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             71 ± 1mm

                                            Fold it by 90°

Install the position (A) and (B)

Fig. 2-5-B

(A)

(B)

Fig. 2-5-C

Printing Surface

Printing Surface

                  25 ± 1mm      Fold it by 90° 

Fold it by 90°                                                              15 ± 1mm 

                            

                          16 ± 1mm

 10 ± 1mm

Fig. 2-5-D

g

3. When IC starts moving back and forth easily after 

desoldering completely, pickup the corner of the IC using 
tweezers and remove the IC by moving with the IC 

desoldering machine. (Refer to Fig. 3-3.)

1. Put Masking Tape (cotton tape) around the Flat Package

IC to protect other parts from any damage.
(Refer to Fig. 3-1.)

Some ICs on the PCB are affixed with glue, so be 
careful not to break or damage the foil of each IC 

leads or solder lands under the IC when removing it.

Masking is carried out on all the parts located within
10 mm  distance from IC leads.

Fig. 3-1  

Masking Tape

(Cotton Tape)

IC

Blower type IC 

desoldering machine

Tweezers

2. Heat the IC leads using a blower type IC desoldering

machine. (Refer to Fig. 3-2.)

Do not rotate or move the IC back and forth , until IC

4. Peel off the Masking Tape.

can move back and forth easily after desoldering the 
leads completely.

5. Absorb the solder left on the pattern using the Braided 

Shield Wire. (Refer to Fig. 3-4.)

Do not move the Braided Shield Wire in the vertical 
direction towards the IC pattern.

Blower type IC 

desoldering machine

IC

Fig. 3-2

IC

Fig. 3-3

Fig. 3-4

IC pattern

Braided Shield Wire

Soldering Iron

4. When bridge-soldering between terminals and/or the 

soldering amount are not enough, resolder using a Thin-

1. Take care of the polarity of new IC and then install the 

tip Soldering Iron. (Refer to Fig. 3-8.)

new IC fitting on the printed circuit pattern. Then solder 
each lead on the diagonal positions of IC temporarily. 
(Refer to Fig. 3-5.)

5. Finally, confirm the soldering status on four sides of the 

IC using a magnifying glass.
Confirm that no abnormality is found on the soldering 
position and installation position of the parts around the 
IC. If some abnormality is found, correct by resoldering.

When the IC leads are bent during soldering and/or

2. Supply the solder from the upper position of IC leads 

repairing, do not repair the bending of leads. If the

sliding to the lower position of the IC leads. 

bending of leads are repaired, the pattern may be

damaged. So, always be sure to replace the IC in this
case.

Soldering Iron

Solder temporarily

Solder temporarily

Fig. 3-5

IC

Thin-tip Soldering Iron

Fig. 3-8

3. Absorb the solder left on the lead using the Braided

Shield Wire.  (Refer to Fig. 3-7.)

Do not absorb the solder to excess.

IC

Soldering Iron

Supply soldering 
from upper position 
to lower position

Solder

Fig. 3-6

Soldering Iron

IC

Braided Shield Wire

Fig. 3-7

This unit is provided with the following SERVICE MODES so you can repair, examine and adjust easily.

• Do not feel after other MENU.

1. Check of the SUM DATA and MICON VERSION on the screen.

1-1: Press the MENU  ---> 0027 button on the remote control to select "Version Info".

1-2: Press the ENTER button on the remote control.

Fig. 1-1

2. DVD Initialize Data.

2-1: Press the MENU  ---> 0027 button on the remote control to select "DVD Initialize".

2-2: Press the ENTER button on the remote control to select "OK".

Fig. 1-2

Fig. 2-1

Fig. 2-2