Sony CDP-CE545 Service Manual ▷ View online
17
TP (VC)
TP (RF)
TP (FE)
TP (TE)
TP
(FE1)
TP (GND)
TP
(PLCK)
TP
(AGCCON)
CN102
IC101
Checking Location:
– BD BOARD (Conductor Side) –
18
MEMO
19
19
SECTION 5
DIAGRAMS
6-1.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
Note on Printed Wiring Board:
•
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor
•
U
: B+ Line.
•
V
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
no mark : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
J
: CD PLAY
c
: DIGITAL OUT
Note:
The components identi-
fied by mark
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
• Circuit Boards Location
HEADPHONE board
KEY board
DISPLAY board
MAIN board
JUNCTION board
BD board
SENSOR board
LOADING MOTOR board
POWER SW board
20
20
CDP-CE545
6-2.
PRINTED WIRING BOARD – BD Board –
•
See page 19 for Circuit Boards Location.
A
05
05
TP
(GND)
TP
(FE1)
TP
(RF)
TP
(VC)
TP
(FE)
TP
(TE)
TP
(AGCCON)
TP
(PLCK)
(LIMIT)
(SPINDLE)
(SLED)
(CONDUCTOR SIDE)
(COMPONENT SIDE)
• Semiconductor
Location
Ref. No.
Location
Q101
C-3
• Semiconductor
Location
Ref. No.
Location
IC101
C-2
IC102
B-1
IC103
B-1
(Page 24)
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