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Model
XM-S400D
Pages
16
Size
1 MB
Type
PDF
Document
Service Manual
Brand
Device
Car Audio
File
xm-s400d.pdf
Date

Sony XM-S400D Service Manual ▷ View online

XM-S400D
5
SECTION  3
DISASSEMBLY
• 
This set can be disassembled in the order shown below.
3-1.  DISASSEMBLY  FLOW
Note: Follow the disassembly procedure in the numerical order given.
3-2.  CHASSIS  BOTTOM  BLOCK
SET
3-2.  CHASSIS BOTTOM BLOCK
 (Page 
5)
3-3.  HEAT TRANSFER SHEET (CHIP), MAIN BOARD
 (Page 
6)
1 screw 
 (2.6 
u 8)
2 two screws 
 
(M2) (L = 6 mm)
2 two screws 
 
(M2) (L = 6 mm)
– Bottom view –
‡+RZWRLQVWDOOWKHFKDVVLVERWWRPEORFN
4 Lift up the chassis bottom 
 
block in the direction 
 
of the arrow.
5 claw
5 claw
6 claw
6 claw
chassis bottom block
7 Draw the POWER/OUTPUT connector 
 
out of the hole in chassis bottom block.
8 chassis bottom block
POWER/OUTPUT
connector
hole
two holes
1 Align the position of the hole of 
 
the chassis bottom block and 
 
the POWER/OUTPUT connector, 
 
and then insert.
POWER/OUTPUT
connector
hole
4 claw
4 claw
3 two claws
chassis bottom block
3 Insert a rod with a blunt tip into the hole, 
 
and slightly lift the chassis bottom block.
 Note: Do not use a metal tool with a sharp tip.
2 Push down the chassis bottom block 
 
in the direction of the arrow, and lock 
 
the four claws.
POWER/OUTPUT
connector side
XM-S400D
6
3-3.  HEAT  TRANSFER  SHEET (CHIP),  MAIN  BOARD
– Bottom view –
1 screw 
 (PTW 
M2)
1 three 
 screws 
 (PTW 
M2)
‡ +ow to iQVtDOO tKe KeDt ViQN VXE
heat sink block
two bosses
two holes
1 Applied the grease. 
 
(oil compound (KS609))
2 heat sink (sub)
 Note 
4: When installing the heat sink (sub),  
 
 
align the two bosses and two holes.
1 two screws 
 (PTW 
M2)
4 MAIN board
 Note 
2: If the heat sink (sub) is affixed 
 
 
to the MAIN board, remove 
 
 
the heat sink (sub).
heat sink (sub)
‡ 3DVtiQJ SoVitioQ oI KeDt tUDQVIeU VKeet FKiS
two heat transfer 
sheets (chip)
MAIN board (side B)
guide line
D519
Q514
guide line
POWER/OUTPUT connector side
IC301
2 Remove the MAIN 
  board block in the 
  direction of the 
 arrow. 
3 two heat transfer sheets (chip)
 Note 
3: A heat transfer sheet (chip) 
 
 
may be affixed to the heat 
  
sink 
block.
heat sink block
POWER/OUTPUT
connector side
Note 1: When the complete MAIN board is replaced, be sure to apply 
the grease (OIL COMPOUND (KS609)) so as to cover the 
IC301 on the MAIN board.
XM-S400D
XM-S400D
7
7
SECTION  4
DIAGRAMS
4-1.  BLOCK  DIAGRAM
DIFFERENTIAL
AMP
IC101 (1/2)
HIGH-PASS
FILTER
IC107 (1/2)
SIGNAL
 INPUT
MUTING
Q103
MUTING
Q104
BUFFER
IC104 (2/2)
BUFFER
IC104 (1/2)
D514
LED DRIVE
Q525
CN101
FRONT
 HPF
S103-1
INPUT
SELECT
S101-1
1
RL+
2
RL–
4
RR–
3
RR+
5
FL+
LOW-PASS
FILTER
IC107 (2/2)
DIFFERENTIAL
AMP
IC101 (2/2)
AUDIO DETECT
Q101
9
AMP_MUTE
8
AMP_STBY
SYSTEM CONTROLLER
IC508
10
AMP_FAULT
3
REM_IN
21
TEMP_AMP
20
TEMP
23
DCDC_ON
7
LED_ON
2
BU_IN
4
SP_IN
11
AMP_SCL
13
INTP3
12
AMP_SDA
Q526
MUTING CONTROL
Q102
6
FL–
8
FR–
7
FR+
B+ SWITCH
Q527, 528
TH502
19
TEMP_POW2
TH503
TH501
DC/DC
CONVERTER
IC503
BUFFER
Q507
BUFFER
Q508
SWITCHING
DRIVER
Q509, 513
+18V
REGULATOR
IC507
CENTER VOLTAGE
GENERATOR
IC103
SWITCHING
DRIVER
Q510, 514
RECT
D516 – 519
ANALOG_+18V
VCC
+3.3V
T502
DC/DC
CONVERTER
TRANSFORMER
R-CH
R-CH
REAR
 LPF
S102-1
6
8
CN501
POWER AMP
IC301
13
47
IN1_P
FL+
FL–
OUT1_P
48
OUT1_M
44
OUT2_P
45
OUT2_M
15 IN2_P
5
7
FR+
FR–
2
4
RL+
RL–
R-CH
1
2
RR+
RR–
9
AMP_REM
R-CH
2
MUTE
1
FA
U
LT
64
SCL
63
SDA
4
ST
ANDBY
D505
D504
BATTERY
CHECK
Q502
REMOTE DETECT
Q504
BACK UP
VOLTAGE DETECT
Q501, 503
15
VCC
+3.3V
REGULATOR
IC502
POWER
PROTECT
: AUDIO
SIGNAL PATH
R-ch is omitted due to same as L-ch.
ON
OFF
ON
OFF
2CH
4CH
TO
AUDIO CIRCUIT
D101
XM-S400D
XM-S400D
8
8
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
• Waveforms
– MAIN Board –
For Schematic Diagrams.
Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 
WV or less are not indicated except for electrolytics and 
tantalums.
•  All resistors are in Ω and 1/4 W or less unless otherwise 
specifi ed.
•  C : Panel designation.
•  A : B+ Line.
•  Power voltages is dc 14.4V and fed with regulated dc 
power supply from AMP REM and BATT cords.
•  Voltages and waveforms are dc with respect to ground 
under no-signal conditions.
  no mark : POWER ON
•  Voltages are taken with VOM (Input impedance 10 M
).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
• Signal path.
  F : 
AUDIO
For Printed Wiring Boards.
Note:
•  X : Parts extracted from the component side.
•  Y : Parts extracted from the conductor side.
• 
 : Pattern from the side which enables seeing.
  (The other layers’ patterns are not indicated.)
•  Indication of transistor.
 
