Panasonic TH-42PR11EH Service Manual ▷ View online
5
TH-42PR11EH
2.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70
°F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20
°F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
6
TH-42PR11EH
3 Service Navigation
3.1.
Service Hint
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
(Part No. TZSC07040)
Board Name
Function
DN
Digital Signal Processor, Microcomputer
D
Format Converter, Plasma AI Processor
Sub-Field Processor
Sub-Field Processor
DS
Slot Interface (Audio / Video / Sync Input
Switch),
Sync Processor, Audio Processor,
Speaker Out Amplifier, DC-DC Converter
Switch),
Sync Processor, Audio Processor,
Speaker Out Amplifier, DC-DC Converter
SS
Sustain drive
SC
Scan drive
SU
Scan out (Upper)
SD
Scan out (Lower)
C1
Data drive (Right)
C2
Data drive (Left)
SP
Speaker
S
Power switch
K
Remote receiver, LED-G, R
GK
Key switch
P
Power supply
HX
PC / RS-232C_Input terminal
7
TH-42PR11EH
3.2.
Applicable signals
8
TH-42PR11EH
4 Specifications
Power Source
220-240 V AC, 50/60Hz
Power Consumption
Power on
275 W
Stand-by condition
Save OFF 1.8 W, Save ON 0.9 W
Power off condition
0.5 W
Plasma Display panel
Drive method: AC type 42-inch,
16:9 aspect ratio
16:9 aspect ratio
Screen size
922 mm (W)
× 518 mm (H) × 1,057 mm (diagonal)
(No. of pixels)
786,432 (1,024 (W)
× 768 (H) [3,072 × 768 dots]
Operating condition
Temperature
0
°C - 40 °C
Humidity
20 % - 80 %
Applicable signals
Scanning format
525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /
60i 60p 50i 50p 24p 25p 30p 24sF 1250 (1080) / 50i
60i 60p 50i 50p 24p 25p 30p 24sF 1250 (1080) / 50i
PC signals
VGA, SVGA, XGA
SXGA, UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
SXGA, UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
PC IN
(HIGH-DENSITY Mini-D-SUB 15PIN)
Y or G with sync 1.0 Vp-p (75-ohm)
Y or G without sync 0.7 Vp-p (75-ohm)
Y or G without sync 0.7 Vp-p (75-ohm)
B/P
B
/C
B
: 0.7 Vp-p (75-ohm)
R/P
R
/C
R
: 0.7 Vp-p (75-ohm)
HD/VD: 1.0 - 5.0 Vp-p (high impedance)
VBS (use HD port)
with picture 1.0 Vp-p (high impedance)
without picture 0.3 Vp-p (high impedance)
without picture 0.3 Vp-p (high impedance)
AUDIO IN (M3 JACK)
0.5 Vrms (high impedance)
SERIAL
EXTERNAL CONTROL TERMINAL (D-SUB 9PIN)
RS-232C COMPATIBLE
Accessories Supplied
Fixing bands
TMME203
× 1
Dimensions (W
× H × D)
1,020 mm
× 705 mm × 95 mm
(109 mm when including protruding portion of slots)
Mass (weight)
approx. 27.0 kg net
Sound
Speaker
120 mm
× 60 mm × 2 pcs, 8-ohm
Audio Output
20 W [10 W + 10 W] (10 % THD)
Note:
• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
• This equipment complies with the EMC standards listed below.
• This equipment complies with the EMC standards listed below.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.
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