DOWNLOAD Sharp DV-660H (serv.man2) Service Manual ↓ Size: 1.96 MB | Pages: 51 in PDF or view online for FREE

Model
DV-660H (serv.man2)
Pages
51
Size
1.96 MB
Type
PDF
Document
Service Manual
Brand
Device
DVD / start to section 13-4
File
dv-660h-sm2.pdf
Date

Sharp DV-660H (serv.man2) Service Manual ▷ View online

DV-660S
DV-660H
41
RFA
O
RF total addition output
2.2[V]
42
EQB
I
Boost adjustment
VrD
When EQB is raised, the boost increases.
43
EQF
I
Frequency adjustment
VrD
When EQF is raised, shift to the
high frequency side occurs.
44
MDI1
I
Monitor input
45
LDO1
O
Drive output
46
P1TN
I
TE–input (DVD)
VrA
47
P1TP
I
TE+input (DVD)
VrA
48
NC
NC terminal
To be connected to GND
49
P1FN
I
FE–input (DVD)
VrA
50
P1TP
I
FE+input (DVD)
VrA
51
LDP1
I
APC polarity 1
Positive polarity when this terminal
is connected to Vcc.
52
P1DI
I
D input (DVD)
53
P1CI
I
C input (DVD)
VrA
54
P1BI
I
B input (DVD)
VrA
55
P1AI
I
A input (DVD)
VrA
56
GNDR
GND terminal (RF)
57
LDP2
I
APC polarity 2
Positive polarity when this terminal
is connected to Vcc.
58
P2AI
I
A input (CD)
VrA
59
P2BI
I
B input (CD)
VrA
60
P2CI
I
C input (CD)
VrA
61
P2DI
I
D input (CD)
VrA
62
GNDS
GND terminal (Servo)
63
P2FP
I
FE+input (CD)
VrA
64
P2FN
I
FE–input (CD)
VrA
Pin No. Terminal name
I/O
Operation function
Terminal DC Voltage(TYP.)
Remarks
Terminal
Terminal name
Function
10~13,16~20,9
A0~A8,A9R
Address input
8
RAS
Row address strobe
23
CAS
Column address strobe
1~5,24~27
DQ1~DQ8
Data input/Data output
22
OE
Output enable
7
WE
Light enable
1
Vcc
Power (5V)
28
Vss
Ground (0V)
21
NC
Not connected
11-4. IC401 IX1484GE
4M DRAM
P1FN
P1FP
LDP1
P1DI
P1CI
P1BI
P1AI
GNDR
LDP2
P2AI
P2BI
P2CI
P2DI
GNDS
P2FP
P2FN
DPDB
VccR
NC
NC
RFO
RPP
RPB
RPO
RPZ
VccS
DFTN
FEO
TEO
LVL
LccP
VCKF
NC
P1TP
P1TN
LDO1
MDI1
EQF
EQB
RFA
RFDC
GND2
EQD
NC
Vcc2
PSC
FEB
TEB
GND
P2TP
P2TN
LDO2
MDI2
VrA
VrD
Vdd
DPAC
DPBD
DPD1
DPD2
SCB
SCL
SCD
SRCK
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
APC1
sel-RF
R-gain
Adjust
EQ
F-gain
Adjust
F-gain
Adjust
RF Ripple
creation
FE creation
DPDTE
creation
FE-gain
Adjust
TE-gain
Adjust
Level detect
T-gain
Adjust
3BTE creation
APC2
B U S
Time
constant 
adjustment
sel-PD
sel-PD
sel-PD
mode-TE
sel-FE
sel-IC
sel-TE
sel-DPD
sel-LVL
• Block Diagram
11-4
DV-660S
DV-660H
11-5. IC402 IX1474GE    DEM/ECC (DVD)
Pin No.
Terminal name
I/O
Operation function
Remarks
1
DPCK1
I
Signal processing reference clock input.
0.5-3.3Vp-p Feedback
resistor built in.
2
DVDD3
Digital power. (3.3V)
For logic cell
3
SVCK1
I
Servo reference clock input. (Oscillation circuit input terminal)
3.3V-I/F Feedback
4
SVCK0
O
Servo reference clock output. (Oscillation circuit input terminal)
resistor built in.
5
DVSS
Digital power. (0V)
For logic cell
6
DVDD2
Digital power. (3.3V)
For logic cell
7
N.C.
User use prohibited.
