Sony SA-FW2010 / SA-W2010 / SS-F2010 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
SA-FW2010/W2010/
SS-F2010
SPECIFICATIONS
ACTIVE SPEAKER SYSTEM
9-889-693-01
2009K04-1
©
2009.11
E Model
Ver. 1.0 2009.11
• When the operation of the subwoofer or front speaker
is confi rmed, it is necessary to connect both these set.
Confi rm the subwoofer and front speaker are prepared
beforehand when you repair.
• SA-FW2010 is composed of the following models.
COMPONENT MODEL NAME
SA-FW2010
SUBWOOFER
SA-W2010
FRONT SPEAKER
SS-F2010
Speaker section
Front speaker (SS-F2010)
Speaker system
Speaker system
2-way, bass refl ex
Speaker unit
Woofer: 160 mm, cone type
Tweeter: 25 mm, horn type
Rated impedance
4
4
ohms
Subwoofer (SA-W2010)
Speaker system
Active
Speaker system
Active
subwoofer
Speaker unit
160 mm, cone type
Enclosure type
Bass
Bass
refl ex
Rated impedance
2
2
ohms
Amplifi er section
Rated output
75 W + 75 W (10% T.H.D., 1 kHz,
4 ohms) (Front speaker)
150 W (10% T.H.D., 100 Hz, 2 ohms)
(Subwoofer)
Input
RCA
Input
RCA
jack
× 1 (INPUT 1)
Voltage: 1 V
Impedance: 10 kilohms
Stereo mini jack
× 1 (INPUT 2)
Voltage: 500 mV
Impedance: 4.7 kilohms
Output
Stereo mini jack
× 1 (i (headphones))
General
Dimensions (w/h/d)
Approx.
Approx.
230
× 905 × 285 mm
(Front
speaker)
Approx.
221
× 403 × 411 mm
(Subwoofer)
Mass
Approx. 11.0 kg
(Front
speaker)
Approx. 7.7 kg
(Subwoofer)
Power requirements
Power requirements
220 - 240 V AC, 50/60 Hz
Power consumption
65
65
W
Power consumption (during standby mode)
0.5
0.5
W
Supplied accessories
Remote Commander (1)
R03 (seize AAA) batteries (2)
Audio cord (1)
Speaker cords (2)
Operating Instructions (1)
Quick Setup Guide (1)
R03 (seize AAA) batteries (2)
Audio cord (1)
Speaker cords (2)
Operating Instructions (1)
Quick Setup Guide (1)
Design and specifi cations are subject to
change without notice.
change without notice.
SS-F2010
SA-W2010
SA-FW2010/W2010/SS-F2010
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Front Panel Block ........................................................... 4
2-2. Rear Panel Block ............................................................ 5
2-3. MAIN Board ................................................................... 6
2-4. Rear Chassis Block ......................................................... 6
2-5. AMP Board ..................................................................... 7
2-6. POWER Board ................................................................ 7
2-7. Front Panel Assy, Duct Panel Assy ................................. 8
2-2. Rear Panel Block ............................................................ 5
2-3. MAIN Board ................................................................... 6
2-4. Rear Chassis Block ......................................................... 6
2-5. AMP Board ..................................................................... 7
2-6. POWER Board ................................................................ 7
2-7. Front Panel Assy, Duct Panel Assy ................................. 8
3.
TEST MODE
............................................................
9
4. DIAGRAMS
4-1. Block Diagram –AUDIO Section– ................................. 11
4-2. Block Diagram –AMP Section– ..................................... 12
4-3. Block
4-2. Block Diagram –AMP Section– ..................................... 12
4-3. Block
Diagram
–PANEL/POWER SUPPLY Section– ............................ 13
4-4. Schematic Diagram –AMP Board (1/3)– ........................ 15
4-5. Schematic Diagram –AMP Board (2/3)– ........................ 16
4-6. Schematic Diagram –AMP Board (3/3)– ........................ 17
4-7. Printed Wiring Board –AUDIO Section (1/2)– .............. 18
4-8. Printed Wiring Boards –AUDIO Section (2/2)– ............. 19
4-9. Schematic Diagram –AUDIO/PANEL Section– ............ 20
4-10. Printed Wiring Boards –MAIN/PANEL Section– .......... 21
4-11. Schematic Diagram –MAIN Board– .............................. 22
4-12. Printed Wiring Board –POWER Board– ........................ 23
4-13. Schematic Diagram –POWER Board– ........................... 24
4-5. Schematic Diagram –AMP Board (2/3)– ........................ 16
4-6. Schematic Diagram –AMP Board (3/3)– ........................ 17
4-7. Printed Wiring Board –AUDIO Section (1/2)– .............. 18
4-8. Printed Wiring Boards –AUDIO Section (2/2)– ............. 19
4-9. Schematic Diagram –AUDIO/PANEL Section– ............ 20
4-10. Printed Wiring Boards –MAIN/PANEL Section– .......... 21
4-11. Schematic Diagram –MAIN Board– .............................. 22
4-12. Printed Wiring Board –POWER Board– ........................ 23
4-13. Schematic Diagram –POWER Board– ........................... 24
5.
