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2011E05-1

© 

2011.05

•  HCD-CPZ3  is  the  amplifi er,  CD  player,  tape  deck 

and tuner section in CMT-CPZ3.

CD 

Section

Model Name Using Similar Mechanism

HCD-CPZ1

CD Mechanism Type

CDM80BH-F1BD83

Base Unit Name

BU-F1BD83

Optical Pick-up Name

KSM-215DCP

TAPE 

Section

Model Name Using Similar Mechanism

HCD-CPZ1

Tape Transport Mechanism Type

CMAL1Z236 or 

CRP42613

US and foreign patents licensed 

from Dolby Laboratories

DIN power output (rated): 60 W + 60 W (4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 75 W + 75 W (4 ohms at 1 kHz, 
10% THD)
Outputs

CD DIGITAL OUT: Optical Wavelength: 660 nm
PHONES (stereo mini jack): Accepts headphones with an impedance of 8 
ohms or more
SPEAKER: Accepts impedance of 4 ohms

System: Compact disc and digital audio system
Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measurement at a distance of 200 mm from the 

objective lens surface on the Optical Pick-up Block with 7 mm aperture.

Frequency response: 20 Hz 

 20 kHz (±1 dB)

Wavelength: 770 nm 

 810 nm

Recording system: 4-track 2-channel, stereo

FM stereo, FM/AM superheterodyne tuner

FM tuner section:

Tuning range: 87.5 MHz 

 108.0 MHz (50 kHz step)

Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz

AM tuner section:

Tuning range: 531 kHz 

 1,602 kHz (9 kHz step) 

Antenna: AM loop antenna
Antenna terminals: External antenna terminal
Intermediate frequency: 450 kHz 

Power requirements: 230 V AC, 50/60 Hz
Power consumption: 60 watts
Dimensions (w/h/d) (excl. speakers): Approx. 175 mm × 240 mm × 295 mm
Mass (excl. speakers): Approx. 3.8 kg

Design and specifications are subject to change without notice.

Note: Tape mechanical deck has been changed in the midway of production.
 

  Refer to “SUPPLEMENT-1” for details.

  .............................................   3

2-1.   Disassembly Flow ...........................................................   4
2-2.   Case .................................................................................  

5

2-3.   Front Panel Block ...........................................................   5
2-4.   TC Board, Mechanical Deck ..........................................   6
2-5.   PANEL Board .................................................................   7
2-6.   MAIN Board ...................................................................   7
2-7.   CD Mechanism Deck (CDM80BH-F1BD83) ................   8
2-8.   Chassis (Top) ..................................................................   8
2-9.   Lever (Loading-L/R) .......................................................   9
2-10.  Lever (Disc Sensor), Lever (Disc Stop) ..........................   10
2-11   DRIVER Board, Motor Assy (Loading) (M701) ............   10
2-12.  BD Board ........................................................................   11
2-13.  BU Section ......................................................................   11
2-14.  Optical Pick-up Block (KSM-215DCP) .........................   12
2-15.  Lever (BU Lock) .............................................................   12
2-16.  Close Lever .....................................................................   13
2-17.  Lever (DIR), Gear (IDL-B) ............................................   13
2-18.  Gear (IDL-C) ..................................................................   14

 .............................................................   15

 .......................   16

 .........................   17

6-1.  Block Diagram
 

– CD SERVO/TAPE DECK/TUNER Section – .............   18

6-2.  Block Diagram – MAIN Section – .................................   19
6-3.  Block Diagram
 

– PANEL/KEY/POWER SUPPLY Section – .................   20

6-4.  Printed Wiring Board – BD Board – ...............................   22
6-5.  Schematic Diagram – BD Board – .................................   23
6-6.  Printed Wiring Board – TC Board – ...............................   24
6-7.  Schematic Diagram – TC Board – ..................................   25
6-8.  Printed Wiring Board – DRIVER Board – .....................   26
6-9.  Schematic Diagram – DRIVER Board – ........................   26
6-10.  Printed Wiring Board – MAIN Board – ..........................   27
6-11.  Schematic Diagram – MAIN Board (1/2) – ....................   28
6-12.  Schematic Diagram – MAIN Board (2/2) – ....................   29
6-13.  Schematic Diagram – AMP Board (1/2) – ......................   30
6-14.  Schematic Diagram – AMP Board (2/2) – ......................   31
6-15.  Printed Wiring Board – AMP Board – ............................   32
6-16.  Printed Wiring Board – SP Board – ................................   33
6-17.  Schematic Diagram – SP Board – ...................................   33
6-18.  Printed Wiring Board – LCD Board – ............................   34
6-19.  Schematic Diagram – LCD Board – ...............................   35
6-20.  Printed Wiring Boards – PANEL Section – ....................   36
6-21.  Schematic Diagram – PANEL Section – ........................   37
6-22.  Printed Wiring Boards – JACK Section – ......................   38
6-23.  Schematic Diagram – JACK Section – ...........................   39
6-24.  Printed Wiring Board – SW POWER Board – ...............   40
6-25.  Schematic Diagram – SW POWER Board – ..................   41
6-26.  Printed Wiring Board – SUB POWER Board – .............   42
6-27.  Schematic Diagram – SUB POWER Board – ................   43

7-1. 

Case Sect ion ....................................................................   54

7-2.  Mechanical Deck (Tape) Section ....................................   55
7-3.  Front Panel Section .........................................................   56
7-4.  Lid (TC) Section .............................................................   57
7-5.  Chassis Section ...............................................................   58
7-6.  AMP/Power Section .......................................................   59
7-7.  CD Mechanism Deck Section-1
 

(CDM80BH-F1BD83) ....................................................   60

7-8.  CD Mechanism Deck Section-2
 

(CDM80BH-F1BD83) ....................................................   61

7-9.  CD Mechanism Deck Section-3
 

(CDM80BH-F1BD83) ....................................................   62

7-10.  Base Unit Section (BU-F1BD83) ...................................   63

  ..............................   64

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

This appliance is classi

fi ed as 

a CLASS 1 LASER product.
This marking is located on the 
rear or bottom exterior.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those speci

fi ed herein may result in hazardous radia-

tion exposure.

Note: Refer to SUPPLEMENT-1 for information on the MAIN and TC 

boards of unit that corresponds to serial No. 5138502 or larger.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• 

Strong viscosity

 

Unleaded solder is more viscous (sticky, less prone to 

fl ow) 

than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The 

fl exible board is easily damaged and should be handled with 

care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc re

fl ective surface by the objective lens in the optical 

pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

• 

This set can be disassembled in the order shown below.