DOWNLOAD Sony MDS-S9 Service Manual ↓ Size: 3.59 MB | Pages: 62 in PDF or view online for FREE

Model
MDS-S9
Pages
62
Size
3.59 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mds-s9.pdf
Date

Sony MDS-S9 Service Manual ▷ View online

MDS-S9
13
3-3.
MD  MECHANISM  DECK (MDM-7A)
Note:
 Follow the disassembly procedure in the numerical order given.
3-2.
CASE
2
case
1
two screws (case 3 TP2)
1
two screws (case 3 TP2)
3
four screws (BVTTWH M3)
1
wire (flat type) (23 core)
(CN400)
1
wire (flat type) (27 core)
(CN1)
2
harness
4
MD mechanism deck
(MDM-7A)
MDS-S9
14
3-4.
MAIN  BOARD
3-5.
BD  BOARD
3
three screws
(BVTP3 
×
 8)
4
two screws
(BVTP3 
×
 8)
5
MAIN board
1
wire (flat type) (15 core)
(CN490)
2
connector (CN902)
1
wire (flat type) (23 core)
(CN103)
2
wire (flat type) (27 core)
(CN102)
7
BD board
3
connector
(CN104)
8
flexible board (CN101)
4
Remove five solders.
5
Remove four solders.
BD board
– CONDUCTOR SIDE VIEW –
6
two screws (2 
×
 6)
15
MDS-S9
SECTION  4
TEST  MODE
4-1.
PRECAUTIONS FOR USE OF TEST MODE
• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc
is stopped before setting and removing it.
Even if the
Z
button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop
rotating.
Therefore, it will be ejected while rotating.
Be sure to press the
Z
button after pressing the 
[MENU/NO]
 button and the rotation of disc is stopped.
4-1-1. Recording laser emission mode and operating buttons
• Continuous recording mode (CREC 1MODE)
• Laser power check mode (LDPWR CHECK)
• Laser power adjustment mode (LDPWR ADJUST)
• Comparison with initial Iop value written in nonvolatile memory (Iop Compare)
• Write current Iop value in read nonvolatile memory using microprocessor (Iop NV Save)
• Traverse (MO) check (EF MO CHECK)
• Traverse (MO) adjustment (EF MO ADJUST)
• When pressing the
z
button.
4-2.
SETTING THE TEST  MODE
The following are two methods of entering the test mode.
Procedure 1: While pressing the 
[       AMS       ]
 knob and
x
button simultaneously, connect the power plug to the outlet, and release
the 
[       AMS       ]
 knob and
x
button.
When the test mode is set, “[Check]” will be displayed. Turning the 
[       AMS       ]
 knob between the following three
groups; ···Tt [Check] Tt [Service] Tt [Develop] Tt ···.
Procedure 2: While pressing the 
[       AMS       ]
 knob, connect the power plug to the outlet, and release the 
[       AMS       ]
 knob.
When the test mode is set, “TEMP CHECK” (C12) will be displayed. By setting the test mode using this method, only the
“Check” group of procedure1 can be executed.
Note:
Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, press the 
[MENU/NO]
 button immediately to release the [Develop] group.
4-3.
RELEASING THE TEST  MODE
Press the
I/1
button. The unit sets into the STANDBY state, and the test mode ends.
4-4.
BASIC OPERATIONS OF THE TEST MODE
All operations are performed using the 
[       AMS       ]
 knob, 
[YES]
 button, and [MENU/NO] button.
The functions of knob and buttons are as follows.
Function name
Function
[       AMS       ]
 knob
Changes parameters and modes
[YES]
 button
Proceeds onto the next step. Finalizes input
[MENU/NO]
 button
Returns to previous step. Stops operations
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16
MDS-S9
4-5.
SELECTING THE TEST  MODE
There are 26 types of test modes as shown below. The groups can be switched by turning the 
[       AMS       ]
 knob. After selecting the
group to be used, press the 
[YES]
 button. After setting a certain group, turning the 
[       AMS       ]
 knob switches modes shown below.
Refer to “Group” in the table for details can be selected.
All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.
Note:
Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, press the
 [MENU/NO] 
button immediately to exit the [Develop] group.
• For details of each adjustment mode, refer to “5. Electrical Adjustments”.
For details of “Err Display”, refer to “Self-Diagnosis Function” on page 2.
• If a different mode has been selected by mistake, press the
 [MENU/NO] 
button to release that mode.
• Modes with (
×
) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set acciden-
tally, press the
 [MENU/NO] 
button to release the mode immediately.
Display
AUTO CHECK
Err Display
TEMP ADJUST
LDPWR ADJUST
Iop Write
Iop NV Save
EF MO ADJUST
EF CD ADJUST
FBIAS ADJUST
AG Set (MO)
AG Set (CD)
TEMP CHECK
LDPWR CHECK
EF MO CHECK
EF CD CHECK
FBIAS CHECK
ScurveCHECK
VERIFYMODE
DETRK CHECK
0920 CHECK
Iop Read
Iop Compare
ADJ CLEAR
INFORMATION
CPLAY1MODE
CREC 1MODE
Details
Automatic self-diagnosis
Error history display, clear
Temperature compensation offset adjustment
Laser power adjustment
Iop data writing
Writes current Iop value in read nonvolatile memory using microprocessor
Traverse (MO) adjustment
Traverse (CD) adjustment
Focus bias adjustment
Auto gain output level adjustment (MO)
Auto gain output level adjustment (CD)
Temperature compensation offset check
Laser power check
Traverse (MO) check
Traverse (CD) check
Focus bias check
S-curve check
Nonvolatile memory check
Detrack check
Most circumference check
Iop data display
Comparison with initial Iop value written in nonvolatile memory
Initialization of nonvolatile memory for adjustment values
Display of microprocessor version, etc.
Continuous playback mode
Continuous recording mode
No.
C01
C02
C03
C04
C05
C06
C07
C08
C09
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C25
C26
C27
C28
C31
C34
C35
Mark
Group
Check
Service
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