EXPLODED VIEWS
5-1. Rear Chassis Section (SA-W2010) ................................. 31
5-2. Front Panel Section (SA-W2010) ................................... 32
5-3. AMP Board Section (SA-W2010) .................................. 33
5-4. Cabinet Section (SA-W2010) ......................................... 34
5-5. Front Speaker (SS-F2010) .............................................. 35
5-2. Front Panel Section (SA-W2010) ................................... 32
5-3. AMP Board Section (SA-W2010) .................................. 33
5-4. Cabinet Section (SA-W2010) ......................................... 34
5-5. Front Speaker (SS-F2010) .............................................. 35
6.
ELECTRICAL PARTS LIST
.............................. 36
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
CAUTION
These servicing instructions are for use by qualifi ed service per-
sonnel only.
To reduce the risk of electric shock, do not perform any servicing
other than that contained in the operating instructions unless you
are qualifi ed to do so.
These servicing instructions are for use by qualifi ed service per-
sonnel only.
To reduce the risk of electric shock, do not perform any servicing
other than that contained in the operating instructions unless you
are qualifi ed to do so.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
SA-FW2010/W2010/SS-F2010
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
When the operation of the subwoofer or front speaker is confi rmed,
it is necessary to connect both these set.
Confi rm the subwoofer and front speaker are prepared beforehand
when you repair.
ERATION
When the operation of the subwoofer or front speaker is confi rmed,
it is necessary to connect both these set.
Confi rm the subwoofer and front speaker are prepared beforehand
when you repair.
NOTE OF REPLACING THE IC001 ON THE MAIN
BOARD
IC001 on the MAIN board cannot exchange with single. When this
part on the MAIN board is damaged, exchange the entire mounted
board.
BOARD
IC001 on the MAIN board cannot exchange with single. When this
part on the MAIN board is damaged, exchange the entire mounted
board.
NOTE OF REPLACING THE IC501 AND IC551 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC501 and IC551 on the AMP board and the complete AMP
board are replaced, it is necessary to spread the compound (OIL
COMPOUND G777) (Part No. J-2501-335-A) between the AMP
board and the heat sink.
If the compound is not spread, there is a possibility that IC is dam-
aged.
Spread the compound referring to the fi gure below.
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC501 and IC551 on the AMP board and the complete AMP
board are replaced, it is necessary to spread the compound (OIL
COMPOUND G777) (Part No. J-2501-335-A) between the AMP
board and the heat sink.
If the compound is not spread, there is a possibility that IC is dam-
aged.
Spread the compound referring to the fi gure below.
oil compound G777
(J-2501-335-A)
(J-2501-335-A)
AMP board
(Componet Side)
IC501
IC551
NOTE OF CONFIRMING THE OPERATION
When confi rming the operation the AMP board removed from the
set, please reduce as much as possible and confi rm the volume
level of subwoofer.
There is a possibility that IC is damaged when a big volume level
is put out with the heat sink not fi xed to the AMP board.
When confi rming the operation the AMP board removed from the
set, please reduce as much as possible and confi rm the volume
level of subwoofer.
There is a possibility that IC is damaged when a big volume level
is put out with the heat sink not fi xed to the AMP board.
• JIG
When disassembling the set, use the following jig (for speaker
When disassembling the set, use the following jig (for speaker
removal).
Part No. J-2501-238-A JIG FOR SPEAKER REMOVAL
SA-FW2010/W2010/SS-F2010
4
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
Note: Follow the disassembly procedure in the numerical order given.
2-1. FRONT PANEL BLOCK
SET
(SA-W2010)
SET
(SS-F2010)
2-2. REAR PANEL BLOCK
(Page
(Page
5)
2-7. FRONT
PANEL
ASSY,
DUCT
PANEL
ASSY
(Page
8)
2-3. MAIN
BOARD
(Page
6)
2-5. AMP
BOARD
(Page
7)
2-6. POWER
BOARD
(Page
7)
2-1. FRONT PANEL BLOCK
(Page
(Page
4)
2-4. REAR CHASSIS BLOCK
(Page
(Page
6)
7 front panel block
1 two screws (BVTP3 u 10)
2 two screws (BVTP3 u 8)
4 two bosses
3 two bosses
5 flat type wire (31 core) (CN802)
6 connector