Sony KDS-55A2000 Service Manual ▷ View online
HISTORY
Model Name :
SERVICE MANUAL
SERVICE MANUAL
Click on Page Number to display detail of changes.
KDS-55A2000
Date Part Number Description of Revisions
Version
1.0
9-927-533-01
2006.07
Original Manual.
2.0
9-927-533-02
2007.03
Correction of Electrcal Adjustments for Data Write Function
(P.30)
- 1 -
KDS-55A2000
RM-ED006
SERVICE MANUAL
SP-3
CHASSIS
MODEL
COMMANDER
DEST
KDS-55A2000
RM-ED006
UK
RM-ED006
KDS-55A2000
MODEL
COMMANDER
DEST
KDS-55A2000
RM-ED006
AEP
SXRD PROJECTION TV
SXRD PROJECTION TV
SXRD PROJECTION TV
SXRD PROJECTION TV
SXRD PROJECTION TV
- 2 -
KDS-55A2000
RM-ED006
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
6
1. SELF DIAGNOSIS FUNCTION
Self Diagnostic Software ....................................
7
2. GENERAL ...................................................................
10
3. DISASSEMBLY
3-1.
Rear Cover Removal ..........................................
24
3-2.
Pillar Removal ....................................................
24
3-3.
Terminal Cover Removal ...................................
24
3-4.
Chassis Assembly Removal ..............................
24
3-5.
FXE, TUE Boards .............................................
25
3-6.
S1 Board ............................................................
25
3-7.
AG, B2 and G Block Assembly ........................
25
3-8.
Lamp Fan Unit Power Block ..............................
26
3-9.
Scirocco Fan .......................................................
26
3-10. Unit Cover Assembly .........................................
27
3-11. Optics Block Assembly ......................................
27
3-12. Screen Frame Block Assembly ...........................
28
3-13. Mirror Cover Block ............................................
28
3-14. Front Terminal Bracket .......................................
28
3-15. Speaker Removal ................................................
28
4. SET-UP ADJUSTMENTS
4-1.
Picture Distortion Correction Mechanism ..........
29
4-1-1. V-TRAP Correction 1 .......................................
29
4-1-2. V-TRAP Correction 2 .......................................
29
4-1-3. Picture Rotation Correction 1 ............................
29
4-1-4. Picture Rotation Correction 2 ............................
29
4-2.
Electrical Adjustment by Remote Commander ...
29
4-2-1. Method of Setting the Service Adjustment
Mode ..................................................................
29
4-2-2.Service Mode Adjustment .................................
29
4-2-3. Memory Write Confirmation Method ...............
30
4-2-4. Adjusting Buttons and Indicator .......................
30
4-3.
Test Reset ............................................................
30
4-4.
H/V Center Confirmation and Adjustment .........
30
5. DIAGRAMS
5-1.
Block Diagram (1) ..............................................
31
Block Diagram (2) ..............................................
32
Block Diagram (3) ..............................................
33
Block Diagram (4) ..............................................
34
Block Diagram (5) ..............................................
35
Block Diagram (6) ..............................................
36
Block Diagram (7) ..............................................
37
Block Diagram (8) ..............................................
38
Block Diagram (9) ..............................................
39
Block Diagram (10) ............................................
40
Block Diagram (11) ............................................
41
Block Diagram (12) ............................................
42
Block Diagram (13) ............................................
43
5-2.
Frame Schematic Diagram ..................................
44
5-3.
Circuit Boards Location ......................................
45
5-4.
Schematic Diagrams ...........................................
45
AG Board Schematic Diagram ...........................
46
B2 Board Schematic Diagram .............................
53
C Board Schematic Diagram ...............................
65
FXE Board Schematic Diagram ..........................
76
G Schematic Diagram .........................................
81
H1, H2, H3 Boards Schematic Diagrams ...........
83
S1, S2, T Boards Schematic Diagrams ...........
83
TUE Board Schematic Diagram ..........................
84
UE Board Schematic Diagram ............................
85
5-5.
Printed Wiring Boards ........................................
89
AG Printed Wiring Board .................................
89
B2 Printed Wiring Board ..................................
91
C Printed Wiring Board ....................................
93
FXE Printed Wiring Board ...............................
94
G Printed Wiring Board ....................................
95
H1, H2, H3 Printed Wiring Boards ...................
97
S1, S2, T Printed Wiring Boards ......................
97
TUE Printed Wiring Board ...............................
98
UE Printed Wiring Board .................................
99
5-6.
Semiconductors .................................................. 100
6. EXPLODED VIEWS
6-1.
Screen, Covers .................................................. 104
6-2.
Chassis Assembly ............................................... 105
6-3.
Optics Block ....................................................... 106
7. ELECTRICAL PARTS LIST .................................. 107
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
KDS-55A2000
RM-ED006
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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