DOWNLOAD Panasonic TH-103PB1E Service Manual ↓ Size: 8 MB | Pages: 76 in PDF or view online for FREE

Model
TH-103PB1E
Pages
76
Size
8 MB
Type
PDF
Document
Service Manual
Brand
Device
Plasma / GPF15DMON2 CHASSIS
File
th-103pb1e.pdf
Date

Panasonic TH-103PB1E Service Manual ▷ View online

5
TH-103PB1E
2.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 
°F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 
°F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 
°F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
6
TH-103PB1E
3 Service Navigation
3.1.
Service Hint
7
TH-103PB1E
Board Name
Function
Board Name
Function
A
Digital Core Signal Processor
Non serviceable
A-Board should be exchanged for service.
C2 (upper)
Data driver (2) (upper)
Non serviceable
C2 (upper)-Borad should be exchanged for service.
D
Format Converter, Plasma AI Processor
Sub-Field Processor
Non serviceable
D-Borad should be exchanged for service.
C3 (upper)
Data driver (3) (upper)
Non serviceable
C3 (upper)-Borad should be exchanged for service.
DS
Slot Interface
Non serviceable
DS-Borad should be exchanged for service.
C4 (upper)
Data driver (4) (upper)
Non serviceable
C4 (upper)-Borad should be exchanged for service.
SC
Scan drive
Non serviceable
SC-Borad should be exchanged for service.
C5 (upper)
Data driver (5) (upper)
Non serviceable
C5 (upper)-Borad should be exchanged for service.
SU
Scan out (upper)
Non serviceable
SU-Borad should be exchanged for service.
C6 (upper)
Data driver (6) (upper)
Non serviceable
C6 (upper)-Borad should be exchanged for service.
SM
Scan out (middle)
Non serviceable
SM-Borad should be exchanged for service.
C1 (lower)
Data driver (1) (lower)
Non serviceable
C1 (lower)-Borad should be exchanged for service.
SD
Scan out (lower)
Non serviceable
SD-Borad should be exchanged for service.
C2 (lower)
Data driver (2) (lower)
Non serviceable
C2 (lower)-Borad should be exchanged for service.
SS
Sustain drive
Non serviceable
SS-Borad should be exchanged for service.
C3 (lower)
Data driver (3) (lower)
Non serviceable
C3 (lower)-Borad should be exchanged for service.
SS2
Sustain connector (upper)
Non serviceable
SS2-Borad should be exchanged for service.
C4 (lower)
Data driver (4) (lower)
Non serviceable
C4 (lower)-Borad should be exchanged for service.
SS3
Sustain connector (lower)
Non serviceable
SS3-Borad should be exchanged for service.
C5 (lower)
Data driver (5) (lower)
Non serviceable
C5 (lower)-Borad should be exchanged for service.
V1
LED-G, R
Non serviceable
V1-Borad should be exchanged for service.
C6 (lower)
Data driver (6) (lower)
Non serviceable
C6 (lower)-Borad should be exchanged for service.
V2
Key switch
Non serviceable
V2-Borad should be exchanged for service.
P(MAIN_1)
Power supply
Non serviceable
P(MAIN_1)-Borad should be exchanged for service.
V3
Remote receiver, AI Sensor
Non serviceable
V3-Borad should be exchanged for service.
P(MAIN_2)
Power supply
Non serviceable
P(MAIN_2)-Borad should be exchanged for service.
S1
Power switch
Non serviceable
S1-Borad should be exchanged for service.
P(SUB)
Power supply
Non serviceable
P(SUB)-Borad should be exchanged for service.
C1 (upper)
Data driver (1) (upper)
Non serviceable
C1 (upper)-Borad should be exchanged for service.
HX
RS232C / PC / DVI / RCA / AUDIO IN / LINE OUT
Non serviceable
HX-Borad should be exchanged for service.
8
TH-103PB1E
3.2.
Applicable signals
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