DOWNLOAD Panasonic SU-HTB500EB / SU-HTB500EEK / SU-HTB500EG / SC-HTB500EB / SC-HTB500EE / SC-HTB500EG Service Manual ↓ Size: 9.08 MB | Pages: 117 in PDF or view online for FREE

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There are special components used in this equipment which are important for safety.
These parts are marked by   in the Schematic Diagrams & Replacement Parts List. It is essential that these critical parts should
be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design without
permission of manufacturer.

Safety

Ref. No.

Part No.

Part Name & Description

Remarks

2

REXX1104

2P RED/BLACK WIRE (AC INLET-SMPS)

17

RGNX1161-K1

SPEC LABEL

EG

17

RGNX1162-K1

SPEC LABEL

EB

17

RGNX1163-K2 SPEC 

LABEL

EE

A2

RFAX1027B

AC CORD/W FERRITE CORE

EG/EE

A2

RFAX1027C

AC CORD/W FERRITE CORE

EB

A3

RQTX1180-D

O/I BOOK (Ge/Fr/It/Po/Cz)

EG

A3

RQTX1181-H

O/I BOOK (Du/Sw/Da/Sp)

EG

A3

RQTX1182-B

O/I BOOK (En)

EB

A3

RQTX1185-B

O/I BOOK (En)

EG

A3

RQTX1184-R 

O/I BOOK (Ru/Ur)

EE

PCB5

REPX0841HA

SMPS P.C.B.

(RTL)

PCB6

REPX0841HA

AC INLET P.C.B.

(RTL)

DZ5701

ERZV10V511CS

ZNR

L5701

ELF17N005A

LINE FILTER

L5702

ELF19H010A

LINE FILTER

T5703

ETS28BH1K6AC

MAIN TRANSFOMER

T5751

ETS19AB2A6AG

SUB TRANSFORMER

PC5720

B3PBA0000402

PHOTO COUPLER

PC5799

B3PBA0000402

PHOTO COUPLER

F1

K5D252BNA005

FUSE

RY5701

K6B1AEA00003

RELAY

FP700

K5H302100004

FUSE PROTECTOR

TH5702

D4CAA5R10001

THERMISTOR

P5701

K2AAYA000001

AC INLET

C5700

F1BAF1020020

1000pF

C5701

F0CAF104A105

0.1uF

C5702

F0CAF104A105

0.1uF

C5703

F0CAF104A105

0.1uF

C5704

F1BAF471A013

470pF

C5708

F1BAF471A013

470pF

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Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called Electrostat-
ically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semicon-
ductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by
electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-

ium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).