DOWNLOAD Sharp LC-42XD10E (serv.man5) Service Manual ↓ Size: 2.36 MB | Pages: 30 in PDF or view online for FREE

Model
LC-42XD10E (serv.man5)
Pages
30
Size
2.36 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / LCD / Major IC Information
File
lc-42xd10e-sm5.pdf
Date

Sharp LC-42XD10E (serv.man5) Service Manual ▷ View online

LC-42XD10E/RU
5 – 9
V22
PORT_E_1
I/O
Port E data.      NC
V20
PORT_E_0
I/O
Port E data.      NC
T21
PORT_E_CLK
I/O
Port E data.      NC
N20
PORT_F_9
O
Port F data.     FRCI_7   
P23
PORT_F_8
O
Port F data.     FRCI_6
P21
PORT_F_7
O
Port F data.     FRCI_5
P22
PORT_F_6
O
Port F data.     FRCI_4
P20
PORT_F_5
O
Port F data.     FRCI_3
R23
PORT_F_4
O
Port F data.     FRCI_2
R21
PORT_F_3
O
Port F data.     FRCI_1
R22
PORT_F_2
O
Port F data.     FRCI_0
R20
PORT_F_1
O
Port F data.     NC
T23
PORT_F_0
O
Port F data.     NC
N21
PORT_F_CLK
O
Port F clock.
G22
PORT_G_9
I
Port G data.     FRCO_7B 
H23
PORT_G_8
I
Port G data.     FRCO_6B
H21 
PORT_G_7
I
Port G data.     FRCO_5B
H22 
PORT_G_6 
I
Port G data.     FRCO_4B
H20 
PORT_G_5 
I
Port G data.     FRCO_3B
J23 
PORT_G_4
I
Port G data.     FRCO_2B
J21 
PORT_G_3
I
Port G data.     FRCO_1B
J22 
PORT_G_2 
I
Port G data.     FRCO_0B
J20 
PORT_G_1 
I
Port G data.     NC
K23 
PORT_G_0 
I
Port G data.     NC
G23 
PORT_G_CLK 
I
Port G clock.   
D19 
P29 
I
CPU I/O PORT   HDMI_INT          (from IC1905)
C19 
P28 
I
CPU I/O PORT   HOTP_CONT1    (to EXT5)
B19 
P27 
I
CPU I/O PORT   HOTP_CONT0    (to EXT5)
A19 
P26 
O
CPU I/O PORT   POWER_ERR      (to power-unit)
C20 
P25 
I
CPU I/O PORT   BL_ERR            (from INV)
B20 
P24 
I/O
CPU I/O PORT   DTM_IRQ          NC
A20 
P23 
I
CPU I/O PORT   CEC_IN            (to IC2701)
B21 
P22 
O
CPU I/O PORT   AVLINK,2_OUT  (from Q2702)
A21 
P21 
I
CPU I/O PORT   AVLINK2_IN      (to Q2711)
A22 
P20 
O
CPU I/O PORT   PCON2            (to power-unit)
A23 
P19 
O
CPU I/O PORT   PCON1            (to power-unit)
B22 
P18 
O
CPU I/O PORT   AVLINK1_OUT   (to Q***)
B23 
P17 
I
CPU I/O PORT   AVLINK1_IN      (from Q***)
C21 
P16 
O
CPU I/O PORT   FPGA_SDE       (to IC1710)
C22 
P15 
O
CPU I/O PORT   FPGA_SDA       (to IC1710)
C23 
P14 
O
CPU I/O PORT   FPGA_SCK       (to IC1710)
D20 
P13 
O
CPU I/O PORT   FPGA_SDA0      (to IC1710)
D21 
P12 
O
CPU I/O PORT   FAN_ERR         (to power-unit)
D22 
P11 
O
CPU I/O PORT   MUTE_SP         (to Q1101/2)
D23 
P10
O
CPU I/O PORT   SV1JSW          (IN3SW  to IC1201)
E20 
P9 
O
CPU I/O PORT   STBY_POW      (to key-unit)
E21 
P8 
O
CPU I/O PORT   CEC1_OUT      (from IC2701)
E22 
P7 
O
CPU I/O PORT   LED_POW_G     (to R/C-unit)
E23 
P6 
O
CPU I/O PORT   LED_POW_R     (to R/C-unit)
F20 
P5 
I
CPU I/O PORT   NVM_CE_N      (to IC3503)
F21 
P4 
O
CPU I/O PORT   HDMI_RESET   (to IC1905)
F22 
P3 
O
CPU I/O PORT   LCD_POW       (to power-unit)
F23 
P2 
I
CPU I/O PORT   RXD              (to RS232C-driver)
G20 
P1
O
CPU I/O PORT   TXD              (to RS232C-driver)
G21 
P0
O
CPU I/O PORT   IRIN              (to R/C-unit)
U12, U16 
VDDA18_ADC 
S
Analog  Supply power for ADC (1.8V)   
U14, T17 
VDDA33_ADC 
S
Analog  Supply power for ADC (3.3V)   
K17 
VDDA33_CADC 
S
Analog  Supply power for CADC (3.3V)  
N17 
VDD_PLL 
S
Analog  Supply power for PLL (1.8V)  
U7 
VDDPLLVDS 
S
Analog  Supply power for LVDSPLL (1.8V)  
M7, J7, U8, G12, G13, L17, 
M17 
VDDD 
S
Core supply power (3.3V)  
N7,U10, R17, G14 
VDDP 
S
Pad supply power (3.3V)   
G10, G11, K7, L7 
VDDPSD 
S
DRAM interface supply power (2.5V)   
P7, U9 
VDDLVDS 
S
LVDS supply power.   (3.3V)
U11, U15 
VSSA18_ADC 
S
Analog ground for ADC.   
LC-42XD10E/RU
5 – 10
U13, U17 
VSSA33_ADC 
S
Analog ground for ADC.   
J17 
VSSA33_CADC 
S
Analog ground for CADC.   
P17 
VSS_PLL 
S
Analog ground for PLL.   
N14, P10, P14, N14, M14, 
L14, K14, K13, T7 
VSS 
S
Core & pad supply ground.   
K10, L10, K12, K11, M10 
VSSPSD 
S
DRAM interface supply ground.   
W20 
NC 
-
Not connected.   
LC-42XD10E/RU
5 – 11
4. IC3501/3502: RH-IXB765WJZZ
256Mb DDR SDRAM
Pin No.
Pin Name
I/O
Pin Function
45,46
CK, CK
I
Clock: CK and CK are differential clock inputs.
