Sharp LC-70UQ10KN (serv.man3) Service Manual ▷ View online
69
LC-60UQ10
LC-70UQ10
LC-70UQ10
3.4. Power / Back Light
4. Power / Back Light
↓
NO
→
↓YES
NO
→
↓YES
NO
→
↓YES
NO
→
↓YES
NO
→
↓YES
NO
→
↓YES
NO
→
↓
NO
→
↓YES
NO
→
↓YES
NO
→
↓YES
NO
→
↓YES
NO
→
↓YES
Is there the pins of 【PD】P3801 at “H”?
[24 / STB]
[24 / STB]
Check the power unit ,
and the signal line between STB and IC2004(
and the signal line between STB and IC2004(
UCOM
)/IC3301
Replace the power unit.
Are the wire harnesses and other cables properly
connected in the set?
connected in the set?
Reconnect the wire harnesses and other cables properly in
the set.
the set.
Does Power starts up (central Icon LED ilights up) ?
Refer to “No power (central Icon LED failure to light up) or
no startup (central Icon LED failure is flashing)”
no startup (central Icon LED failure is flashing)”
Is there the pins of 【PD】P3801 at “H”?
[16 / PNL_POW]
[16 / PNL_POW]
Check the power unit ,
and the signal line between PNL_POW and IC3301
(
and the signal line between PNL_POW and IC3301
(
Digital AV decode & Main CPU
) .
Are the DC/DC converter outputs and the output voltages
along
along
Check the DC/DC converters and the control lines.
Replace defective parts as required.
Replace defective parts as required.
No light (Back Light doesn't light)
Is the AC cord connector tightly connected to the set?
Reconnect the AC cord tightly and turn on the power again.
Is there the pins of 【PD】P3801 at “H”?
[14 / PS_ON]
[14 / PS_ON]
Check the signal line between PS_ON and IC2002(UCOM)
Is there the pins of 【PD】P3801 at “H”?
[13 / AC_DET]
[13 / AC_DET]
Check the power unit ,
and the signal line between AC_DET and IC2002(UCOM)
and the signal line between AC_DET and IC2002(UCOM)
Is power supplied from pins of 【PD】P3801 as specified?
[5~8 / UR+13V]
[5~8 / UR+13V]
Check the signal line between PS_ON and IC2002(UCOM)
No power (Central Icon is not lighting)
No startup (Central Icon is flashing)
Is the AC cord connector tightly connected to the set?
Reconnect the AC cord tightly and turn on the power again.
Are the wire harnesses and other cables properly
connected to the set?
connected to the set?
Reconnect the wire harnesses and other cables properly to
the set.
the set.
Is power supplied from pins of 【PD】P3801 ?
[15 / BU+5V]
[15 / BU+5V]
Replace the power unit.
BU3.3V
(IC9607 etc.)
STB+3.3V
(IC9607 etc.)
D5V
(IC9602 etc.)
D3.3V
(IC9603 etc.)
D1.5V
(IC9601 etc.)
D1.2V
(IC9601 etc.)
D2.5V
(IC9603 etc.)
D1.1V
(IC9605 etc.)
D1V
(IC9602 etc.)
USB_5V
(IC9604 etc.)
1.2V
(IC3302 etc.)
CPU_ADAC+3.3V (IC3303 etc.)
CII+5V
CII+5V
(IC1401 etc.)
ANT+5V
(IC1101 etc.)
HDMI4_PWR5V
(IC1507 etc.)
VDD of SC3101
(IC3104 etc.)
5V of USB1
(IC9502 etc.)
5V of USB2
(IC9504 etc.)
5V of USB3
(IC9505 etc.)
70
LC-60UQ10
LC-70UQ10
LC-70UQ10
Bottom-side-Mount
This Main Board adopts "Bottom-side-Mount"
"Bottom-side-Mount(BMS)" is a technology that mounts parts (condenser) in the gap of BGA solder balls between the Board and the BGA-IC
When repairing, please care
"Bottom-side-Mount(BMS)" is a technology that mounts parts (condenser) in the gap of BGA solder balls between the Board and the BGA-IC
When repairing, please care
◆BSM mounting equipment for BGA Repair (Reference)
BGA/CSP REWORK SYSTEM RD-500S
◆Basic Procedure
Setting temperature of Repair, Time condition areas usual.
