Sony HT-ST5 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HT-ST5
SA-ST5
SPECIFICATIONS
HT-ST5
SOUND BAR
SA-ST5
ACTIVE SPEAKER SYSTEM
9-896-025-02
2014L33-1
©
2014.12
US Model
Canadian Model
Australian Model
Taiwan Model
Ver. 1.1 2014.12
• All of the units included in the HT-ST5 (SA-ST5/
SA-WST5/Remote control) are required to con-
fi rming operation of SA-ST5. Check in advance
that you have all of the units.
fi rming operation of SA-ST5. Check in advance
that you have all of the units.
COMPONENT MODEL NAME
HT-ST5
Bar Speaker (Active Speaker System)
SA-ST5
Subwoofer (Active Subwoofer)
SA-WST5
Amplifier section
U.S. models:
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(FTC)
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(FTC)
Front L + Front R:
With 8 ohms loads, both channels driven, from 200 - 20,000 Hz;
rated 15 Watts per channel minimum RMS power, with no more than
1% total harmonic distortion from 250 milliwatts to rated output.
With 8 ohms loads, both channels driven, from 200 - 20,000 Hz;
rated 15 Watts per channel minimum RMS power, with no more than
1% total harmonic distortion from 250 milliwatts to rated output.
POWER OUTPUT (reference)
Front L/Front R speaker blocks: 40 Watts (per channel at 8 ohms, 1 kHz)
Center speaker block: 40 Watts (per channel at 8 ohms, 1 kHz)
Center speaker block: 40 Watts (per channel at 8 ohms, 1 kHz)
Except US model:
POWER OUTPUT (rated)
POWER OUTPUT (rated)
Front L + Front R: 35 W + 35 W
(at 8 ohms, 1 kHz, 1% THD)
(at 8 ohms, 1 kHz, 1% THD)
POWER OUTPUT (reference)
Front L/Front R speaker blocks: 40 Watts (per channel at 8 ohms, 1 kHz)
Center speaker block: 40 Watts (per channel at 8 ohms, 1 kHz)
Center speaker block: 40 Watts (per channel at 8 ohms, 1 kHz)
Inputs
HDMI IN 1/2/3*
OPTICAL IN (OPT/TV)
ANALOG IN
OPTICAL IN (OPT/TV)
ANALOG IN
*
These 3 jacks are identical. Using any of them makes no difference.
Output
HDMI OUT (TV ARC)
BLUETOOTH section
Communication system
BLUETOOTH Specification version 3.0
Output
BLUETOOTH Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m (33 ft)
1)
Maximum number of devices to be registered
9 devices
Frequency band
2.4 GHz band (2.4000 GHz - 2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible BLUETOOTH profiles
2)
A2DP 1.2 (Advanced Audio Distribution Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)
Supported Codecs
3)
SBC
4)
, AAC
5)
, aptX
Transmission range (A2DP)
20 Hz - 20,000 Hz (Sampling frequency 44.1 kHz)
1) The actual range will vary depending on factors such as obstacles
between devices, magnetic fields around a microwave oven, static
electricity, cordless phone, reception sensitivity, operating system,
software application, etc.
electricity, cordless phone, reception sensitivity, operating system,
software application, etc.
2) BLUETOOTH standard profiles indicate the purpose of BLUETOOTH
communication between devices.
