Panasonic TH-103PF12E Service Manual ▷ View online
5
TH-103PF12E
2.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70
°F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20
°F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
6
TH-103PF12E
3 Service Navigation
3.1.
Service Hint
7
TH-103PF12E
Board Name
Function
Board Name
Function
DN
Digital Signal Processor, Microcomputer
S1
Power switch
D
Format Converter, Plasma AI Processor
Sub-Field Processor
Sub-Field Processor
C1 (upper)
Data drive (1) (upper)
C2 (upper)
Data drive (2) (upper)
DS
Slot Interface (Audio / Video / Sync Input Switch),
Sync Processor, Audio Processor, DC-DC Converter
Sync Processor, Audio Processor, DC-DC Converter
C3 (upper)
Data drive (3) (upper)
C4 (upper)
Data drive (4) (upper)
SC
Scan drive
C5 (upper)
Data drive (5) (upper)
SU
Scan out (Upper)
Non serviceable.
SU-Board should be exchanged for service.
Non serviceable.
SU-Board should be exchanged for service.
C6 (upper)
Data drive (6) (upper)
C1 (lower)
Data drive (1) (lower)
C2 (lower)
Data drive (2) (lower)
SM
Scan out (Middle)
Non serviceable.
SM-Board should be exchanged for service.
Non serviceable.
SM-Board should be exchanged for service.
C3 (lower)
Data drive (3) (lower)
C4 (lower)
Data drive (4) (lower)
C5 (lower)
Data drive (5) (lower)
SD
Scan out (Lower)
Non serviceable.
SD-Board should be exchanged for service.
Non serviceable.
SD-Board should be exchanged for service.
C6 (lower)
Data drive (6) (lower)
P(MAIN_1)
Power supply
P(MAIN_2)
Power supply
SS
Sustain drive
P(SUB)
Power supply
SS2
Sustain out (Upper)
PB
Fan Control
SS3
Sustain out (Lower)
HX
PC / RS-232C
V1
LED-G, R
H5
Audio Out terminal
V2
Key switch
HDE
DVI-D terminal
V3
Remote receiver
HL
Component Video terminal (BNC), LAN terminal
8
TH-103PF12E
3.2.
Applicable signals
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