According to Operation tandard (B-A-10 CSP,BGA Repair)
According to Operation tandard (B-A-10 CSP,BGA Repair)
◆Repair
1)
Setting temperature (Reference value : Thickness of Board 1.2mm, BGA Repair, Standard-Setting )
Pre-heat
Ramp1
Soak
Ramp2
Reflow
Time
60
36
44
72
31
Top-heater
150
309
299
378
335
Bot-heater
150
319
314
455
455
Area-heater
2)
Remove
Note①
After heating BGA, solder is melting.
So if BGA is pressed, BGA contacts with mounted parts by BSM, or position gap of parts happens , parts are attached to BGA.
So if BGA is pressed, BGA contacts with mounted parts by BSM, or position gap of parts happens , parts are attached to BGA.
(If you find Angular electrode, please set it by applying Flux and using blower.)
Board side
Parts side
450
Angular electrode
When electrode of parts contact with
IC , Angle may occure.
NOTE
Bottom-side-Mount
This Main Board adopts “Bottom-side-Mount”.
“Bottom-side-Mount (BMS)” is a technology that mounts parts (condenser) in the gap of BGA solder balls btween the
Board and th BGA-IC.
When reparing, please take care.
This Main Board adopts “Bottom-side-Mount”.
“Bottom-side-Mount (BMS)” is a technology that mounts parts (condenser) in the gap of BGA solder balls btween the
Board and th BGA-IC.
When reparing, please take care.
BSM mounting equipment for BGA Repair (Reference)
Basic Procedure
Setting temperature of Repair, Time condition areas usual.
According to Operation standard (B-A-10 CSP, BGA Repair)
Repair
Repair
1) Setting temperature (Reference value: Thickness of Board 1.2mm, BGA Repair, Standard-Setting)
Bottom-side-Mount
This Main Board adopts "Bottom-side-Mount"
"Bottom-side-Mount(BMS)" is a technology that mounts parts (condenser) in the gap of BGA solder balls between the Board and the BGA-IC
When repairing, please care
"Bottom-side-Mount(BMS)" is a technology that mounts parts (condenser) in the gap of BGA solder balls between the Board and the BGA-IC
When repairing, please care
◆BSM mounting equipment for BGA Repair (Reference)
BGA/CSP REWORK SYSTEM RD-500S
◆Basic Procedure
Setting temperature of Repair, Time condition areas usual.
According to Operation tandard (B-A-10 CSP,BGA Repair)
According to Operation tandard (B-A-10 CSP,BGA Repair)
◆Repair
1)
Setting temperature (Reference value : Thickness of Board 1.2mm, BGA Repair, Standard-Setting )
Pre-heat
Ramp1
Soak
Ramp2
Reflow
Time
60
36
44
72
31
Top-heater
150
309
299
378
335
Bot-heater
150
319
314
455
455
Area-heater
2)
Remove
Note①
After heating BGA, solder is melting.
So if BGA is pressed, BGA contacts with mounted parts by BSM, or position gap of parts happens , parts are attached to BGA.
So if BGA is pressed, BGA contacts with mounted parts by BSM, or position gap of parts happens , parts are attached to BGA.
(If you find Angular electrode, please set it by applying Flux and using blower.)
Board side
Parts side
450
Angular electrode
When electrode of parts contact with
IC , Angle may occure.
2) Remove
Note
After heating BGA, solder is melting.
So if BGA is pressed, BGA contacts with mouted parts by BSM, or position gap of parts happens, parts
are attached to BGA.
(If you find Angular electrode, please set it by applying Flux and using blower).
are attached to BGA.
(If you find Angular electrode, please set it by applying Flux and using blower).
