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2012A08-1

© 

2012.01

POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
(US model only)
With 8 ohm loads, both channels driven, from 
20 – 20,000 Hz; rated 90 watts per channel 
minimum RMS power, with no more than 0.09% 
total harmonic distortion from 250 milliwatts to 
rated output.

Amplifi er section
US, Canadian and AEP models

1)

Minimum RMS Output Power (8 ohms, 20 Hz –
20 kHz, THD 0.09%)
   

90 W + 90 W

Stereo Mode Output Power (8 ohms, 1 kHz, 
THD 1%)
   

100 W + 100 W

1)

Measured under the following conditions:

US, Canadian

120 V AC, 60 Hz

AEP

230 V AC, 50 Hz

Frequency response
 

Analog 

10 Hz – 70 kHz

 

 

+0.5/–2 dB (with BASS =

 

 

0 dB, TREBLE = 0 dB)

Input 

 

Analog (PORTABLE IN)

  

Sensitivity: 

1 

V/

  

50 

kilohms

  

S/N

2)

: 96 dB (A, 500 mV

3)

)

Inputs
 

Analog (Except PORTABLE IN)

 

 

Sensitivity: 500 mV/

  

50 

kilohms

  

S/N

2)

: 96 dB (A, 500 mV

3)

)

Outputs
 

Analog (AUDIO OUT)

 

 

Voltage: 500 mV/

  

10 

kilohms

Tone
 

Gain levels  

±10 dB, 1 dB step

2)

INPUT SHORT (with BASS = 0 dB, TREBLE = 

0 dB).

3)

Weighted network, input level.

FM tuner section
Tuning range 

87.5 MHz – 108.0 MHz

Antenna (aerial) 

FM wire antenna (aerial)

Antenna (aerial) terminals
 

 

75 ohms, unbalanced

AM tuner section
Tuning range

10 kHz step  

9 kHz step

US, Canadian

530 kHz – 

531 kHz –

1,710 kHz 

1,710 kHz

AEP

–    

531 kHz –

  

1,602 

kHz

Antenna (aerial) 

Loop antenna (aerial) 

General
Power requirements

US, Canadian

120 V AC, 60 Hz

AEP

230 V AC, 50/60 Hz

Power consumption  200 W
Power consumption (during standby mode)
  

0.3 

W

Dimensions (w/h/d) (Approx.)
 

 

430 mm × 132.5 mm ×

 

 

279 mm (17 in × 5 1/4 in ×

 

 

11 in) including projecting

 

 

parts and controls

Mass (Approx.) 

6.4 kg (14 lb 2 oz)

Halogenated fl ame retardants are not used in
the certain printed wiring boards.

s Operating Instructions
s Quick Setup Guide
s FM wire antenna (aerial) (1)

s AM loop antenna (aerial) (1)

s Remote control (RM-AAU130) (1) 

s R6 (size AA) batteries (2)

Design and specifi cations are subject to
change without notice.

US

4-408-213-0[]

AEP

4-408-213-1[]

Canadian

4-408-213-2[]

SAFETY  CHECK-OUT (US MODEL)
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable.  (See 
Fig. A)

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  0 SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COM-  POSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.

Ω

μF

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

1-1. Case 

..................................................................................... 4

1-2.  Back Panel Section ............................................................. 5
1-3.  Front Panel Section ............................................................. 5
1-4.  MAIN Board Section .......................................................... 6

 ...................................................................... 7

 ........................................................ 9

4-1.  Block Diagram – Main Section – ......................................11
4-2.  Block Diagram – Display and Power Section – ............... 12
4-3.  Printed Wiring Board – Main Board – .............................. 14
4-4.  Schematic Diagram – Main Board 1/3 – .......................... 15
4-5.  Schematic Diagram – Main Board 2/3 – .......................... 16
4-6.  Schematic Diagram – Main Board 3/3 – .......................... 17
4-7.  Printed Wiring Board – Display and 

  

 

Power Key Board – ........................................................... 18

4-8.  Schematic Diagram – Display and 

  

 

Power Key Board – ........................................................... 19

4-9.  Printed Wiring Board – Headphone, Thermal and 

  

 

Tuner1 Board – ................................................................. 20

4-10.  Schematic Diagram – Headphone, Thermal and 
 

Tuner1 Board – ................................................................. 20

5-1.   Case Section ...................................................................... 26
5-2.   Front Panel Section ............................................................ 27
5-3.   Back Panel Section ............................................................ 28
5-4.   Chassis Section .................................................................. 29

 ....................................... 30

Note:  This set can be disassemble according to the following sequence.

Note:  Follow the disassembly procedure in the numerical order given.

1 two screws
     (+BVST 4x8)

2 two screws
     (+BVST 4x8)

3 two screws
     (+BVTP 3x8)

4 case