3) Codec: Audio signal compression and conversion format
4) Subband Codec
5) Advanced Audio Coding
4) Subband Codec
5) Advanced Audio Coding
Front L/Front R speaker blocks
Speaker system
2-way speaker system, Acoustic suspension
Speaker
Woofer: 60 mm (2 3/8 in) cone type
Tweeter: 20 mm (13/16 in) balanced drive type
Tweeter: 20 mm (13/16 in) balanced drive type
Rated impedance
8 ohms
Center speaker block
Speaker system
Full range speaker system, Acoustic suspension
Speaker (5 speakers)
60 mm (2 3/8 in) cone type
Rated impedance
8 ohms
General
Power requirements
120 V AC, 60 Hz (US and Canadian models)
120 V AC, 50 Hz/60 Hz (Taiwan model)
220 V - 240 V AC, 50 Hz/60 Hz (Australian model)
120 V AC, 50 Hz/60 Hz (Taiwan model)
220 V - 240 V AC, 50 Hz/60 Hz (Australian model)
Power consumption
On: 55 W
Standby mode: 0.5 W or less
BLUETOOTH Standby mode: 0.5 W or less
Standby mode: 0.5 W or less
BLUETOOTH Standby mode: 0.5 W or less
Dimensions (approx.) (w/h/d)
1,030 mm × 120 mm × 120 mm (40 5/8 in × 4 3/4 in × 4 3/4 in) (with
stands)
1,030 mm × 101 mm × 116 mm (40 5/8 in × 4 in × 4 5/8 in) (without
stands)
stands)
1,030 mm × 101 mm × 116 mm (40 5/8 in × 4 in × 4 5/8 in) (without
stands)
Mass (approx.)
6.1 kg (13 lb 7 1/8 oz)
Communication system
Wireless Sound Specification version 3.0
Frequency band
5.2 GHz (5.180 GHz - 5.240 GHz) (US, Canadian and Australian models only)
5.8 GHz (5.736 GHz - 5.814 GHz)
5.8 GHz (5.736 GHz - 5.814 GHz)
Modulation method
DSSS
Digital audio input formats supported by the system
* It is possible to input these formats only with HDMI connection.
Wireless transmitter section
Dolby Digital
DTS-HD Master Audio*
Dolby Digital Plus*
DTS-HD High-Resolution Audio*
Dolby TrueHD*
DTS-HD Low Bit Rate*
DTS
Linear PCM 2ch 48 kHz or less
DTS 96/24
Linear PCM Maximum 7.1ch 192 kHz or less*
– Continued on next page –
Note:
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
Photo: SA-ST5
• Please refer to service manual separately issued for Subwoofer.
HT-ST5
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Accessories
Remote control (1)
R03 (size AAA) batteries (2)
Optical digital cable for a TV (1)
Startup Guide (1)
Operating Instructions (1)
R03 (size AAA) batteries (2)
Optical digital cable for a TV (1)
Startup Guide (1)
Operating Instructions (1)
Video formats supported by the system
Input/Output (HDMI Repeater block)
*1
YCbCr 4:2:0/Supported 8-bit only
*2
Supported 8-bit only
Design and specifications are subject to change without notice.
Format
2D
3D
Frame
packing
Side-by-
Side (Half)
Over-Under
(Top-and-
Bottom)
4096 × 2160p @ 59.94/60 Hz
*1
4096 × 2160p @ 50 Hz
*1
4096 × 2160p @ 23.98/24 Hz
*2
3840 × 2160p @ 59.94/60 Hz
*1
3840 × 2160p @ 50 Hz
*1
3840 × 2160p @ 29.97/30 Hz
*2
3840 × 2160p @ 25 Hz
*2
3840 × 2160p @ 23.98/24 Hz
*2
1920 × 1080p @ 59.94/60 Hz
1920 × 1080p @ 50 Hz
1920 × 1080p @ 29.97/30 Hz
1920 × 1080p @ 25 Hz
1920 × 1080p @ 23.98/24 Hz
1920 × 1080i @ 59.94/60 Hz
1920 × 1080i @ 50 Hz
1280 × 720p @ 59.94/60 Hz
1280 × 720p @ 50 Hz
1280 × 720p @ 29.97/30 Hz
1280 × 720p @ 23.98/24 Hz
720 × 480p @ 59.94/60 Hz
720 × 576p @ 50 Hz
640 × 480p @ 59.94/60 Hz
This system incorporates Dolby* Digital and the DTS** Digital Surround
System.
