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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such 
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES 
devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components. 
The following techniques should be used to help reduce the incidence of component damage caused 
by electro static discharge (ESD).

1.  Immediately before handling any semiconductor component or semiconductor-equipped 

assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, 
obtain and wear a commercially available discharging ESD wrist strap, whichshould be 
removed for potential shock reasons prior to applying power to the unit under test.

2.  After removing an electrical assembly equipped with ES devices, place the assembly on a 

conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure 
of the assembly.

3.  Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.  Use only an anti-static solder removal device. Some solder removal devices not classified as 

"anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5.  Do not use freon-propelled chemicals. These can generate electrical charges sufficient to 

damage ES devices.

6.  Do not remove a replacement ES device from its protective package until immediately before 

you are ready to install it. (Most replacement ES devices are packaged with leads electrically 
shorted together by conductive foam, alminum foil or comparableconductive material).

7.  Immediately before removing the protective material from the leads of a replacement ES 

device, touch the protective material to the chassis or circuit assembly into which the device 
will be installed.

Caution

 

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.  Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise 

hamless motion such as the brushing together of your clothes fabric or the lifting of your foot 

from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).

 

 

Note: Lead is listed as (Pb) in the periodic table of elements.

 

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

 

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

 

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

 

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For 
service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be 
used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol 

 stamped on the back of PCB.

●     

Pb free solder has a higher melting point than standard solder. Typically the melting point is 
50 ~ 70 °F (30~40°C) higher. Please use a high temperature soldering iron and set it to 700 ± 
20 °F (370 ± 10 °C).

●     

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or 
solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder 
until it melts, before applying Pb solder.

●     

After applying PbF solder to double layered boards, please check the component side for 
excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

 

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, 
silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also 
beused.