DOWNLOAD Panasonic KX-NT700RU Service Manual ↓ Size: 5.34 MB | Pages: 96 in PDF or view online for FREE

ORDER NO. KMS1001750CE

(for Russia)

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1 Safety Precautions -----------------------------------------------3

1.1. For  Technicians  -------------------------------------------3

2 Warning --------------------------------------------------------------3

2.1. Battery Caution ---------------------------------------------3
2.2. Caution--------------------------------------------------------3
2.3. About Lead Free Solder (PbF: Pb free) --------------3

2.3.1. Suggested PbF Solder -------------------------------4

2.4. Discarding of P. C. Board --------------------------------4

3 Specifications ------------------------------------------------------5

3.1. General Descriptions--------------------------------------5

4 Technical Descriptions------------------------------------------6

4.1. Block Diagram ----------------------------------------------6
4.2. Circuit Operations ------------------------------------------7

4.2.1. Power Supply Circuit ---------------------------------7
4.2.2. Reset Circuit --------------------------------------------8
4.2.3. Ethernet Circuit ----------------------------------------8
4.2.4. TELEPHONE LINE -----------------------------------9
4.2.5. Key Input Control Circuit (PANEL BOARD)--- 11
4.2.6. SIGNAL ROUTE------------------------------------- 12

5 Location of Controls and Components------------------ 20

5.1. Main View -------------------------------------------------- 20
5.2. Control Panel---------------------------------------------- 21

6 Installation Instructions--------------------------------------- 22

6.1. Basic Connections --------------------------------------- 22

7 Troubleshooting Guide---------------------------------------- 23

7.1. Troubleshooting Flowchart----------------------------- 23
7.2. Maintenance Mode -------------------------------------- 25

7.2.1. Display Test ------------------------------------------- 25
7.2.2. Key Test------------------------------------------------ 29
7.2.3. Hardware Test---------------------------------------- 30
7.2.4. Beamforming Test ----------------------------------- 31
7.2.5. Mic Line Test------------------------------------------ 32

7.3. Port Output------------------------------------------------- 34
7.4. No Operation ---------------------------------------------- 35

7.4.1. Power Supply: AC adaptor------------------------ 35
7.4.2. Power Supply: PoE Hub --------------------------- 35

7.5. LCD Trouble ----------------------------------------------- 37
7.6. Speaker and Microphone Trouble-------------------- 38

7.6.1. SP Phone Reception (from LAN, TEL, or

Audio to Speaker) ----------------------------------- 38

7.6.2. SP Phone Transmission (form MIC to

LAN, TEL, or Audio) -------------------------------- 38

7.7. LAN port Trouble ----------------------------------------- 41
7.8. USB port Trouble----------------------------------------- 42
7.9. SD CARD Trouble --------------------------------------- 42

7.10. TEL Line Trouble ----------------------------------------- 43

7.10.1. No Dial Tone ------------------------------------------ 43
7.10.2. No Ringing Tone ------------------------------------- 43
7.10.3. Cannot send DTMF DIALING -------------------- 44

7.11. External Microphone Trouble ------------------------- 45

7.11.1. EXT MIC1 Transmission--------------------------- 45
7.11.2. EXT MIC2 Transmission--------------------------- 45

8 Disassembly Instructions ------------------------------------ 46

8.1. Disassembly Instructions------------------------------- 46

8.1.1. How To Remove Cabinet Cover. [No.1]

(Procedures No.1)----------------------------------- 46

8.1.2. How To Remove Main Board. [No.2]

(Procedures No.1ÆNo.2) ------------------------- 46

8.1.3. How To Remove Panel Board. [No.3]

(Procedures No.1ÆNo.2ÆNo.3) --------------- 47

8.1.4. How To Remove Speaker. [No.4]

(Procedures No.1ÆNo.2ÆNo.3ÆNo.4)  ----- 48

8.1.5. How To Remove Mic. [No.5] (Procedures

No.1ÆNo.5) ------------------------------------------ 48

8.1.6. How To Remove LED LENS. [No.6]

(Procedures No.1ÆNo.2ÆNo.6) --------------- 49

9 Maintenance------------------------------------------------------ 50

9.1. Terminal Guide of ICS, Transistors and

Diodes ------------------------------------------------------ 50

9.2. How To Replace a Flat Package IC----------------- 51

9.2.1. Preparation ------------------------------------------- 51
9.2.2. Removal Procedure -------------------------------- 51
9.2.3. Procedure--------------------------------------------- 52
9.2.4. Removing Solder From Between Pins--------- 52

10 Schematic Diagram -------------------------------------------- 53

10.1. Block Diagram -------------------------------------------- 53
10.2. Schematic Diagram ------------------------------------- 54

10.2.1. Main Board ------------------------------------------- 54
10.2.2. Panel Board ------------------------------------------ 72

10.3. Waveform-------------------------------------------------- 74

11 Printed Circuit Board------------------------------------------ 79

11.1. Main Board ------------------------------------------------ 79

11.1.1. Component View------------------------------------ 79
11.1.2. Flow Solder Side View----------------------------- 80

11.2. Panel Board----------------------------------------------- 81

11.2.1. Component View------------------------------------ 81
11.2.2. Flow Solder Side View----------------------------- 81

12 Appendix Information of Schematic Diagram -------- 82
13 Exploded View and Replacement Parts List----------- 83

13.1. Cabinet and Electric Parts----------------------------- 83
13.2. Accessories and Packing Materials----------------- 84
13.3. Replacement Parts List -------------------------------- 85

13.3.1. Cabinet and Electrical Parts---------------------- 85
13.3.2. Accessories and Packing Materials ------------ 85
13.3.3. Main Board Parts ----------------------------------- 85
13.3.4. Panel Board Parts ---------------------------------- 95

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• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not touch IC or LSI pins with bare fingers.

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufac-
turer. Dispose of used batteries according to the manufacturer's instructions.

The lithium battery is a critical component (type No. CR2032). Please observe for the proper polarity and the exact location when
replacing it and soldering the replacement lithium battery in.

The power socket wall outlet should be located near this equipment and be easily accessible.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C). 

Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

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There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with othermateri-
als. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.