*
System.
*
Manufactured under license from Dolby Laboratories.
Dolby, and the double-D symbol are trademarks of Dolby
Laboratories.
Dolby, and the double-D symbol are trademarks of Dolby
Laboratories.
** For DTS patents, see http://patents.dts.com. Manufactured under
license from DTS Licensing Limited. DTS, DTS-HD, the Symbol, & DTS
and the Symbol together are registered trademarks, and DTS-HD
Master Audio is a trademark of DTS, Inc. © DTS, Inc. All Rights
Reserved.
and the Symbol together are registered trademarks, and DTS-HD
Master Audio is a trademark of DTS, Inc. © DTS, Inc. All Rights
Reserved.
The BLUETOOTH® word mark and logos are registered trademarks owned
by Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is
under license.
by Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is
under license.
This system incorporates High-Definition Multimedia Interface (HDMI™)
technology.
The terms HDMI and HDMI High-Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered trademarks of HDMI Licensing
LLC in the United States and other countries.
technology.
The terms HDMI and HDMI High-Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered trademarks of HDMI Licensing
LLC in the United States and other countries.
The N Mark is a trademark or registered trademark of NFC Forum, Inc. in
the United States and in other countries.
the United States and in other countries.
Android and Google Play are trademarks of Google Inc.
© 2013 CSR plc and its group companies.
The aptX® mark and the aptX logo are trade marks of CSR plc or one of its
group companies and may be registered in one or more jurisdictions.
The aptX® mark and the aptX logo are trade marks of CSR plc or one of its
group companies and may be registered in one or more jurisdictions.
Apple, the Apple logo, iPhone, iPod, and iPod touch are trademarks of
Apple Inc., registered in the U.S. and other countries. App Store is a
service mark of Apple Inc.
Apple Inc., registered in the U.S. and other countries. App Store is a
service mark of Apple Inc.
“Made for iPod,” and “Made for iPhone” mean that an electronic
accessory has been designed to connect specifically to iPod or iPhone,
respectively, and has been certified by the developer to meet Apple
performance standards. Apple is not responsible for the operation of this
device or its compliance with safety and regulatory standards. Please
note that the use of this accessory with iPod or iPhone may affect
wireless performance.
accessory has been designed to connect specifically to iPod or iPhone,
respectively, and has been certified by the developer to meet Apple
performance standards. Apple is not responsible for the operation of this
device or its compliance with safety and regulatory standards. Please
note that the use of this accessory with iPod or iPhone may affect
wireless performance.
Compatible iPod/iPhone models
The compatible iPod/iPhone models are as follows. Update your iPod/
iPhone with the latest software before using with the system.
iPhone with the latest software before using with the system.
BLUETOOTH technology works with:
iPhone
iPhone 5s/iPhone 5c/iPhone 5/iPhone 4s/iPhone 4/iPhone 3GS
iPod touch
iPod touch (5th generation)/iPod touch (4th generation)
iPhone 5s/iPhone 5c/iPhone 5/iPhone 4s/iPhone 4/iPhone 3GS
iPod touch
iPod touch (5th generation)/iPod touch (4th generation)
“BRAVIA” logo is a trademark of Sony Corporation.
“ClearAudio+” is a trademark of Sony Corporation.
“x.v.Color” and “x.v.Color” logo are trademarks of Sony Corporation.
“PlayStation
®
” is a registered trademark of Sony Computer Entertainment
Inc.
Other trademarks and trade names are those of their respective owners.
Copyrights
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
HT-ST5
3
1.
SERVICING NOTES
.............................................
