Sony MDS-S9 Service Manual ▷ View online
5
MDS-S9
TABLE OF CONTENTS
SELF-DIAGNOSIS FUNCTION
....................................
2
1.
SERVICING NOTES
...............................................
6
2.
GENERAL
................................................................... 10
3.
DISASSEMBLY
3-1. Disassembly Flow ........................................................... 12
3-2. Case ................................................................................. 13
3-3. MD Mechanism Deck (MDM-7A) ................................. 13
3-4. MAIN Board ................................................................... 14
3-5. BD Board ......................................................................... 14
3-2. Case ................................................................................. 13
3-3. MD Mechanism Deck (MDM-7A) ................................. 13
3-4. MAIN Board ................................................................... 14
3-5. BD Board ......................................................................... 14
4.
TEST MODE
.............................................................. 15
5.
ELECTRICAL ADJUSTMENTS
......................... 20
6.
DIAGRAMS
6-1. Block Diagram – SERVO Section – ............................... 31
6-2. Block Diagram – MAIN Section – ................................. 32
6-3. Note for Printed Wiring Boards and
6-2. Block Diagram – MAIN Section – ................................. 32
6-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 33
6-4. Printed Wiring Boards – BD Board – ............................. 35
6-5. Schematic Diagram – BD Board (1/2) – ........................ 36
6-6. Schematic Diagram – BD Board (2/2) – ........................ 37
6-7. Printed Wiring Board
6-5. Schematic Diagram – BD Board (1/2) – ........................ 36
6-6. Schematic Diagram – BD Board (2/2) – ........................ 37
6-7. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 38
6-8. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 39
6-9. Schematic Diagram – MAIN Board (1/3) – ................... 40
6-10. Schematic Diagram – MAIN Board (2/3) – ................... 41
6-11. Schematic Diagram – MAIN (3/3)/PT Boards – ............ 42
6-12. Printed Wiring Board – PT Board – ............................... 43
6-13. Printed Wiring Board – DISPLAY Board – ................... 44
6-14. Schematic Diagram – DISPLAY Board – ...................... 45
6-15. IC Pin Function Description ........................................... 46
6-10. Schematic Diagram – MAIN Board (2/3) – ................... 41
6-11. Schematic Diagram – MAIN (3/3)/PT Boards – ............ 42
6-12. Printed Wiring Board – PT Board – ............................... 43
6-13. Printed Wiring Board – DISPLAY Board – ................... 44
6-14. Schematic Diagram – DISPLAY Board – ...................... 45
6-15. IC Pin Function Description ........................................... 46
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 52
7-2. Front Panel Section ......................................................... 53
7-3. Mechanism Deck Section-1 (MDM-7A) ........................ 54
7-4. Mechanism Deck Section-2 (MDM-7A) ........................ 55
7-2. Front Panel Section ......................................................... 53
7-3. Mechanism Deck Section-1 (MDM-7A) ........................ 54
7-4. Mechanism Deck Section-2 (MDM-7A) ........................ 55
8.
ELECTRICAL PARTS LIST
............................... 56
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is classified
as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
The following caution label is located inside the unit.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.
Använd samma batterityp eller en likvärdig typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
6
MDS-S9
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be
performed are shown as follows.
performed are shown as follows.
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP
IOP
: For measuring IOP (Check the deterioration of the optical pick-up laser)
GND : Ground
TE
TE
: Tracking error signal (Traverse adjustment)
FE
: Focus error signal
VC
: Reference level for checking the signal
RF
: RF signal (Check jitter)
I+3V
CN105
IOP
TE
VC
GND
FE
RF
I+3V
IOP
GND
TE
FE
VC
RF
IOP
GND
TE
FE
VC
RF
I+3V
IOP
GND
TE
FE
FE
VC
RF
1
7
for
MDM-7A
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
SECTION 1
SERVICING NOTES
7
MDS-S9
IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195
OF BD BOARD) ARE REPLACED
OF BD BOARD) ARE REPLACED
The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need
to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD board),
record the IOP value on the optical pick-up according to the following procedure.
to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD board),
record the IOP value on the optical pick-up according to the following procedure.
Record Precedure:
1. While pressing the
1. While pressing the
[ AMS ]
knob and x button simultaneously, connect the power plug to the outlet, and release the
[ AMS ]
knob and x button simultaneously to display “[Check]”.
2. Turn the
[ AMS ]
knob to display “[Service]”, and press the
[YES]
button to display “AUTO CHECK” (C01).
3. Turn the
[ AMS ]
knob to display “Iop Write” (C05), and press the
[YES]
button.
4. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.
5. Input the IOP value written on the optical pick-up.
5. Input the IOP value written on the optical pick-up.
To select the number : Turn the
[ AMS ]
knob.
To select the digit
: Press the
[ AMS ]
knob.
6. When the
[YES]
button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).
7. As the adjustment results are recorded for the 6 value. Leave it as it is and press the
[YES]
button.
8. “Complete!!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop
Write” (C05).
9. Press the
I/1
button to complete.
Display Precedure:
1. While pressing the
1. While pressing the
[ AMS ]
knob and x button simultaneously, connect the power plug to the outlet, and release the
[ AMS ]
knob and x button simultaneously to display “[Check]”.
