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Model
MDS-JA555ES
Pages
88
Size
8.01 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio / S/M MDS-JA555ES US CA AEP UK99
File
mds-ja555es.pdf
Date

Sony MDS-JA555ES Service Manual ▷ View online

MDS-JA555ES
37
37
6-2. CIRCUIT BOARD LOCATION
AC board
BD board
MOTOR board
PSW board
HP board
FL board
OUT SWITCH board
REC board
POSITION SWITCH board
BT board
DA board
AD board
PJ board
PW board
DIGITAL board
Note on Printed Wiring Boards:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
2
: nonflammable resistor.
5
: fusible resistor.
C
: panel designation.
U
: B+ Line.
V
: B– Line.
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
E
: PB
j
: REC
p
: PB (DIGITAL)
l
: REC (DIGITAL)
Note:
The components identi-
fied by mark 
!
 or dotted
line with mark 
!
 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 
!
 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
MDS-JA555ES
38
38
6-3. PRINTED WIRING BOARD   BD SECTION      
• Refer to page 37 for Note on Printed Wiring Boards.   • Refer to page 37 for Circuit Board Location.
FOR ADJUSTMENT
Ref. No.
Location
D101
G-6
D181
A-1
D183
A-1
IC103
E-6
IC123
B-3
IC171
A-6
Q102
E-5
Q103
C-6
Q104
E-6
• Semiconductor
Location
Ref. No.
Location
IC101
G-5
IC121
C-5
IC124
C-6
IC152
E-2
IC181
C-2
IC192
B-1
Q101
E-6
Q162
E-6
Q163
E-5
Q181
B-2
Q182
B-3
• Semiconductor
Location
MDS-JA555ES
39
39
6-4. SCHEMATIC DIAGRAM    BD SECTION(1/2)
• Refer to page 37 for Note on Schematic Diagrams.   • Refer to page 56 for Waveforms.
• Refer to page 58 for IC Block Diagram.   • Refer to page 63 for IC Pin Function.
(Page 43)
(Page 45)
(Page 40)
MDS-JA555ES
40
40
6-5. SCHEMATIC DIAGRAM    BD SECTION(2/2)
• Refer to page 37 for Note on Schematic Diagrams.   • Refer to page 56 for Waveforms.
• Refer to page 57 for IC Block Diagram.    • Refer to page 62 for IC Pin Function.
(Page 39)
The components identified by
mark 
!
 or dotted line with mark
!
 are critical for safety.
Replace only with part number
specified.
Les composants identifiés par
une marque 
!
 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
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