Sony DSC-J10 Service Manual ▷ View online
DSC-J10
3-1E
3. ASSEMBLY
Assembly-2: Assembling Method of the USB Cover
Chassis
USB Cover
USB Cover Spring
Microphone lead wire
Solder
Assembly-5: Soldering Method of the Microphone
Lead Wire
Main Board
Speaker lead wire
Chassis
Main Board
Assembly-4: Routing and Soldering Method of
the Speaker Lead Wire
Route the speaker lead wire as shown below.
Speaker lead wire
Chassis
Solder
USB Jack
USB Jack Spring
Chassis
Assembly-3: Assembling Method of the USB Jack
Harness
Assembly-1: Handling Method for the Flexible Boards
of the LCD Module and SW Board
SW Board
Chassis
LCD Module
LCD Bracket Assy
DSC-J10
4-1E
4. BLOCK DIAGRAMS
4-1. OVERALL BLOCK DIAGRAM
DRIVER
LENS CO N
G PIO
DDR2 64M
x 16BIT
VD&TG
ICX682 16M
M ICRO PHO NE
USB I/F
STO RAG E I/F
UII/F
38M Hz
CO ACH-13S
SENSO R
AFE
RTC
STRO BE
I/F
AUDIO
12M Hz
TI
VSP6244B
SDRAM I/F
I/F
I/F
M O TO R
G PIO
G 2001
DISPLAY
I/F
SPEAKER
FLASH I/F
3 in 1
G PIO
eM M C
USB I/F
SO NY CCD
32.768KHz
SensorBoard
STRO BE Board
Flash Charge
RT9595
POWER CIRCUIT
Sam sung 2.7"LM S270G F078
DSC-J10
4-1E
4. BLOCK DIAGRAMS
4-1. OVERALL BLOCK DIAGRAM
DRIVER
LENS CO N
G PIO
DDR2 64M
x 16BIT
VD&TG
ICX682 16M
M ICRO PHO NE
USB I/F
STO RAG E I/F
UII/F
38M Hz
CO ACH-13S
SENSO R
AFE
RTC
STRO BE
I/F
AUDIO
12M Hz
TI
VSP6244B
SDRAM I/F
I/F
I/F
M O TO R
G PIO
G 2001
DISPLAY
I/F
SPEAKER
FLASH I/F
3 in 1
G PIO
eM M C
USB I/F
SO NY CCD
32.768KHz
SensorBoard
STRO BE Board
Flash Charge
RT9595
POWER CIRCUIT
Sam sung 2.7"LM S270G F078
DSC-J10
4-1E
4. BLOCK DIAGRAMS
4-1. OVERALL BLOCK DIAGRAM
DRIVER
LENS CO N
G PIO
DDR2 64M
x 16BIT
VD&TG
ICX682 16M
M ICRO PHO NE
USB I/F
STO RAG E I/F
UII/F
38M Hz
CO ACH-13S
SENSO R
AFE
RTC
STRO BE
I/F
AUDIO
12M Hz
TI
VSP6244B
SDRAM I/F
I/F
I/F
M O TO R
G PIO
G 2001
DISPLAY
I/F
SPEAKER
FLASH I/F
3 in 1
G PIO
eM M C
USB I/F
SO NY CCD
32.768KHz
SensorBoard
STRO BE Board
Flash Charge
RT9595
POWER CIRCUIT
Sam sung 2.7"LM S270G F078