4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 6
2-2. Grille
Assy
...................................................................... 7
2-3. Side Panel (L/R) Assy ..................................................... 7
2-4. Rear Panel (R) Assy, Rear Panel (L) Block .................... 8
2-5. RF Modulator (WS001) (RFM1) .................................... 9
2-6. Bracket Bottom Block .................................................... 10
2-7. Power Cord (AC1) .......................................................... 11
2-8. Chassis
2-4. Rear Panel (R) Assy, Rear Panel (L) Block .................... 8
2-5. RF Modulator (WS001) (RFM1) .................................... 9
2-6. Bracket Bottom Block .................................................... 10
2-7. Power Cord (AC1) .......................................................... 11
2-8. Chassis
Block
.................................................................. 12
2-9. IO
Board
......................................................................... 13
2-10. MAIN Board ................................................................... 14
2-11. AMP Board ..................................................................... 15
2-12. POWER Board ................................................................ 16
2-13. Center Speaker Block ..................................................... 17
2-14. Loudspeaker (60 mm) (SP5, SP6, SP7, SP8, SP9) ......... 18
2-15. Left Speaker Block ......................................................... 19
2-16. Cabinet (Left) Block ....................................................... 19
2-17. Loudspeaker (20 mm) (SP1) (L-ch),
2-11. AMP Board ..................................................................... 15
2-12. POWER Board ................................................................ 16
2-13. Center Speaker Block ..................................................... 17
2-14. Loudspeaker (60 mm) (SP5, SP6, SP7, SP8, SP9) ......... 18
2-15. Left Speaker Block ......................................................... 19
2-16. Cabinet (Left) Block ....................................................... 19
2-17. Loudspeaker (20 mm) (SP1) (L-ch),
Loudspeaker (60 mm) (SP3) (L-ch) ................................ 20
2-18. RC-S801 (NFC1) ............................................................ 21
2-19. Right Speaker Block ....................................................... 21
2-20. Bluetooth Module (BT1) ................................................ 22
2-21. DISPLAY Board ............................................................. 23
2-22. Cabinet (Right) Block ..................................................... 24
2-23. Loudspeaker (20 mm) (SP2) (R-ch),
2-19. Right Speaker Block ....................................................... 21
2-20. Bluetooth Module (BT1) ................................................ 22
2-21. DISPLAY Board ............................................................. 23
2-22. Cabinet (Right) Block ..................................................... 24
2-23. Loudspeaker (20 mm) (SP2) (R-ch),
Loudspeaker (60 mm) (SP4) (R-ch) ............................... 25
2-24. KEY Board ...................................................................... 26
2-25. Flexible Flat Cable (8P) (FFC6) ..................................... 27
2-25. Flexible Flat Cable (8P) (FFC6) ..................................... 27
3.
TEST MODE
............................................................ 28
4. TROUBLESHOOTING
.......................................... 33
TABLE OF CONTENTS
5. DIAGRAMS
5-1. Block Diagram - HDMI Section - ................................... 36
5-2. Block Diagram - MAIN Section - ................................... 37
5-3. Block Diagram - AMP Section - ..................................... 38
5-4. Block
5-2. Block Diagram - MAIN Section - ................................... 37
5-3. Block Diagram - AMP Section - ..................................... 38
5-4. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 39
5-5. Printed Wiring Board - MAIN Board - ........................... 41
5-6. Printed Wiring Board - AMP Board - ............................. 42
5-7. Schematic Diagram - AMP Board - ................................ 43
5-8. Printed Wiring Board - DISPLAY Board - ..................... 44
5-9. Schematic Diagram - DISPLAY Board - ........................ 45
5-10. Printed Wiring Boards
5-6. Printed Wiring Board - AMP Board - ............................. 42
5-7. Schematic Diagram - AMP Board - ................................ 43
5-8. Printed Wiring Board - DISPLAY Board - ..................... 44
5-9. Schematic Diagram - DISPLAY Board - ........................ 45
5-10. Printed Wiring Boards
- IO, KEY, REPEATER_R (Lch)/(Rch) Boards - ........... 46
5-11. Schematic Diagram
- IO, KEY, REPEATER_R (Lch)/(Rch) Boards - ........... 47
5-12. Printed Wiring Board - POWER Board - ........................ 48
5-13. Schematic Diagram - POWER Board - .......................... 49
5-13. Schematic Diagram - POWER Board - .......................... 49
6.