Open
8
HDWT
I
MPU write signal.
TTL level
9
HDRD
I
MPU read signal.
TTL level
10
HCEN
I
MPU chip selection.
TTL level
11
HD0
I/O
MPU data bus.
TTL level
12
HD1
I/O
MPU data bus.
TTL level
13
HD2
I/O
MPU data bus.
TTL level
14
HD3
I/O
MPU data bus.
TTL level
15
HD4
I/O
MPU data bus.
TTL level
16
HD5
I/O
MPU data bus.
TTL level
17
HD6
I/O
MPU data bus.
TTL level
18
HD7
I/O
MPU data bus.
TTL level
19
DVSS
Digital power. (0V)
For I/O cell
20
DVDD5
Digital power. (5V)
For I/O cell
21
HINT
O
MPU interruption signal. (Occurrence of interruption = “L”)
OPEN DRAIN
22
HA0
I
MPU address bus.
TTL level
23
HA1
I
MPU address bus.
TTL level
24
PLCK
I/O
Read channel clock input/output terminal.
25
ED0
User use is prohibited (N.C.) since it is for shipping adjustment.
Open
26
ED1
27
ED2
28
ED3
29
ED4
30
ED5
31
ED6
32
ED7
33
TEST
I
For shipping adjustment.
Set to “L”
34
PDON
O
PLL phase error signal output. (Negative polarity)
35
PDOP
O
PLL phase error signal output. (Positive polarity)
36
RLLD
O
RLL detection result output.
37
LPFN
I
PLL loop filter amp. reverse input.
38
LPFO
O
PLL loop filter amp. output.
39
VCOF
O
VCO filter terminal.
40
SLCO
O
Built-in comparator reference voltage output terminal.
41
AVSS
Analog power. (0V)
42
AVR
O
Non-PLL system analog reference potential. (1.65V)
43
VRC
Resistance division point potential. (For analog reference
potential generation: 1.65)
44
PVR
O
PLL system analog reference potential. (1.65V)
45
AVDD
Analog power. (3.3V)
46
RVR2
2nd reference voltage. (For capacitor connection)
47
RVDD
Exclusive-use power terminal. (3.3V)
48
RFIN
I
RF signal input.
49
RVSS
Exclusive-use power terminal. (0V)
50
RVR1
1nd reference voltage. (For capacitor connection)
51
DVR
I
DMO reference potential. (1.65V recommended)
52
DMO
O
Disc equalizer output for DVD. (Triple value PWM + HiZ)
53
RASN
O
External RAM row address selection. (Negative logic)
54
CASN
O
External RAM row address selection. (Negative logic)
11-5
DV-660S
DV-660H
Pin No.
Terminal name
I/O
Operation function
Remarks
55
MOEN
O
External RAM output permission signal.
56
MWEN
O
External RAM read/write selection.
57
DVSS
Digital power. (0V)
For logic cell
58
DVDD3
Digital power. (3.3V)
For logic cell
59
MA9
O
External RAM address bus.
60
MA8
O
External RAM address bus.
61
MA7
O
External RAM address bus.
62
MA6
O
External RAM address bus.
63
MA5
O
External RAM address bus.
64
MA4
O
External RAM address bus.
65
MA3
O
External RAM address bus.
66
MA2
O
External RAM address bus.
67
MA1
O
External RAM address bus.
68
MA0
O
External RAM address bus.
69
DVSS
Digital power. (0V)
For I/O cell
70
DVDD5
Digital power. (5V)
For I/O cell
71
MD7
I/O
External RAM data bus.
TTL level
72
MD6
I/O
External RAM data bus.
TTL level
73
MD5
I/O
External RAM data bus.
TTL level
74
MD4
I/O
External RAM data bus.
TTL level
75
MD3
I/O
External RAM data bus.
TTL level
76
MD2
I/O
External RAM data bus.
TTL level
77
MD1
I/O
External RAM data bus.
TTL level
78
MD0
I/O
External RAM data bus.
TTL level
79
SD7
O
MPEG data output.
80
SD6
O
MPEG data output.
81
SD5
O
MPEG data output.
82
SD4
O
MPEG data output.
83
DVSS
Digital power. (0V)
For logic cell
84
DVDD3
Digital power. (3.3V)
For logic cell
85
SD3
O
MPEG data output.
86
SD2
O
MPEG data output.
87
SD1
O
MPEG data output.
88
SD0
O
MPEG data output.
