Sharp LC-42XD10E (serv.man5) Service Manual ▷ View online
LC-42XD10E/RU
5 – 9
V22
PORT_E_1
I/O
Port E data. NC
V20
PORT_E_0
I/O
Port E data. NC
T21
PORT_E_CLK
I/O
Port E data. NC
N20
PORT_F_9
O
Port F data. FRCI_7
P23
PORT_F_8
O
Port F data. FRCI_6
P21
PORT_F_7
O
Port F data. FRCI_5
P22
PORT_F_6
O
Port F data. FRCI_4
P20
PORT_F_5
O
Port F data. FRCI_3
R23
PORT_F_4
O
Port F data. FRCI_2
R21
PORT_F_3
O
Port F data. FRCI_1
R22
PORT_F_2
O
Port F data. FRCI_0
R20
PORT_F_1
O
Port F data. NC
T23
PORT_F_0
O
Port F data. NC
N21
PORT_F_CLK
O
Port F clock.
G22
PORT_G_9
I
Port G data. FRCO_7B
H23
PORT_G_8
I
Port G data. FRCO_6B
H21
PORT_G_7
I
Port G data. FRCO_5B
H22
PORT_G_6
I
Port G data. FRCO_4B
H20
PORT_G_5
I
Port G data. FRCO_3B
J23
PORT_G_4
I
Port G data. FRCO_2B
J21
PORT_G_3
I
Port G data. FRCO_1B
J22
PORT_G_2
I
Port G data. FRCO_0B
J20
PORT_G_1
I
Port G data. NC
K23
PORT_G_0
I
Port G data. NC
G23
PORT_G_CLK
I
Port G clock.
D19
P29
I
CPU I/O PORT HDMI_INT (from IC1905)
C19
P28
I
CPU I/O PORT HOTP_CONT1 (to EXT5)
B19
P27
I
CPU I/O PORT HOTP_CONT0 (to EXT5)
A19
P26
O
CPU I/O PORT POWER_ERR (to power-unit)
C20
P25
I
CPU I/O PORT BL_ERR (from INV)
B20
P24
I/O
CPU I/O PORT DTM_IRQ NC
A20
P23
I
CPU I/O PORT CEC_IN (to IC2701)
B21
P22
O
CPU I/O PORT AVLINK,2_OUT (from Q2702)
A21
P21
I
CPU I/O PORT AVLINK2_IN (to Q2711)
A22
P20
O
CPU I/O PORT PCON2 (to power-unit)
A23
P19
O
CPU I/O PORT PCON1 (to power-unit)
B22
P18
O
CPU I/O PORT AVLINK1_OUT (to Q***)
B23
P17
I
CPU I/O PORT AVLINK1_IN (from Q***)
C21
P16
O
CPU I/O PORT FPGA_SDE (to IC1710)
C22
P15
O
CPU I/O PORT FPGA_SDA (to IC1710)
C23
P14
O
CPU I/O PORT FPGA_SCK (to IC1710)
D20
P13
O
CPU I/O PORT FPGA_SDA0 (to IC1710)
D21
P12
O
CPU I/O PORT FAN_ERR (to power-unit)
D22
P11
O
CPU I/O PORT MUTE_SP (to Q1101/2)
D23
P10
O
CPU I/O PORT SV1JSW (IN3SW to IC1201)
E20
P9
O
CPU I/O PORT STBY_POW (to key-unit)
E21
P8
O
CPU I/O PORT CEC1_OUT (from IC2701)
E22
P7
O
CPU I/O PORT LED_POW_G (to R/C-unit)
E23
P6
O
CPU I/O PORT LED_POW_R (to R/C-unit)
F20
P5
I
CPU I/O PORT NVM_CE_N (to IC3503)
F21
P4
O
CPU I/O PORT HDMI_RESET (to IC1905)
F22
P3
O
CPU I/O PORT LCD_POW (to power-unit)
F23
P2
I
CPU I/O PORT RXD (to RS232C-driver)
G20
P1
O
CPU I/O PORT TXD (to RS232C-driver)
G21
P0
O
CPU I/O PORT IRIN (to R/C-unit)
U12, U16
VDDA18_ADC
S
Analog Supply power for ADC (1.8V)
U14, T17
VDDA33_ADC
S
Analog Supply power for ADC (3.3V)
K17
VDDA33_CADC
S
Analog Supply power for CADC (3.3V)
N17
VDD_PLL
S
Analog Supply power for PLL (1.8V)
U7
VDDPLLVDS
S
Analog Supply power for LVDSPLL (1.8V)
M7, J7, U8, G12, G13, L17,
M17
VDDD
S
Core supply power (3.3V)
N7,U10, R17, G14
VDDP
S
Pad supply power (3.3V)
G10, G11, K7, L7
VDDPSD
S
DRAM interface supply power (2.5V)
P7, U9
VDDLVDS
S
LVDS supply power. (3.3V)
U11, U15
VSSA18_ADC
S
Analog ground for ADC.