EXPLODED VIEWS
6-1. Grille
Section
.................................................................. 53
6-2. Side Panel Section .......................................................... 54
6-3. Rear Panel (L) Section .................................................... 55
6-4. Bracket Bottom Section .................................................. 56
6-5. AMP Board Section ........................................................ 57
6-6. Chassis
6-3. Rear Panel (L) Section .................................................... 55
6-4. Bracket Bottom Section .................................................. 56
6-5. AMP Board Section ........................................................ 57
6-6. Chassis
Section
............................................................... 58
6-7. Lid (Button) Section ....................................................... 59
6-8. Center Speaker Section ................................................... 60
6-9. Left Speaker Section ....................................................... 61
6-10. Right Speaker Section ..................................................... 62
6-11. Front Panel Section ......................................................... 63
6-8. Center Speaker Section ................................................... 60
6-9. Left Speaker Section ....................................................... 61
6-10. Right Speaker Section ..................................................... 62
6-11. Front Panel Section ......................................................... 63
7.
ELECTRICAL PARTS LIST
.............................. 64
Accessories are given in the last of the electrical parts list.
HT-ST5
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
All of the units included in the HT-ST5 (SA-ST5/SA-WST5/Re-
mote control) are required to confi rming operation of SA-ST5.
Check in advance that you have all of the units.
ERATION
All of the units included in the HT-ST5 (SA-ST5/SA-WST5/Re-
mote control) are required to confi rming operation of SA-ST5.
Check in advance that you have all of the units.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
“PRTECT (PROTECT)” APPEARS ON THE DISPLAY OF
THE BAR SPEAKER
THE BAR SPEAKER
q Press the ÒÄÆ (on/standby) button to turn off the system. After the
lamp disappears, disconnect the AC power cord (mains lead) then
ensure nothing is obstructing the ventilation holes of the system.
ensure nothing is obstructing the ventilation holes of the system.
NOTE THE REPAIRING OF MAIN BOARD
When the MAIN board installed in this unit is defective, replace
the complete mounted board. The mounted parts cannot replace
with single.
Block diagram and printed wiring board that have been described
on this service manual are for reference.
Schematic diagram have not described.
When the MAIN board installed in this unit is defective, replace
the complete mounted board. The mounted parts cannot replace
with single.
Block diagram and printed wiring board that have been described
on this service manual are for reference.
Schematic diagram have not described.
NOTE OF REPLACING THE IC3001, IC3003, IC3005
AND IC3007 ON THE AMP BOARD AND THE COM-
PLETE AMP BOARD
When IC3001, IC3003, IC3005 and IC3007 on the AMP board and
the complete AMP board are replaced, it is necessary to spread the
compound between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below
AND IC3007 ON THE AMP BOARD AND THE COM-
PLETE AMP BOARD
When IC3001, IC3003, IC3005 and IC3007 on the AMP board and
the complete AMP board are replaced, it is necessary to spread the
compound between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below
thermal compound (G747)
IC3001
IC3003
IC3005
IC3007
– AMP Board (Component Side) –
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C914 or
C915, C967, C992) to discharge the capacitor (C914 or C915,
C967, C992).
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C914 or
C915, C967, C992) to discharge the capacitor (C914 or C915,
C967, C992).
– POWER Board (Conductor Side) –
(US, Canadian and Taiwan models)
(US, Canadian and Taiwan models)
– POWER Board (Conductor Side) –
(Australian model)
(Australian model)
C914
800
:/2 W
C967
800
:/2 W
C992
800
:/2 W
C967
800
:/2 W
C992
800
:/2 W
C915
800
:/2 W
Ver. 1.1