Sony MDS-J3000 / MDS-J3000ES Service Manual ▷ View online
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Model Name Using Similar Mechanism
MDS-JE500
MD Mechanism Type
MDM-3A
Optical Pick-up Type
KMS-260A/J1N
MDS-J3000/J3000ES
SERVICE MANUAL
AEP Model
UK Model
MDS-J3000ES
E Model
Chinese Model
MDS-J3000
SPECIFICATIONS
— Continued on next page —
Photo: MDS-J3000
MiNi DiSC DECK
9-960-936-12
2004I02-1
© 2004.09
Ver 1.1 2004. 09
Sony Corporation
Audio Group
Published by Sony Engineering Corporaton
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CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the equipment manufacturer.
Discard used batteries according to manufacture’s instructions.
Replace only with the same or equivalent type recommended by
the equipment manufacturer.
Discard used batteries according to manufacture’s instructions.
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilakting skifte av batteri.
Benytt samme batteritype eller en tilsvarende type anbefalt av
apparatfabrikanten.
Brukte batterier katterier kasseres i henhold til fabrikantens
VARNIG
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som rekommenderas
av apparattillverkaren.
Kassera använt batteri enligt gällande föreakrifter.
Använd samma batterityp eller en likvärdig typ som rekommenderas
av apparattillverkaren.
Kassera använt batteri enligt gällande föreakrifter.
VAROITUS
Parist voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is classified as a CLASS 1
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
rear exterior.
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
rear exterior.
The following caution label is located
inside the unit.
inside the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
The laser component in this product is
capable of emitting radiation exceeding
the limit for Class 1.
capable of emitting radiation exceeding
the limit for Class 1.
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TABLE OF CONTENTS
1. SERVICING NOTE
.......................................................... 4
2. GENERAL
.......................................................................... 7
3. DISASSEMBLY
3-1. Front Panel Assembly ......................................................... 22
3-2. Bracket (T), (L) and (R) ...................................................... 22
3-3. BD Board ........................................................................... 23
3-4. SUB Chassis ........................................................................ 23
3-5. Shutter Assembly ................................................................ 24
3-6. Over Write Head ................................................................. 24
3-7. Slider Complete Assembly .................................................. 25
3-2. Bracket (T), (L) and (R) ...................................................... 22
3-3. BD Board ........................................................................... 23
3-4. SUB Chassis ........................................................................ 23
3-5. Shutter Assembly ................................................................ 24
3-6. Over Write Head ................................................................. 24
3-7. Slider Complete Assembly .................................................. 25
4. TEST MODE
..................................................................... 26
5. ELECTRICAL ADJUSTMENTS
............................... 29
6. DIAGRAMS
6-1. Circuit Boards Location ...................................................... 34
6-2. Block Diagrams
6-2. Block Diagrams
• BD Section ....................................................................... 35
• Main Section .................................................................... 37
• Main Section .................................................................... 37
6-3. IC Block Diagrams — BD Section — ................................ 39
6-4. Printed Wiring Board — BD Section — ............................. 42
6-5. Schematic Diagram — BD Section — ............................... 45
6-6. Schematic Diagram — Main Section — ............................ 49
6-7. Printed Wiring Board — Main Section — .......................... 53
6-8. Printed Wiring Board — Panel Section — ......................... 56
6-9. Schematic Diagram — Panel Section — ............................ 59
6-10. IC Block Diagrams — Main Section — .......................... 61
6-11. IC Pin Functions ............................................................... 63
6-4. Printed Wiring Board — BD Section — ............................. 42
6-5. Schematic Diagram — BD Section — ............................... 45
6-6. Schematic Diagram — Main Section — ............................ 49
6-7. Printed Wiring Board — Main Section — .......................... 53
6-8. Printed Wiring Board — Panel Section — ......................... 56
6-9. Schematic Diagram — Panel Section — ............................ 59
6-10. IC Block Diagrams — Main Section — .......................... 61
6-11. IC Pin Functions ............................................................... 63
7. EXPLODED VIEWS
7-1. Panel (Top, Rear, Side) Section .......................................... 72
7-2. Front Panel Section ............................................................. 73
7-3. Chassis Section .................................................................... 74
7-4. Mechanism Deck Section (1) (MDM-3A) .......................... 75
7-5. Mechanism Deck Section (2) (MDM-3A) .......................... 76
7-2. Front Panel Section ............................................................. 73
7-3. Chassis Section .................................................................... 74
7-4. Mechanism Deck Section (1) (MDM-3A) .......................... 75
7-5. Mechanism Deck Section (2) (MDM-3A) .......................... 76
8. ELECTRICAL PARTS LIST
........................................ 77
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SECTION 1
SERVICING NOTE
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-124-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be
performed are shown as follows.
performed are shown as follows.
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP
IOP
: For measuring IOP (Check the deterioration of the optical pick-up laser)
TEO : TRK error signal (Traverse adjustment)
VC
VC
: Reference level for checking the signal
RF
: RF signal (Check jitter)
IOP
I + 3V
TEO
VC
RF
Mechanism deck
CN110
Jig
(J-2501-124-A)
FORCED RESET
The system microprocessor can be reset in the following way.
Use these methods when the unit cannot be operated normally due to the overrunning of the microprocessor, etc.
Use these methods when the unit cannot be operated normally due to the overrunning of the microprocessor, etc.
Method :
Disconnect the power plug, short-circuit the land of RESET.
Disconnect the power plug, short-circuit the land of RESET.
[MAIN BOARD] (Conductor Side)
Short land
TP (RESET)
CN303
IC401