DOWNLOAD Sony MDS-LSA1 Service Manual ↓ Size: 4.6 MB | Pages: 82 in PDF or view online for FREE

Model
MDS-LSA1
Pages
82
Size
4.6 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mds-lsa1.pdf
Date

Sony MDS-LSA1 Service Manual ▷ View online

5
Description
Table of Error Codes
Error Code
10
12
20
21
22
23
24
30
31
40
41
42
43
50
51
Could not load
Loading switches combined incorrectly
Timed out without reading the top of PTOC
Could read top of PTOC, but detected error
Timed out without accessing UTOC
Timed out without reading UTOC
Error in UTOC
Could not start playback
Error in sector
Retry cause generated during normal recording
Retried in DRAM overflow
Retry occurred during TOC writing
Retry aborted during S.F editing
Other than access processing, and could not read address.
Focus NG occurred and overran.
TABLE OF CONTENTS
1. SERVICING NOTES .............................................
6
2. GENERAL
........................................................................ 12
3. DISASSEMBLY
3-1. Case (Top) ........................................................................... 17
3-2. MD Mechanism Deck ......................................................... 18
3-3. Base (Front) Assy, Panel ..................................................... 18
3-4. Clip Board and Main Board ................................................ 19
3-5. Trans Board ......................................................................... 19
3-6. Holder Assy ......................................................................... 20
3-7. Over Write Head ................................................................. 20
3-8. Optical pick-up (MD) (KMS-262A/J1N) ............................ 21
3-9. BD Board ............................................................................ 21
4. TEST  MODE
..................................................................... 22
5. ELECTRICAL ADJUSTMENTS
............................... 30
6. DIAGRAMS
6-1. Circuit Boards Location ...................................................... 41
6-2. Block Diagrams
• BD Section ....................................................................... 42
• Main Section .................................................................... 43
6-3. Printed Wiring Board – BD Section – ................................. 45
6-4. Schematic Diagram – BD Section (1/2) – ........................... 46
6-5. Schematic Diagram – BD Section (2/2) – ........................... 47
6-6. Printed Wiring Board – Main Section (Side A) – ............... 48
6-7. Printed Wiring Board – Main Section (Side B) – ............... 49
6-8. Schematic Diagram – Main Section (1/3) – ........................ 50
6-9. Schematic Diagram – Main Section (2/3) – ........................ 51
6-10.  Schematic Diagram – Main Section (3/3) – ..................... 52
6-11.  Printed Wiring Board – Power Section – ......................... 53
6-12. Printed Wiring Board – Panel Section – ........................... 54
6-13.  Schematic Diagram – Panel Section – ............................. 55
6-14. IC Block Diagrams ........................................................... 56
6-15. IC Pin Functions ............................................................... 59
7. EXPLODED VIEWS
7-1. Panel Section ....................................................................... 70
7-2. Chassis Section ................................................................... 71
7-3. MD Mechanism Section-1 (MDM-7X2B) .......................... 72
7-4. MD Mechanism Section-2 (MDM-7X2B) .......................... 73
8. ELECTRICAL PARTS LIST
........................................ 74
6
SECTION 1
SERVICE NOTES
This appliance is classified as a
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the
rear exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This caution
label is located
inside the unit.
7
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be
performed are shown as follows.
GND : Ground
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP
: For measuring IOP (Check the deterioration of the optical pick-up laser)
TE
: TRK error signal (Traverse adjustment)
VC
: Reference level for checking the signal
RF
: RF signal (Check jitter)
FE
: Focus error signal
I+3V
IOP
GND
TE
FE
VC
RF
I+3V
IOP
GND
TE
FE
VC
RF
1
7
for
MDM-7X2B
I+3V
CN105
IOP
TE
VC
GND
FE
RF
8
IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF
BD BOARD) ARE REPLACED
The Iop value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need
to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD board),
record the Iop value on the optical pick-up according to the following procedure.
Record Precedure:
1. While pressing the  . button and  x  button, connect the power plug to the outlet, and release the  .  button and  x  button.
2. Press the  .  or  >  button to display “[Service]”, and press the  7  button.
3. Press the  .  or  >  button to display “Iop Write” , and press the  7  button.
4. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.
5. Input the Iop value written on the optical pick-up.
To select the number : Press the  .  or  > button.
To select the digit
: Press the  POWER  button.
6. When the  7  button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).
7. As the adjustment results are recorded for the 6 value. Leave it as it is and press the  7  button.
8. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop
Write” .
9. Press the  POWER “X2”  button to complete.
Display Precedure:
1. While pressing the  .  button and  x  button, connect the power plug to the outlet, and release the  .  button and  x  button.
2. Press the  .  or  >  button to display “[Service]”, and press the  7  button.
3. Press the  .  or  >  button to display “Iop Read” , and press the  7  button.
4. “@@.@/##.#” is displayed and the recorded contents are displayed.
  @@.@ : indicates the Iop value labeled on the optical pick-up.
  ##.#
: indicates the Iop value after adjustment.
5. To end, press the   x  button to display “Iop Read”. Then press the  POWER “X2”  button.
NOTE
• The MDS-LSA1 is designed so that a number of functions which may be performed in test mode may be performed by clicking a single
button.
Switching between functions
Pressing the  INPUT  button causes the display to change as indicated below.
Hidden t “X2”
The functions performed by each button change in accordance with the DISPLAY mode.
Note that the following notation is used herein:
 POWER ............. Press the  POWER  button when HIDDEN.
 POWER “X2” .... Press the  POWER  button while “X2” is lit.
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