LC-42XD10E/RU
5 – 10
U13, U17
VSSA33_ADC
S
Analog ground for ADC.
J17
VSSA33_CADC
S
Analog ground for CADC.
P17
VSS_PLL
S
Analog ground for PLL.
N14, P10, P14, N14, M14,
L14, K14, K13, T7
VSS
S
Core & pad supply ground.
K10, L10, K12, K11, M10
VSSPSD
S
DRAM interface supply ground.
W20
NC
-
Not connected.
LC-42XD10E/RU
5 – 11
4. IC3501/3502: RH-IXB765WJZZ
256Mb DDR SDRAM
Pin No.
Pin Name
I/O
Pin Function
45,46
CK, CK
I
Clock: CK and CK are differential clock inputs.
All address and control input signals are sampled on the positive edge of CK and negative edge of CK.
Output (read) data is referenced to both edges of CK.
Internal clock signals are derived from CK/CK.
All address and control input signals are sampled on the positive edge of CK and negative edge of CK.
Output (read) data is referenced to both edges of CK.
Internal clock signals are derived from CK/CK.
44
CKE
I
Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals,
and device input buffers and output drivers.
Taking CKE Low provides PRECHARGE POWER DOWN and SELF REFRESH
operction (all bank idle)
CKE is synchronous for POWER-DOWN entry and exit, and for SELF REFRESH entry.
CKE is asynchronous for SELF REFRESH exit, and for output disable.
CKE must be maintained high throughput READ and WRITE accesses.
Input buffers, excluding CK, CK and CKE are disabled during POWER-DOWN.
Input buffers, excluding CKE are disabled during SELF REFRESH.
CKE is an SSTL_2 input, but will detect an LVCMOS Low level after Vdd is applied upon
1st power up, After VREF has become stable during the power on and initialization
sequence, it must be maintained for proper operation of the CKE receiver.
For proper SELF-REFRESH entry and exit, VREF must be maintained to this input.
and device input buffers and output drivers.
Taking CKE Low provides PRECHARGE POWER DOWN and SELF REFRESH
operction (all bank idle)
CKE is synchronous for POWER-DOWN entry and exit, and for SELF REFRESH entry.
CKE is asynchronous for SELF REFRESH exit, and for output disable.
CKE must be maintained high throughput READ and WRITE accesses.
Input buffers, excluding CK, CK and CKE are disabled during POWER-DOWN.
Input buffers, excluding CKE are disabled during SELF REFRESH.
CKE is an SSTL_2 input, but will detect an LVCMOS Low level after Vdd is applied upon
1st power up, After VREF has become stable during the power on and initialization
sequence, it must be maintained for proper operation of the CKE receiver.
For proper SELF-REFRESH entry and exit, VREF must be maintained to this input.
24
CS
I
Chip Select: CS enables (registered LOW) and disables (registered HIGH) the command
decoder.
All commands are masked when CS is registered HIGH.
CS provides for external bank selection on systems with multiple banks.
CS is considered part of the command code.
decoder.
All commands are masked when CS is registered HIGH.
CS provides for external bank selection on systems with multiple banks.
CS is considered part of the command code.
21-23
RAS, CAS, WE
I
Command Inputs: RAS, CAS, and WE (along with CS) define the command being
entered.
entered.
20,47
LDM,(UDM)
I
Input Data Mask: DM is an input mask signal for write data.
Input data is masked when DM is sampled HIGH along with that input data during a
WRITE access.
DM is sampled on both edges of DQS.
