor is charged up to the specified
voltage, the XSTB FUL signal that is supplied from the flash unit is changed
from “H” to “L” informing the HI Controller (pin 32 of IC604) of the comple-
tion of charging.
charges the discharging capacity. The charge circuit inside the flash unit
has the high voltage oscillator that generates a high voltage (about 700 Vp-
p). The high voltage is rectified and charges the discharging capacitor up to
about 300 V. When the discharging capacitor is charged up to the specified
voltage, the XSTB FUL signal that is supplied from the flash unit is changed
from “H” to “L” informing the HI Controller (pin 32 of IC604) of the comple-
tion of charging.
HI Controller (IC603)
The flash LED has been blinking during charging, but is changed by the HI
Controller to turn on all the time.
Then the HI Controller waits that the shutter button is pressed. When the
shutter button is pressed, flashing is indicated by the STROB ON signal
from IC501.
Controller to turn on all the time.
Then the HI Controller waits that the shutter button is pressed. When the
shutter button is pressed, flashing is indicated by the STROB ON signal
from IC501.
When the flash unit receives the flashing signal (STROB ON), it turns on
the flash switch and activates the flash unit. The flash unit can adjust its
brightness. The reflection light that is returned from the subject flows the
current STROB A IN in the flash unit. The voltage is developed across a
resistor R513 through which the current STROB A IN flows so that the
detected voltage is fed back to IC501 (pin 77.) Turn-on time of the flash
unit is controlled in accordance with the detected voltage.
The detected voltage is also changed during the MACRO shooting by the
function of Q501.
the flash switch and activates the flash unit. The flash unit can adjust its
brightness. The reflection light that is returned from the subject flows the
current STROB A IN in the flash unit. The voltage is developed across a
resistor R513 through which the current STROB A IN flows so that the
detected voltage is fed back to IC501 (pin 77.) Turn-on time of the flash
unit is controlled in accordance with the detected voltage.
The detected voltage is also changed during the MACRO shooting by the
function of Q501.
The flash picture is stored in the CCD imager and the field video signal is
generated.
generated.
19
4-2-1. Flash and Reading-out Images
Operation block diagram of flash and timing are shown in Fig. 4-2.
FLASH
S204
FLASH
D103
IC603
HI Controller
HI Controller
34
16
17
56
93
32
XSHTR LOCK SW
–2
–1
STB LED
STB CHG
XSTB FUL
XSHTR ON
Flash Unit
CHARGE
Fluorescent
tube
tube
IC501
77
SHUTTER
(RELEASE)
Button ON
(RELEASE)
Button ON
XMACRO/NORMAL
Signal flow
R517
R512
R513
STRB ON
STROB A IN
PHOTO
TR
TR
SHUTTER
(RELEASE)
I
Input from switch
STB CHG
XSTB FUL
XNOR/STRB
FLSH ON
Charging operation
Charging
a capacitor
Q607
69
Q501
IC501
detector
Flash turns on
Voltage is detected from
the current IXR513
flowing through the photo
transistor.
the current IXR513
flowing through the photo
transistor.
20
4-3. Hybrid LCD
* There are two types of LCD: One is the “transparent type” and the other
is “reflection type”. Because LCD does not transmits light from itself,
the transparent type LCD has the back light that provides illumination
from its rear. The reflection type does not have the back light but reflects
the incoming light from outside to provide illumination.
the transparent type LCD has the back light that provides illumination
from its rear. The reflection type does not have the back light but reflects
the incoming light from outside to provide illumination.
Description of Structure
Each pixel that is the smallest unit to display picture on LCD, of the hybrid
LCD plays the “double role” to satisfy the contradictory requirements.
A transparent material is used for each pixel that has the size of about 300
LCD plays the “double role” to satisfy the contradictory requirements.
A transparent material is used for each pixel that has the size of about 300
µ
m vertically and 100
µ
m horizontally in order to pass the illumination that
is provided by the back light. At the same time, the outer edges of each
pixel have the aluminum thin layer using the sputtering technology that
reflects the incoming light from outside.
Ratio of the transparent area to the aluminum covered area is almost 1-to-1.
When the back light is turned on, the transparent area in the center of pixel
passes the back light. When a strong light is introduced from outside, it is
reflected by the aluminum covered area to provide illumination.
pixel have the aluminum thin layer using the sputtering technology that
reflects the incoming light from outside.
Ratio of the transparent area to the aluminum covered area is almost 1-to-1.
When the back light is turned on, the transparent area in the center of pixel
passes the back light. When a strong light is introduced from outside, it is
reflected by the aluminum covered area to provide illumination.
Fig. 4-3-1
Structural Drawing
Micro reflection
electrode
Transparent
electrode
Polarizing
plate
plate
Polarizing
plate
LCD
R
G
B
Back light
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