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Model Name Using Similar Mechanism

SCD-XE597

CD Mechanism Type

CDM66D-DVBU50

Base Unit Name

DVBU50

Optical Traverse Unit Name

DBU-3

2007G05-1
© 2007.07

AEP Model

Playing frequency range

2 Hz to 100 kHz

Frequency response

2 Hz to 40 kHz (

−3 dB)

Dynamic range

100 dB or more

Total harmonic distortion rate

0.003 % or less

Wow and flutter

Value of measurable limit 
(

±0.001 % W. PEAK) or 

less

Frequency response

2 Hz to 20 kHz

Dynamic range

96 dB or more

Total harmonic distortion rate

0.0035 % or less

Wow and flutter

Value of measurable limit 
(

±0.001 % W. PEAK) or 

less

* Output only the audio signals of the CD

Laser

Semiconductor laser 
(Super Audio CD: 

λ= 650 

nm) (CD: 

λ= 780 nm)

Emission duration: 
continuous

Power requirements

230 V AC, 50/60 Hz

Power consumption

15 W

Dimensions (w/h/d)

430 

× 124 × 390 mm incl. 

projecting parts

Mass (approx.)

7.2 kg

Audio connecting cord

Red and White 

× 2 (2)

Black 

× 1 (2)

Remote commander

RM-ASU001 (1)

Battery

R6 (size-AA) (2)

Design and specifications are subject to change 
without notice.

ANALOG 
OUT

Phono 
jacks

2 Vrms (at 
50 kilohms)

Over 10 
kilohms

DIGITAL 
(CD) OUT 
OPTICAL*

Square 
optical 
output 
connector

−18 dBm

(Light 
emitting 
wave length: 
660 nm)

DIGITAL 
(CD) OUT 
COAXIAL*

Coaxial 
output 
connector

0.5 Vp-p

75 ohms

PHONES

Stereo 
phone jack

5 mW

32 ohms

2

...............................................

3

...................................................................

4

3-1.

Disassembly Flow ...........................................................

5

3-2.

Case .................................................................................

5

3-3.

Loading Panel Assy .........................................................

6

3-4.

Mechanism Deck (CDM66D-DVBU50) .........................

6

3-5.

MAIN Board ....................................................................

7

3-6.

Front Panel Assy ..............................................................

7

3-7.

Base Unit (DVBU50) ......................................................

8

3-8.

WALTZ-RF Board, Optical Traverse Unit (DBU-3) .......

8

3-9.

Loading Board, Motor (L) Assy (Loading) (M151) ........

9

3-10. Harness Setting ................................................................

9

.............................................................. 10

......................... 12

6-1.

Block Diagram – MAIN Section – .................................. 14

6-2.

Block Diagram – AMP Section – .................................... 15

6-3.

Block Diagram
– PANEL/POWER SUPPLY Section – ........................... 16

6-4.

Printed Wiring Board – WALTZ-RF Board – .................. 18

6-5.

Schematic Diagram – WALTZ-RF Board – .................... 19

6-6.

Printed Wiring Board – MAIN Section (1/2) – ............... 20

6-7.

Printed Wiring Boards – MAIN Section (2/2) – .............. 21

6-8.

Schematic Diagram – MAIN Section (1/5) – .................. 22

6-9.

Schematic Diagram – MAIN Section (2/5) – .................. 23

6-10. Schematic Diagram – MAIN Section (3/5) – .................. 24
6-11. Schematic Diagram – MAIN Section (4/5) – .................. 25
6-12. Schematic Diagram – MAIN Section (5/5) – .................. 26
6-13. Schematic Diagram – DISPLAY Board – ....................... 27
6-14. Printed Wiring Boards – PANEL Section – ..................... 28
6-15. Printed Wiring Boards – POWER SUPPLY Section – .... 29
6-16. Schematic Diagram

– KEY/POWER SUPPLY Section – ............................... 30

7-1.