89
SERR
O
MPEG data reliability flag. (Data error: “L”)
90
SBGN
O
MPEG output sector sync signal. (Sector top: “L”)
91
SENB
O
MPEG data effective flag. (Effective state: “L”)
92
SDCK
O
MPEG data transfer clock.
93
DVSS
Digital power. (0V)
For logic cell
94
SREQ
I
MPEG data request flag. (Request state: “L”)
TTL level
95
RSTN
I
Hard reset input. (Reset state: “L”)
96
DVDD3
Digital power. (3.3V)
For logic cell
97
STDA
O
Operation state monitor data.
Common with PWM.
(Output synchronizing with SDCK fall)
98
STCK
O
Operation state monitor sync signal. (Data top bit: “L”)
Common with PWM.
99
UPWM
O
General-use PWM output.
4mA, 5V-I/F
100
DVSS
Digital power. (0V)
For logic cell
11-6
DV-660S
DV-660H
11-6. IC501 IX1539GE
FLASH
Symbol
Type
Name and function
Byte selection address: When the device is in the x8 mode, the low or high order byte is
DQ
15
/A
-1
Input
selected. It is not used in the x16 mode.
(If BYTE# is high, DQ
15
/A
-1
 input circuit does not operate.)
A
0
-A
12
Input
Word selection address: Selection of one word of 16k byte block. These addresses are
latched during data wiring operation.
A
13
-A
17
Input
Block selection address: Selection of 1/32 erase block. These addresses are latched
during data writing, erasing and lock block operation.
Low order byte data input/output: Command user interface writing cycle data and command
DQ
0
-DQ
7
Input/Output
input. Various data read memory identifier and status data output Chip nonselection or output
disable: Float state
DQ
8
-DQ
15
Input/Output
High order byte data input/output: The function is the same as that of low order byte data
input/output. Operative only in x16 mode. x8 mode: Float state DQ
15
/A
-1
 is address.
CE#
Input
Chip enable: Device control logic, input buffer, decoder and sense amp. are activated.
Chip becomes active only when CE# is “Low”.
Reset/Power down: If RP# is set to “Low”, the control circuit is initialized when power is turned
on. Hence, the RP#pin is set to “Low”. When power is turned on or off or in case of fluctuation it
RP#
Input
is kept at “Low” so as to protect data from noise. When RP# is in “Low” state, the device is in
deep power down state. 480 ns is required to recover from the deep power down state. If the RP#
pin becomes “Low”, the whole chip operation is interrupted and reset. After recovery the device is set
to array read state.
OE#
Input
Output enable: When OE# is set to “Low”, data is output from the DQ pin. When OE# is
set to “High”, the DQ pin is set to float state.
Write enable: Command user interface, data Q register and address Q latch access is controlled.
WE#
Input
In “Low” state WE# becomes active. At rise edge the address and data are fetched.
Ready/busy: The state of internal write state machine is output. In “Low” state it is indicated that the
RY/BY#
Output
write state machine is in operation. If the write state machine waits for next operation instruction, erase
is suspended or it is in deep power down state, the RY/BY# pin is in float state.
Byte enable: When BYTE# is set to “Low”, the device is set to the x8 mode. At this time the
BYTE#
Input
DQ
8
-DQ
15
 pin becomes float state. Address A
-1
 selects high order/low order byte.
When BYTE# is “High”, the device is set to the x16 mode. The A
-1
 input circuit is disabled.
Vpp
Write/erase power supply: 5.0 
±
 0.5V is applied during writing/erasing.
Vcc
Device power supply: 5.0 
±
 0.5V
GND
Ground
NC
Nonconnection
• Block Diagram
ID
Register
CSR
ESRs
DQ
8-15
DQ
0-7
OUTPUT MULTIPLEXER
Program Erase
Voltage Switch
BYTE#
CUI
WSM
16-KBYTE
Block 31
16-KBYTE
Block 30
16-KBYTE
Block 1
16-KBYTE
Block 0
CE#
OE#
WE#
RP#
RY/BY#
V
PP
V
CC
GND
Y GATING/SENSING
X-DECODER
Y-DECODER
Input
Buffer
ADDRESS
QUEUE
LATCHES
ADDRESS
COUNTER
A
-1.0~17
Output
Buffer
Output
Buffer
Input
Buffer
Input
Buffer
I/O Logic
DATA
QUEUE
REGISTER
Register
Data 
Comparator
11-7
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