Although DM pins are input only, the DM loading matches the DQ and DQS loading.
For the x16, LDM corresponds to the data on DQ0>D7; UDM corresponds to the
data on DQ8>DQ15.
DM may be driven high, low, or floating during READs.
Input data is masked when DM is sampled HIGH along with that input data during a
WRITE access.
DM is sampled on both edges of DQS.
Although DM pins are input only, the DM loading matches the DQ and DQS loading.
For the x16, LDM corresponds to the data on DQ0>D7; UDM corresponds to the
data on DQ8>DQ15.
DM may be driven high, low, or floating during READs.
26,27
BA0, BA1
I
Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, READ,WRITE
or PRECHARGE command is being applied.
or PRECHARGE command is being applied.
28-32,
35-42
A [0: 12]
I
Address Inputs: Provide the row address for ACTIVE commands, and the column
address and AUTO PRECHARGE bit for READ/WRITE commands, to select one
location out of the memory array in the respective bank.
A10 is sampled during a PRECHARGE command to determine whether the
PRECHARGE applies to one bank (A10 LOW) or all banks (A10 HIGH).
If only one bank is to be procreated, the bank is selected by BA0, BA1.
The address inputs also provide the op-code during a MODE REGISTER SET
command.
BA0 and BA1 define which mode register is loaded during the MODE REGISTER
SET command (MRS or EMRS).
address and AUTO PRECHARGE bit for READ/WRITE commands, to select one
location out of the memory array in the respective bank.
A10 is sampled during a PRECHARGE command to determine whether the
PRECHARGE applies to one bank (A10 LOW) or all banks (A10 HIGH).
If only one bank is to be procreated, the bank is selected by BA0, BA1.
The address inputs also provide the op-code during a MODE REGISTER SET
command.
BA0 and BA1 define which mode register is loaded during the MODE REGISTER
SET command (MRS or EMRS).
2,4,5,7,
8,10,
11,13,
54,56,
57,59,
60,62,
57,59,
60,62,
63,65
DQ
I/O
Data Input/Output: Data bus.
16,51
LDQS,(U)DQS
I/O
Data Strobe: Output with read data, input with write data.
Edge-aligned with read data, centered in write data.
Used to capture write data.
For the x16, LDQS corresponds to the data on DQ0>D7; UDQS corresponds to
the data on DQ8>DQ15
Edge-aligned with read data, centered in write data.
Used to capture write data.
For the x16, LDQS corresponds to the data on DQ0>D7; UDQS corresponds to
the data on DQ8>DQ15
14,17,
19,25,
43,50,
19,25,
43,50,
53,
NC
-
No Connect: No internal electrical connection is present.
3,9,15,
55,61
VDDQ
-
DQ Power Supply: +2.5V
± 0.2V. (+2.6V ± 0.1V for DDR400)
6,12,
52,58,
64
VSSQ
-
DQ Ground.
1,18,33,
VDD
-
Power Supply: +2.5V
± 0.2V. (+2.6V ± 0.1V for DDR400)
LC-42XD10E/RU
5 – 12
5. IC3503: RH-IXB754WJZZ
128Mb Flash Memory
34,48,
66
VSS
-
Ground.
49
VREF
I
SSTL_2 reference voltage.
Pin No.
Pin Name
I/O
Pin Function
I
2-12,
15,
18-26,
54, 31
54, 31
A0-A22
I
23 Address lnputs.
35,37,3
9,41,44
9,41,44
,46,48,
50
DQ0-DQ7
I/O
8 Data Inputs / Outputs.
35-
42,44-
50
DQ8-DQ14
I/O
7 Data Inputs / Outputs.
51
DQ15A-1
I
Data Input/Output or Address Input.
32
CE
I
Chip Enable.
34
OS
O
Output Enable.
13
WE
I
Write Enable.
16
Vpp/WP
I
Hardware Vpp/ Write Protect
14
RP
I
Reset/Block Temporary Unprotect.
17
R/B
O
Ready / Busy Output.
53
BYTE
I
Byte/Word Organization Select.
43
VCC
-
Supply Voltage
33.52
VSS
-
Ground.
27,28,5
5,56
NC
-
Not Connected Internally.
29
VCCQ
-
Supply Voltage for Input/Output.
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