Overall Section ................................................................ 42

7-2.

DISPLAY Board Section ................................................. 43

7-3.

Front Panel Section ......................................................... 44

7-4.

MAIN Board Section ....................................................... 45

7-5.

Mechanism Deck Section (CDM66D-DVBU50) ............ 46

7-6.

Optical Pick-up Section (DVBU50) ................................ 47

................................ 48

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of the soldering iron around 270 ˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

 0

0

This appliance is 
classified as a CLASS 1 
LASER product. This 
marking is located on 
the rear exterior.

3

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 ˚C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

In cleaning the lens of optical pick-up, use the air blower.
Never use a cotton swab for cleaning the lens of optical pick-up,
which otherwise causes a trouble.

Perform this setting when the EEPROM (IC702) on the MAIN board
is replaced.
Procedure:

1. While pressing the [MENU] button and  

.

 AMS 

>

  jog press

the [POWER] button to turn the power on and enter the test
mode and display “DIAG MODE”.

2.  

.

 AMS 

>

  jog is turned and “8D” is selected.

3.   

.

 AMS 

>

  jog is pressed and “INIT START” is displayed.

4. Then confirm “INITIAL OK” is displayed.
5. Press the [POWER] button to turn the power off.
6. Press the [POWER] button to turn the power on.
7. Press the [MENU] button.
8.  

.

 AMS 

>

  jog is turned and “M/2ch SEL” is selected.

9.  

.

 AMS 

>

  jog is pressed.

10.  

.

 AMS 

>

  jog is turned and “SEL – 2ch” is selected.

11.  

.

 AMS 

>

  jog is pressed.

12. Press the [POWER] button to turn the power off.

1

Rotate the cam (66)
with a screw driver
in the direction of arrow 

A

.

A

2

Pull out the tray 
in the direction of arrow B.

cam (66)

4

This section is extracted from
instruction manual.

A

B

Each time you press the button, the playing time 
of the track, the remaining time of the disc, or 
TEXT information appears in the display.

C

Each time you press the button while playing 
back a hybrid disc, the layer to be played back 
switches between the Super Audio CD layer 
and the CD layer.

D

E A

F N

G X

H x

I . 

>

J

K

L

Press to select the playback area when a disc 
with the 2 channel area and the multi-channel 
area is loaded.

M

Press to enter the menu.
Press to exit from the menu and return to the 
normal display.

N

Adjust the headphones volume.

O

Connect the headphones.
During playback of a Multi-channel Super 
Audio CD, the same signal that is output from 
the  ANALOG 5.1CH FRONT L/R jacks is 
output from the PHONES jack.

POWER

PHONES

PHONE LEVEL

MIN

MAX

TIME/TEXT

MENU

MULTI/2CH

SA-CD/CD

AMS

PUSH

ENTER

1

2

3

4

5

6

7

8

9

q;

qa

qs

qd

qf

qg

A

Press to resume Continuous Play from Shuffle Play or Program Play.

B

Each time you press the button while playing back a hybrid disc, the layer to be played 
back switches between the Super Audio CD layer and the CD layer.

C

Press to select the playback area when a disc with the 2 channel area and the multi-channel 
area is loaded.

D

Press to enter the track numbers.

E

F

Press to delete a programed track number.

G

Press to adjust the output level balance for the Multi-channel management function.

H

Press to check the programed order.

I H

X

x

J m/M

K

./>

L

M

Press to locate a track numbered over 10.

N

Each time you press the button, the playing time of the track, the remaining time of the disc, or 
TEXT information appears in the display.

O

Press to turn the display information off or on.

CONTINUE SHUFFLE

PLAY MODE

PROGRAM

SA-CD/CD

1

2

3

4

5

6

7

8

10/0

9

TIME/TEXT

REPEAT

AMS

CLEAR

>10

ENTER

MODE

DISPLAY

MULTI/2CH

LEVEL

ADJ

CHECK