Bottom-side-Mount
This Main Board adopts "Bottom-side-Mount"
"Bottom-side-Mount(BMS)" is a technology that mounts parts (condenser) in the gap of BGA solder balls between the Board and the BGA-IC
When repairing, please care
"Bottom-side-Mount(BMS)" is a technology that mounts parts (condenser) in the gap of BGA solder balls between the Board and the BGA-IC
When repairing, please care
◆BSM mounting equipment for BGA Repair (Reference)
BGA/CSP REWORK SYSTEM RD-500S
◆Basic Procedure
Setting temperature of Repair, Time condition areas usual.
According to Operation tandard (B-A-10 CSP,BGA Repair)
According to Operation tandard (B-A-10 CSP,BGA Repair)
◆Repair
1)
Setting temperature (Reference value : Thickness of Board 1.2mm, BGA Repair, Standard-Setting )
Pre-heat
Ramp1
Soak
Ramp2
Reflow
Time
60
36
44
72
31
Top-heater
150
309
299
378
335
Bot-heater
150
319
314
455
455
Area-heater
2)
Remove
Note①
After heating BGA, solder is melting.
So if BGA is pressed, BGA contacts with mounted parts by BSM, or position gap of parts happens , parts are attached to BGA.
So if BGA is pressed, BGA contacts with mounted parts by BSM, or position gap of parts happens , parts are attached to BGA.
(If you find Angular electrode, please set it by applying Flux and using blower.)
Board side
Parts side
450
Angular electrode
When electrode of parts contact with
IC , Angle may occure.
71
LC-60UQ10
LC-70UQ10
LC-70UQ10
3)
Ready for mounting
Please clean solder by using blotter-band
Note②
When cleaning after removing BGA, soldering tip must not contact with parts mounted by BSM.
4)
Mounting
Please mount BGA at the same condition as "2 )Remove"
5)
Inspection
Reference
Radiographic Testing
position gap of mounted parts by BSM
position gap of BGA
position gap of mounted parts by BSM
position gap of BGA
Widening
3) Ready for mounting
Please Clean solder by using blotter-band.
Note
When cleaning after removing BGA, soldering tip must no contact wich parts mounted by BSM.
3)
Ready for mounting
Please clean solder by using blotter-band
Note②
When cleaning after removing BGA, soldering tip must not contact with parts mounted by BSM.
4)
Mounting
Please mount BGA at the same condition as "2 )Remove"
5)
Inspection
Reference
Radiographic Testing
position gap of mounted parts by BSM
position gap of BGA
position gap of mounted parts by BSM
position gap of BGA
Widening
4) Mounting
Please mount BGA at the same condition as”2) Remove”.
5) Inspection
Reference
Radiographic Testing
position gap of mounted parts by BSM
position gap of BGA
72
LC-60UQ10
LC-70UQ10
LC-70UQ10
MAJOR ICs INFORMATION
NO
REF NO
Part Code
Name
Deｓｃｒｉｐｔｉｏｎ
1
IC3102
RH-IXD706WJQZQ
NAND Flash
Ｔhis IC ｉｓ 8Gbit NAND flash memory .
This IC stores the software data that processes the system of TV such as the graphic
processing, the LCD controls, and backlights etc.
This IC stores the software data that processes the system of TV such as the graphic
processing, the LCD controls, and backlights etc.
2
IC3301
RH-IXD414WJN1Q
Digital AV decode
Main CPU
Main CPU
This IC is Video Processor & MAIN CPU.
In this IC, the decode processing and the video signal processing are done.
Moreover, OSD is generated here and added to a picture signal.
In this IC, the decode processing and the video signal processing are done.
Moreover, OSD is generated here and added to a picture signal.
3
IC2002
RH-IXD515WJNTQ
UCOM
The monitor microprocessor is intended to communicate with the main CPU and to
operate the system.
It also controls power of the entire system.
operate the system.
It also controls power of the entire system.
4
IC3501,IC3502
IC3503,IC3504
IC3503,IC3504
RH-IXD682WJQZQ
DDR
This IC ｉｓ 2GB DDR3 SDRAM .
This IC operates as a memory of IC3301 (Digital AV decode & Main CPU).
This IC operates as a memory of IC3301 (Digital AV decode & Main CPU).
