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TH-103PF12E

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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TH-103PF12E

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 

°F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 

°F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 

°F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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TH-103PF12E

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TH-103PF12E

Board Name

Function

Board Name

Function

DN

Digital Signal Processor, Microcomputer

S1

Power switch

D

Format Converter, Plasma AI Processor
Sub-Field Processor

C1 (upper) 

Data drive (1) (upper)

C2 (upper)

Data drive (2) (upper)

DS 

Slot Interface (Audio / Video / Sync Input Switch), 
Sync Processor, Audio Processor, DC-DC Converter

C3 (upper)

Data drive (3) (upper)

C4 (upper)

Data drive (4) (upper)

SC

Scan drive

C5 (upper)

Data drive (5) (upper)

SU

Scan out (Upper)
Non serviceable.
SU-Board should be exchanged for service.

C6 (upper)

Data drive (6) (upper)

C1 (lower) 

Data drive (1) (lower)

C2 (lower)

Data drive (2) (lower)

SM

Scan out (Middle)
Non serviceable.
SM-Board should be exchanged for service.

C3 (lower)

Data drive (3) (lower)

C4 (lower)

Data drive (4) (lower)

C5 (lower)

Data drive (5) (lower)

SD

Scan out (Lower)
Non serviceable.
SD-Board should be exchanged for service.

C6 (lower)

Data drive (6) (lower)

P(MAIN_1)

Power supply

P(MAIN_2)

Power supply

SS

Sustain drive

P(SUB)

Power supply

SS2

Sustain out (Upper)

PB

Fan Control

SS3

Sustain out (Lower)

HX 

PC / RS-232C

V1

LED-G, R

H5 

Audio Out terminal

V2

Key switch

HDE

DVI-D terminal

V3

Remote receiver

HL

Component Video terminal (BNC), LAN terminal