2. Turn the
[ AMS ]
knob to display “[Service]”, and press the
[YES]
button to display “AUTO CHECK” (C01).
3. Turn the
[ AMS ]
knob to display “Iop Read” (C26), and press the
[YES]
button.
4. “@@.@/##.#” is displayed and the recorded contents are displayed.
@@.@ : indicates the IOP value labeled on the optical pick-up.
##.#
##.#
: indicates the IOP value after adjustment
5. To end, press the
[ AMS ]
knob or
[MENU/NO]
button to display “Iop Read” (C26). Then press the
I/1
button.
WHEN MEMORY NG IS DISPLAYED
If the nonvolatile memory data is abnormal, “E001 MEMORY NG” will be displayed so that the MD deck does not continue operations.
In this case, set the test mode promptly and perform the following procedure.
In this case, set the test mode promptly and perform the following procedure.
Procedure:
1. Enter the test mode (refer to page 15).
2. Normally a message for selecting the test mode will be displayed. However if the nonvolatile memory is abnormal, the following will be
1. Enter the test mode (refer to page 15).
2. Normally a message for selecting the test mode will be displayed. However if the nonvolatile memory is abnormal, the following will be
displayed “INIT EEP?”.
3. Press the both
x
and
Z
buttons simultaneously.
4. Turn the
[ AMS ]
knob to display “MDM-7A”.
5. Press the
[ AMS ]
button. If the nonvolatile memory is successfully overwritten, the normal test mode will be set and a message to
select the test mode will be displayed.
FORCE RESET
You can reset the microprocessor of the system with following procedure.
Use this method if the device cannot be operated normaly because the microprocessor is hung up or with some reasons.
Use this method if the device cannot be operated normaly because the microprocessor is hung up or with some reasons.
Procedure:
Remove the short pin attached on CN420, then install it again.
Remove the short pin attached on CN420, then install it again.
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CN420
– MAIN BOARD (Component Side) –
8
MDS-S9
RETRY CAUSE DISPLAY MODE IN MD
• In this test mode, the causes for retry of the unit during recording and stop can be displayed on the liquid crystal display. During
playback, the “track mode” for obtaining track information will be set.
This is useful for locating the faulty part of the unit.
This is useful for locating the faulty part of the unit.
• The following will be displayed :
During recording and stop : Retry cause, number of retries, and number of retry errors.
During playback
During playback
: Information such as type of disc played, part played, copyright.
These are displayed in hexadecimal.
Precedure:
1. Keep the
1. Keep the
x
button pressed for about 10 seconds, or press the
[LEVER/DISPLAY/CHAR]
button while pressing
x
and
[MENU/NO]
buttons.
2. “RTs00c00e000” is displayed after the mode is set.
3. Press the
3. Press the
z
button go into recording mode, then press the
u
button to start recording.
4. To check “track mode”, press the
u
button to playback.
5. To release the test mode, press the
I/1
button and turn off the power. Remove the power plug from the outlet after “TOC” is turned
off. If you cannot release the test mode, refer to “FORCE RESET” on page 7.
Fig. 1 Reading the Test Mode Display
(During recording and stop)
RTs@@c##e
***
Liquid crystal display
@@ : Cause of retry
##
##
: Number of retries
***
: Number of retry errors
Fig. 2 Reading the Test Mode Display
(During playback)
@@ ###
**
$$
Liquid crystal display
@@ : Parts No. (Name of area named on TOC)
### : Cluster
### : Cluster
Address (Physical address on the
**
: Sector
disc)
$$
: Track mode (Track information such as copy-
right information of each part)
Reading the Retry Cause Display
8
4
2
1
8
4
2
1
b7 b6 b5 b4 b3 b2 b1 b0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
0
Hexa-
decimal
Cause of Retry
01
02
04
08
10
20
40
80
Higher Bits
Lower Bits
Hexadecimal
Bit
Binary
shock
ader5
Discontinuous address
DIN unlock
FCS incorrect
IVR rec error
CLV unlock
Access fault
Occurring conditions
When track jump (shock) is detected
When ADER was counted more than five times
continuously
continuously
When ADIP address is not continuous
When DIN unlock is detected
When not in focus
When ABCD signal level exceeds the specified range
When CLV is unlocked
When access operation is not performed normally
Reading the Display:
Convert the hexadecimal display into binary display. If more than two causes, they will be added.
Convert the hexadecimal display into binary display. If more than two causes, they will be added.
Example
When 42 is displayed:
Higher bit : 4 = 0100 t b6
Lower bit : 2 = 0010 t b1
In this case, the retry cause is combined of “CLV unlock” and “ader5”.
Higher bit : 4 = 0100 t b6
Lower bit : 2 = 0010 t b1
In this case, the retry cause is combined of “CLV unlock” and “ader5”.
When A2 is displayed:
Higher bit : A = 1010 t b7 + b5
Lower bit : 2 = 0010 t b1
The retry cause in this case is combined of “Access fault”, “IVR rec error”, and “ader5”.
Higher bit : A = 1010 t b7 + b5
Lower bit : 2 = 0010 t b1
The retry cause in this case is combined of “Access fault”, “IVR rec error”, and “ader5”.
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