C
B
These are omitted. 
E
Q
Caution:
Pattern face side: 
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen 
from the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.
•  MAIN board is multi-layer printed board. However, the 
patterns of intermediate layers have not been included in 
diagrams.
•  IC Block Diagrams
– MAIN Board –
IC301  TAS5414CTPHDRQ1
SIGNAL
PATH
LOAD
DIAGNOSTICS
AND
FAULT
MONITORS
CPC_BOT
40
CP
41
CPC_TOP
42
OUT1_M
48
6
GND 7
GND 8
GND 9
GND 12
GND 14
GND 16
IN1_P 13
FAULT 1
2
4
D_BYP 5
GND 3
GND
17
IN_M
18
IN3_P
19
IN4_P
20
GND
21
GND
22
GND
23
GND
24
GND
25 26
OUT4_M
34
OUT4_P
33
GND
35
GND
30
GND
31
GND
32
GND
27
PVDD
OUT1_P
47
SCL
20
64
GND
60
GND
59
GND
58
GND
57
GND
56
GND
55
PVDD
20
52
PVDD
53
PVDD
54
GND
20
51
GND
20
50
GND
20
49
FAULT
AND
TIMING
LOGIC
SUPPLIES
AND
REFERENCES
SDA
20
63
OSC_SYNC
20
61
I2C_ADDR
20
62
MUTE
STANDBY
10
REXT
11
IN2_P 15
A_BYP
CLIP_OTW
I2C
OSC
AND
CLOCK
OVER/UNDER
VOLTAGE
CHANNEL
UTILITIES
LOAD
DUMP
OVER TEMPERATURE
WARNING/SHUTDOWN
VREF AND IREF
CP
AVDD
OUT3_M
37
OUT3_P
36
GND
38
GND
39
GND
46
GND
43
OUT2_M
45
OUT2_P
44
PVDD
AVDD (6.5V)
28
PVDD
29
PVDD
DVDD (3.3V)
CHARGE
PUMP
IC502  S-1142D33I-E6T1U
IC503  TL594CDTB-R2
VOUT 1
ON/OFF 3
VIN
6
NC
4
VSS
5
VSS 2
+
OVERCURRENT
PROTECTOR
THERMAL
SHUTDOWN
REFERENCE
VOLTAGE
ON/OFF
CONTROL
+
DTC
1IN+
ERROR
AMPLIFIER 1
PWM
COMPALATOR
UNDER
VOLTAGE
LOCKOUT
CONTROL
C1
1D
CTC
COMPALATOR
FEEDBACK
2IN+
2IN–
1
3
4
0.7mA
15
16
OSCILLATOR
PULSE-STEERING
FLIP-FLOP
REF
14
1IN– 2
CT
RT
OUTPUT CTRL
5
6
13
VCC
12
GND 7

ERROR
AMPLIFIER 2
C1 8
E1
9
E2
10
C2
11
REFERENCE
REGURATOR
3
Q513, 514 (Drain)
10 V/DIV, 10 
Ps/DIV
19 
Ps
34.8 Vp-p
2
IC503 
9 (E1), q; (E2)
5 V/DIV, 20 
Ps/DIV
38.4 
Ps
14 Vp-p
1
IC503 
5 (CT)
1 V/DIV, 10 
Ps/DIV
19.2 
Ps
3 Vp-p
Note 1: Only part of electrical parts that mounted on the 
board of this unit can be replaced for repair.
 
Refer to “6. ELECTRICAL PARTS LIST” about 
electrical parts for service.
 
Since electrical parts that are not described in the 
electrical parts list cannot be replaced for repair, re-
place the complete mounted board when these elec-
trical parts are defective.
Note 2: When the complete MAIN board is replaced, be sure 
to apply the grease (OIL COMPOUND (KS609)) so 
as to cover the IC301 on the MAIN board.
Note 1: Only part of electrical parts that mounted on the 
board of this unit can be replaced for repair.
 
Refer to “6. ELECTRICAL PARTS LIST” about 
electrical parts for service.
 
Since electrical parts that are not described in the 
electrical parts list cannot be replaced for repair, re-
place the complete mounted board when these elec-
trical parts are defective.
Note 2: When the complete MAIN board is replaced, be sure 
to apply the grease (OIL COMPOUND (KS609)) so 
as to cover the IC301 on the MAIN board.
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