5
IC2501
VHISII9679+-1Q
HDCP2.2
This IC supports HDMI input with HDCP1.4 or HDCP2.2 encryption.
This IC can support up to 4k2k Ultra HD video format.
This IC can support up to 4k2k Ultra HD video format.
6
IC2601
VHISII9687A-1Q
HDMI_Port _Processor
This HDMI port processor is the second generation of HDMI port processor with HDMI
Ethernet Channel(HEC) and Audio Return Channel(ARC) support on one input port.
・ Supports video resolutions up to 1080p, 60Hz, 12bit or 720p/1080i, 120Hz,12bit.
・ HDMI,HDCP,and DVI1.0 compatible
Ethernet Channel(HEC) and Audio Return Channel(ARC) support on one input port.
・ Supports video resolutions up to 1080p, 60Hz, 12bit or 720p/1080i, 120Hz,12bit.
・ HDMI,HDCP,and DVI1.0 compatible
7
IC1702
VHIYDA174QZ-1Y
Audio-AMP + DSP for
SP
SP
This IC is digital audio power amplifier which contained 2 cores of DSP and FM sound
source.
The maximum output is 15Wx2ch.
source.
The maximum output is 15Wx2ch.
8
IC1705
VHIYDA176DL-1Y
Audio-AMP for Woofer
This IC is digital audio power amplifier with digital audio interface.
The power-supply voltage is corresponded to 5V～18V and the maximum output is
15Wx2ch.
The power-supply voltage is corresponded to 5V～18V and the maximum output is
15Wx2ch.
9
IC1102
RH-IXD591WJQZY
LNB supply and control
It is IC for amplifying the feeble electric wave sent from satellite broadcasting
on the level which can treat a decoder, and changing and processing signal.
on the level which can treat a decoder, and changing and processing signal.
10
IC1301
VHICXD2842E-1Y
Demodulator
This IC is a combined DVB-T2, T, C, S2, S demodulator.
11
IC9501
VHIGL850G3Q-1Q
USB-Hub
This is the STT hub solutions which fully coply with Universal Serial Bus Specification
Revision 2.0
Revision 2.0
12
IC3103
VHIGL834L++-1Y
SD card controller
This IC is a crystal-less USB 2.0 to Single LUN SD3.0/MMC/MS Memory Card Reader
controller.
controller.
13
IC1601,IC2004
VHIRV2402AI-1Y
2K bit E2PROM
(256-word x 8bit)
(256-word x 8bit)
This is a 2Kbit-2-wire (I2C bus type) serial EEPROM that can be programmed electrically .
This IC stores the menu data and the adjustment value data of adjustment process mode
etc.
The data is given out by commands from the main microprocessor.
This IC stores the menu data and the adjustment value data of adjustment process mode
etc.
The data is given out by commands from the main microprocessor.
14
IC3101
VHIRV2464AI-1Y
2K bit E2PROM
(256-word x 8bit)
(256-word x 8bit)
This is a 2Kbit-2-wire (I2C bus type) serial EEPROM that can be programmed electrically .
This IC stores the menu data and the adjustment value data of adjustment process mode
etc.
The data is given out by commands from the main microprocessor.
This IC stores the menu data and the adjustment value data of adjustment process mode
etc.
The data is given out by commands from the main microprocessor.
15
IC630
VHIM3221EIP-1Y
RS232C-DRIVER
This is a single driver, single receiver RS-232 solution operating from a single Vcc
supply. The RS-232 pins provide IEC G1000-4-2 ESD Protection. The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an
asynchronous communication controller and the serial-port connector. The charge pump
and four small external capacitors allow operation from a single 3V to 5.5V supply.
supply. The RS-232 pins provide IEC G1000-4-2 ESD Protection. The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an
asynchronous communication controller and the serial-port connector. The charge pump
and four small external capacitors allow operation from a single 3V to 5.5V supply.
16
IC9601
VHIBD9580MU-1Y
DC/DC converter
This IC is a DC/DC converter which can change DC voltage.
MAJOR ICs INFORMATION for UQ10E/EN/KN and PRO10R series
[MAIN UNIT]
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