Sony CDP-CE575 Service Manual ▷ View online
CDP-CE575
21
21
SECTION 7
DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
Note on Printed Wiring Board:
•
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
no mark : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
c
: DIGITAL OUT
Note:
The components identi-
fied by mark
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
7-1.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
• Circuit Boards Location
SENSOR board
BD board
JUNCTION board
MAIN board
HEADPHONE board
DISPLAY board
KEY (B) board
POWER SW board
KEY (A) board
LOADING MOTOR board
CDP-CE575
22
22
7-2.
PRINTED WIRING BOARD – BD Section –
•
See page 21 for Circuit Boards Location.
TP (DGND)
C111
R138
C140
C158
C112
C182
R151
R152
R140
C154
R174
C138
C132
C151
C191
C153
C192
C134
C102
C101
R101
C171
R142
R192
C133
C199
C103
C110
C172
R110
R136
C131
R184
C150
R112
Q132
R111
C194
R146
C152
R149
FB191
C181
Q131
R134
R137
X191
R103
R143
C193
R102
C130
C137
E
E
M101
(SPINDLE)
M102
(SLED)
S101
(LIMIT)
IC150
CN101
C136
C184
RB101
C124
RB102
IC131
CN102
R135
C145
R141
R172
R183
R182
C139
C174
C173
R171
R144
IC101
R191
R155
R145
R173
C183
R181
R127
R123
C123
C125
C120
R120
R122
C126
C122
R125
R129
R126
R121
C121
R153
R139
1-681-001-
11
(11)
BD BOARD
(COMPONENT SIDE)
TP (VC)
TP (TE1)
TP (FE1)
TP (RFAC)
1-681-001-
11
(11)
M
BD BOARD
(CONDUCTOR SIDE)
A
MAIN BOARD
CN301
M
OPTICAL PICK-UP
BLOCK
(PXR-104X)
B
A
C
D
E
F
G
1
2
3
4
5
6
7
8
9
10
11
12
13
TP (RFDC)
• Semiconductor
Location
Ref. No.
Location
IC101
C-8
IC131
E-8
IC150
E-10
Q131
F-6
Q132
E-6
(Page 28)
Ver 1.1 2001.07
CDP-CE575
23
23
7-3.
SCHEMATIC DIAGRAM – BD Section –
•
See page 32 for Waveforms.
•
See page 29 for IC Block Diagrams.
The components identified by mark
0
or dotted
line with mark
0
are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que
par une pièce portant le numéro spécifié.
TP (RFDC)
(Page 26)
Ver 1.1 2001.07
CDP-CE575
24
24
MAIN BOARD
CN311
(TABLE SENSOR)
(DISC SENSOR)
1
4
3
2
7-4.
PRINTED WIRING BOARDS – MOTOR/SENSOR Section –
•
See page 21 for Circuit Boards Location.
(Page 28)
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