All address and control input signals are sampled on the positive edge of CK and negative edge of CK.
Output (read) data is referenced to both edges of CK.
Internal clock signals are derived from CK/CK.
44
CKE
I
Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, 
and device input buffers and output drivers.
Taking CKE Low provides PRECHARGE POWER DOWN and SELF REFRESH 
operction (all bank idle)
CKE is synchronous for POWER-DOWN entry and exit, and for SELF REFRESH entry.
CKE is asynchronous for SELF REFRESH exit, and for output disable.
CKE must be maintained high throughput READ and WRITE accesses.
Input buffers, excluding CK, CK and CKE are disabled during POWER-DOWN.
Input buffers, excluding CKE are disabled during SELF REFRESH. 
CKE is an SSTL_2 input, but will detect an LVCMOS Low level after Vdd is applied upon 
1st power up, After VREF has become stable during the power on and initialization 
sequence, it must be maintained for proper operation of the CKE receiver.
For proper SELF-REFRESH entry and exit, VREF must be maintained to this input.
24
CS
I
Chip Select: CS enables (registered LOW) and disables (registered HIGH) the command 
decoder.
All commands are masked when CS is registered HIGH.
CS provides for external bank selection on systems with multiple banks.
CS is considered part of the command code.
21-23
RAS, CAS, WE 
I
Command Inputs: RAS, CAS, and WE (along with CS) define the command being
 entered.
20,47
LDM,(UDM)
I
Input Data Mask: DM is an input mask signal for write data.
Input data is masked when DM is sampled HIGH along with that input data during a 
WRITE access.
DM is sampled on both edges of DQS.
Although DM pins are input only, the DM loading matches the DQ and DQS loading.
For the x16, LDM corresponds to the data on DQ0>D7; UDM corresponds to the 
data on DQ8>DQ15.
DM may be driven high, low, or floating during READs.
26,27
BA0, BA1
I
Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, READ,WRITE 
or PRECHARGE command is being applied.
28-32,
35-42
A [0: 12]
I
Address Inputs: Provide the row address for ACTIVE commands, and the column 
address and AUTO PRECHARGE bit for READ/WRITE commands, to select one 
location out of the memory array in the respective bank. 
A10 is sampled during a PRECHARGE command to determine whether the 
PRECHARGE applies to one bank (A10 LOW) or all banks (A10 HIGH).
If only one bank is to be procreated, the bank is selected by BA0, BA1. 
The address inputs also provide the op-code during a MODE REGISTER SET 
command. 
BA0 and BA1 define which mode register is loaded during the MODE REGISTER 
SET command (MRS or EMRS).
2,4,5,7,
8,10,
11,13,
54,56,
57,59,
60,62,
63,65
DQ
I/O
Data Input/Output: Data bus.
16,51
LDQS,(U)DQS
I/O
Data Strobe: Output with read data, input with write data. 
Edge-aligned with read data, centered in write data. 
Used to capture write data. 
For the x16, LDQS corresponds to the data on DQ0>D7; UDQS corresponds to
the data on DQ8>DQ15
14,17,
19,25,
43,50,
53,
NC
-
No Connect: No internal electrical connection is present.
3,9,15,
55,61
VDDQ
-
DQ Power Supply: +2.5V 
± 0.2V. (+2.6V ± 0.1V for DDR400)
6,12,
52,58,
64
VSSQ
-
DQ Ground.
1,18,33,
VDD
-
Power Supply: +2.5V 
± 0.2V. (+2.6V ± 0.1V for DDR400)
LC-42XD10E/RU
5 – 12
5. IC3503: RH-IXB754WJZZ
128Mb Flash Memory
34,48,
66
VSS
-
Ground.
49
VREF
I
SSTL_2 reference voltage.
Pin No.
Pin Name
I/O
Pin Function
I
2-12, 
15,  
18-26,
54, 31
A0-A22
I
23 Address lnputs.    
35,37,3
9,41,44
,46,48,
50
DQ0-DQ7
I/O
8 Data Inputs / Outputs.   
35-
42,44-
50
DQ8-DQ14
I/O
7 Data Inputs / Outputs.   
51
DQ15A-1
I
Data Input/Output or Address Input.
32
CE
I
Chip Enable. 
34
 OS
O
Output Enable.
13
WE
I
Write Enable. 
16
Vpp/WP
I
Hardware Vpp/ Write Protect 
14
RP
I
Reset/Block Temporary Unprotect.
17
R/B
O
Ready / Busy Output.    
53
BYTE
I
Byte/Word Organization Select.
43
VCC
-
Supply Voltage
33.52
VSS
-
Ground.    
27,28,5
5,56
NC
-
Not Connected Internally.    
29
VCCQ
-
Supply Voltage for Input/Output.
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