DOWNLOAD Sony MDS-JA20ES Service Manual ↓ Size: 6.07 MB | Pages: 88 in PDF or view online for FREE

Model
MDS-JA20ES
Pages
88
Size
6.07 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mds-ja20es.pdf
Date
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– 39 –
• Circuit Boards Location
AC board
BD board
PSW board
MOTOR board
HEADPHONE board
FL board
DIGITAL board
POWER board
AU board
RELEASE board
OUT SWITCH board
ANALOG VOLUME board
POSITION SWITCH board
– 40 –
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
Ω
 and 
1
/
4
 
W or less unless otherwise
specified.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
C
: panel designation.
Note on Printed Wiring Boards:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
U
: B+ Line.
•
V
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : STOP
(
) : PLAY
〈〈
 
〉〉
: REC
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: PB
j
: REC
p
: PB (Digital out)
l
: REC (Digital in)
• Abbreviation
CND : Canadian model.
Note:
The components identi-
fied by mark 
!
 or dotted
line with mark 
!
 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 
!
 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
B
These are omitted.
C
E
Q
C
B
These are omitted.
E
Q
6-3.
NOTE  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS
• Abbreviation
CND
: Canadian model.
• Indication of transistor.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
6-4.
PRINTED  WIRING  BOARD  – BD Section –
•
 See page 39 for Circuit Boards Location.
– 41 –
• Semiconductor
Location
(Component Side)
Ref. No.
Location
D101
G-6
D181
A-1
D183
A-1
IC103
E-6
IC123
B-3
IC171
A-6
Q102
E-5
Q103
C-6
Q104
E-6
– 42 –
• Semiconductor
Location
(Conductor Side)
Ref. No.
Location
IC101
G-5
IC121
C-5
IC124
C-6
IC152
E-2
IC181
C-2
IC192
B-1
Q101
E-6
Q162
E-6
Q163
D-5
Q181
B-2
Q182
B-3
(Page 52)
(Page 58)
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