DOWNLOAD Panasonic SA-PM200EB / SA-PM200EG / SA-PM200EP / SC-PM200EP Service Manual ↓ Size: 10.43 MB | Pages: 109 in PDF or view online for FREE

5

Disconnect AC power, discharge unit AC Capacitors as such C702, C710, C725, C727 and C728 through a 10W, 1W resistor to
ground.
Caution : DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.

• Current consumption at AC 220 - 240V, at 50Hz in NO SIGNAL mode (at volume min in FM Tuner mode) should be ~200 mA.

The protection circuitry may have operated if either of the following conditions are noticed:

• No sound is heard when the power is turned on.
• Sound stops during a performance.

The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:

1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.

Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

There are special components used in this equipment which are important for safety.

These parts are marked by   in the Schematic Diagrams, Exploded View & Replacement Parts List. It is essential that these
critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the
original design without permission of manufacturer.

Table 1

Safety

Ref. No.

Part No.

Part Name & Description

Remarks

8

RYK1650C-K

REAR CABINET ASS’Y

EB/EG

8

RYK1650A-K

REAR CABINET ASS’Y

EP

15

RGN3037J-K

NAME PLATE

EP

301

RAEX1033Z-V

TRAVERSE ASS’Y

A2

K2CQ2CA00007

AC CORD

EG/EP

A2

K2CZ3YY00005

AC CORD

EB

A3

RQT9546-D

O/I BOOK (Ge/It/Fr/Sp/Du/Da/Sw)

EG

A3

RQT9547-R

O/I BOOK (En)

EP

A3

RQT9548-B

O/I BOOK (En)

EB

PCB2

REPX0917A

SMPS P.C.B.

(RTL)

Z752

ERZVA5Z471

ZNR

SW7900

D4FBR5000009

RESETTABLE FUSE

L702

G0B183E00004

LINE FILTER

T701

ETS28BT11GAC

MAIN TRANSFORMER

PC701

B3PBA0000503

PHOTO COUPLER

PC702

B3PBA0000503

PHOTO COUPLER

F751

K5G312Y00007

FUSE

TH701

D4CAA5R10001

THERMISTOR

TH702

D4CC11040013

THERMISTOR

P751

K2AA2B000011

AC INLET

R724

ERJ12YJ155U

1.5M     1/2W

R726

ERJ12YJ155U

1.5M     1/2W

C702

F0CAF104A105

0.1uF

C710

F1BAF2220023

2200pF

C725

F0CAF104A105

0.1uF

C727

F1BAF1020020

1000pF

C728

F1BAF1020020

1000pF

6

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-

ium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution :

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).

7

This product utilizes a laser diode with the unit turned "on", invisible laser radiation is emitted from the pickup lens.
Wavelength: 790 nm (CD)
Maximum output radiation power from pickup: 100 

μW/VDE

Laser radiation from the pickup unit is safety level, but be sure the followings: 

1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous. 
2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pickup lens for a long time.

Dieses Produkt enthält eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheitadg-
estrahit.
Wellenlänge : 790nm (CD)
Maximale Strahlungsleistung der Lasereinheit :100 

μW/VDE

Die Strahlung an der Lasereinheit ist ungefährlich, wenn folgende Punkte beachtet werden:

1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefährlich ist.
2. Den werkseitig justierten Einstellregler der Lasereinhit nicht verstellen.
3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken.
4. Nicht über längere Zeit in die Fokussierlinse blicken.

THIS PRODUCT UTILIZES A LASER.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.

8

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86

°F) more than that

of the normal solder.

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)