DOWNLOAD Sony HCD-ZX50MD Service Manual ↓ Size: 11.08 MB | Pages: 127 in PDF or view online for FREE

Model
HCD-ZX50MD
Pages
127
Size
11.08 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-zx50md.pdf
Date

Sony HCD-ZX50MD Service Manual ▷ View online

49
6-14. ERROR RATE CHECK
6-14-1. CD Error Rate Check
Checking Procedure :
1. Load a check disc (MD) TDYS-1.
2. Move the multi-stick and display “CPLAY1MODE” (C34).
3. Press the  PUSH ENTER  button twice and display “CPLAY1
MID”.
4. The display changes to “C1 = 
 AD = 
”.
5. Check that the C1 error rate is below 20.
6. Press the  CLEAR  button while REC IT is lit, stop playback,
press the   MD Z  button while REC IT is off, and remove the
test disc.
6-14-2. MO Error Rate Check
Checking Procedure :
1. Load a continuously recorded test disc (MDW-74/GA-1).
(Refer to “6-5. Using the Continuously Recorded Disc”.)
2. Move the multi-stick and display “CPLAY1MODE” (C34).
3. Press the  PUSH ENTER  button and display “CPLAY1MID”.
4. The display changes to “C1 = 
 AD = 
”.
5. If the C1 error rate is below 20, check that ADER is 00.
6. Press the  CLEAR  buttonwhile REC IT is lit, stop playback,
press the   MD Z  button while REC IT is off, and remove the
test disc.
6-15. FOCUS BIAS CHECK
Change the focus bias and check the focus tolerance amount.
Checking Procedure :
1. Load a continuously recorded test disc (MDW-74/GA-1).
(Refer to “6-5. Using the Continuously Recorded Disc”.)
2. Move the multi-stick and display “CPLAY1 MODE”(C34).
3. Press the  PUSH ENTER  button twice and display “CPLAY1
MID”.
4. Press the  CLEAR  button while REC IT is lit when “C1 = 
AD = 
” is displayed.
5. Move the multi-stick and display “FBIAS CHECK”(C16).
6. Press the  PUSH ENTER  button and display “ 
/
 c = 
”.
The first four digits indicate the C1 error rate, the two digits
after [/] indicate ADER, and the 2 digits after [c =] indicate the
focus bias value.
Check that the C1 error is below 20 and ADER is below 2.
7. Press the  PUSH ENTER  button and display “ 
/
 b = 
”.
Check that the C1 error is below 100 and ADER is below 2.
8. Press the  PUSH ENTER  button and display “ 
/
 a = 
”.
Check that the C1 error is below 100 and ADER is below 2
9. Press the  CLEAR  button while REC IT is lit, next press the
MD Z  button while REC IT is off and remove the continuously
recorded disc.
Note 1 : If the C1 error and ADER are above other than the speci-
fied value at points a (step 8. in the above) or b (step 7. in
the above), the focus bias adjustment may not have been
carried out properly. Adjust perform the beginning again.
6-16. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT
Be sure to perform this adjustment when the Optical pick-up is re-
placed.
If the adjustment results becomes “Adjust NG!”, the Optical pick-
up may be faulty or the servo system circuits may be abnormal.
6-16-1. CD Auto Gain Control Output Level Adjustment
Adjusting Procedure :
1. Insert the check disc (MD) TDYS-1.
2. Move the multi-stick to display “AG Set (CD)” (C11).
3. When the  PUSH ENTER  button is pressed, the adjustment will
be performed automatically.
“Complete!” will then be displayed momentarily when the value
is recorded in the non-volatile memory, after which the display
changes to “AG Set (CD)” (C11).
4. Press the   MD Z  button while REC IT is off and remove the
disc.
6-16-2. MO Auto Gain Control Output Level Adjustment
Adjusting Procedure :
1. Insert the reference disc (MDW-74/GA-1) for recording.
2. Move the multi-stick to display “AG Set (MO)” (C10).
3. When the  PUSH ENTER  button is pressed, the adjustment will
be performed automatically.
“Complete!” will then be displayed momentarily when the value
is recorded in the non-volatile memory, after which the display
changes to “AG Set (MO)” (C10).
4. Press the   MD Z  button while REC IT is off and remove the
disc.
50
NOTE:It is useful to use the jig. for checking the waveform. (Refer
to Servicing Note on page 10.)
[BD (MD) BOARD] (SIDE B)
D101
IC151
23
1 27
1
1
7
IC101
CN101
CN103
CN102
IC195
IC190
CN105
IC102
*
NOTE
6-17. ADJUSTING POINTS AND CONNECTING POINTS
[BD (MD) BOARD] (SIDE A)
51
SECTION 7
DIAGRAMS
7-1. CIRCUIT BOARDS LOCATION
TRANS board
PANEL board
MAIN board
FRONT AMP board
CD SW board
MIC board
LEAF SW board
HP board
SUB PANEL board
AUDIO board
TUNER UNIT
CLAMP MOTOR board
SUB TRANS board 
(US,AEP,UK,G,AED,CIS model)
SENSOR 2 board
BD (MD) board
DIGITAL board
SENSOR board
OUT SW board
INT/COUNT SW board
LOAD MOTOR board
CONNECTOR board
IN SW board
BD (CD) board
52
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
2
: nonflammable resistor.
1
: fusible resistor.
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
a
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
U
: B+ Line.
V
: B– Line.
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
g
: VIDEO/MD (AUDIO)
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J
: CD (Analog)
c
: CD/MD (Digital)
p
: MD (PB)
l
: MD (REC)
• Abbreviation
G
: German model
AED
: North European model
MX
: MExican model
AR
: Argentine model
HK
: Hong Kong model
MY
: Malaysia model
SP
: Singapore model
KR
: Korea model
AUS
: Australian model
Note: The components identified by mark 
0
 or dotted line
with mark 
0
 are critical for safety.
Replace only with part number specified.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Indication of transistor
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
B
These are omitted.
C
E
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